2017 IEEE Technology & Engineering Management Conference (TEMSCON)最新文献

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Topic modelling approach to knowledge depth and breadth: Analyzing trajectories of technological knowledge 知识深度和广度的主题建模方法:分析技术知识的轨迹

2017 IEEE Technology & Engineering Management Conference (TEMSCON) Pub Date : 2017-06-01 DOI: 10.1109/TEMSCON.2017.7998354

A. Suominen

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引用次数: 2

Insurance policy reformation for autism treatment coverage 自闭症治疗保险政策改革

2017 IEEE Technology & Engineering Management Conference (TEMSCON) Pub Date : 2017-06-01 DOI: 10.1109/TEMSCON.2017.7998393

Sharon Qi, Seung Jun Lee, Tianqin Shi

引用次数: 0

Corporate venture capital as a real option in the markets for technology 企业风险资本是技术市场的一个真正选择

2017 IEEE Technology & Engineering Management Conference (TEMSCON) Pub Date : 2015-07-01 DOI: 10.2139/SSRN.1873957

M. Ceccagnoli, Matthew J. Higgins, Hyunsung D. Kang

引用次数: 32

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