2021 IEEE CPMT Symposium Japan (ICSJ)最新文献_第6页

Development of newly low-dielectric organic substrate material for a millimeter-wave radar 毫米波雷达新型低介电有机衬底材料的研制

2021 IEEE CPMT Symposium Japan (ICSJ) Pub Date : 2021-11-10 DOI: 10.1109/ICSJ52620.2021.9648858

Chie Chikara, Satoshi Yoshiura, Satoshi Kajita, Koji Fujikawa, Taishi Imazato, T. Nagasawa

引用次数: 0

The Electrical Analysis on Ultra High Density IO Fan-Out Design 超高密度IO扇出设计的电学分析

2021 IEEE CPMT Symposium Japan (ICSJ) Pub Date : 2021-11-10 DOI: 10.1109/ICSJ52620.2021.9648870

Po-I Wu, Ming-Fong Jhong, H. Kuo, Chih-Yi Huang, Chen-Chao Wang

{"title":"The Electrical Analysis on Ultra High Density IO Fan-Out Design","authors":"Po-I Wu, Ming-Fong Jhong, H. Kuo, Chih-Yi Huang, Chen-Chao Wang","doi":"10.1109/ICSJ52620.2021.9648870","DOIUrl":"https://doi.org/10.1109/ICSJ52620.2021.9648870","url":null,"abstract":"With the rapid development of self-driving cars, 5G mobile communications and artificial intelligence (AI), the high performance semiconductor integrated circuits have become a potential product in semiconductor industry. In order to support huge data transmission throughput, the package types play an important role in achieving high bandwidth and low latency. The layout density of traditional Flip Chip BGA (FCBGA) cannot contain thousands of signal lines. In the recent, 2.5D IC package with ultra-high density I/O is able to apply in such high-performance computing product. 2.5D IC has a silicon interposer which is an electrical interface routing to spread a connection to a wider pitch or to reroute the signals. TSV is an import element of interposer in vertical connection between ASIC chips or HBM chips to package substrate. However, it is hard to increase the production yield of the silicon interposer due to the TSV structure. The cost and productivity are also considered in manufacture. Some OSAT (Outsourced Semiconductor Assembly and Test) companies did some studies [1]–[5] and proposed some structures without TSV, such as FOCoS (Fan-out Chip on Substrate). By different process, there are Chip First FOCoS and Chip last FOCoS both are suitable for different applications and production costs [6]. In first part of paper, we introduce the 2.5D IC and FOCoS which are currently package type applied in ultra-high density I/O design. According to real design, the actual structure of high-performance computing IC device with one ASIC die and two HBM dies is shown in this paper. There are different trace lengths and ground plane designs due to different location of HBM die and manufacture issues. Finally, we use eye diagram analysis to estimate the quality of high speed signal.","PeriodicalId":191859,"journal":{"name":"2021 IEEE CPMT Symposium Japan (ICSJ)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-11-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126804879","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Electrochemical Analysis of Surface Oxide Layers of Various Copper Films in Microelectronics 微电子中各种铜膜表面氧化层的电化学分析

2021 IEEE CPMT Symposium Japan (ICSJ) Pub Date : 2021-11-10 DOI: 10.1109/ICSJ52620.2021.9648887

Chi-Hsuan Lin, Wei-Chen Huang, Y. Ke, Jenn-Ming Song

{"title":"Electrochemical Analysis of Surface Oxide Layers of Various Copper Films in Microelectronics","authors":"Chi-Hsuan Lin, Wei-Chen Huang, Y. Ke, Jenn-Ming Song","doi":"10.1109/ICSJ52620.2021.9648887","DOIUrl":"https://doi.org/10.1109/ICSJ52620.2021.9648887","url":null,"abstract":"Copper is a commonly used conductor and metallization materials. However, surface copper oxide layers which readily form during fabrication and assembly processes will increase electrical/thermal resistance, and even cause reliability problems. The dominating factors include the constituent phases of surface oxide layer, as well as the thickness ratio of CuO/Cu2O. The most common way to analyze surface oxide layer are XPS (X-ray photoelectron spectroscopy) and TEM (Transmission electron microscopy) techniques. However, sophisticated instruments are required and sample preparation is time-consuming. Efficient and accurate on-line or at-line measurement is very crucial. In this study, the analysis of oxidized layer of electroplated, and cold-rolled copper surface by means of coulometric reduction method was developed. Various microelectronic assembly processes were simulated to obtain copper surface with different oxidation conditions, including molding, curing, reflowing, and high temperature aging were also performed. Experimental results demonstrate that coulometric reduction can precisely detect the oxide phase and their thickness regardless of the sample conditions.","PeriodicalId":191859,"journal":{"name":"2021 IEEE CPMT Symposium Japan (ICSJ)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-11-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115525814","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Millimeter-Wave Antenna-in-Package Design Validation Solution in Wireless Communication Applications 毫米波天线在无线通信应用中的封装设计验证解决方案

2021 IEEE CPMT Symposium Japan (ICSJ) Pub Date : 2021-11-10 DOI: 10.1109/ICSJ52620.2021.9648903

Sheng-Chi Hsieh, Fu-Cheng Chu, Cheng-Yu Ho, Chen-Chao Wang

{"title":"Millimeter-Wave Antenna-in-Package Design Validation Solution in Wireless Communication Applications","authors":"Sheng-Chi Hsieh, Fu-Cheng Chu, Cheng-Yu Ho, Chen-Chao Wang","doi":"10.1109/ICSJ52620.2021.9648903","DOIUrl":"https://doi.org/10.1109/ICSJ52620.2021.9648903","url":null,"abstract":"In this paper, the 2 by 2 mmWave AiP array is design in organic substrate using fcCSP structure. The RF die is placed on bottom side of organic substrate and the AiP array is put in the front side of organic substrate. Through 3D electromagnetic solver, the single AiP has good bandwidth with over 6dBi antenna gain. In design stage, the spherical chamber is utilized to validate single antenna performance. It can directly probe by RF probe on C4 bump pad or micro bump pad to get 2D or 3D radiation pattern of single antenna. From the simulation and measurement results, there is a good correlation. In engineering stage, the RF die is mounted on the bottom of organic substrate. The AiP device can utilize the compact antenna test range (CATR) chamber to get all relative radiation patterns, such as 2D/3D pattern and EIRP. Of course, the CART is a good validation solution for beamforming measurement. Finally, for mass production, a measurement test set is announced for mmWave AiP or SiP production test. Through the three different measurement solutions and mmWave measurement flow, a completed mmWave AiP and SiP flow from design to validation is delivered.","PeriodicalId":191859,"journal":{"name":"2021 IEEE CPMT Symposium Japan (ICSJ)","volume":"2515 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-11-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131347648","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

A High Capacity and Cost-Effective OFDM EML TO-CAN for RoF/IFoF Transmission Systems in Beyond-5G Mobile Fronthaul 用于超5g移动前传RoF/IFoF传输系统的高容量、高性价比的OFDM EML TO-CAN

2021 IEEE CPMT Symposium Japan (ICSJ) Pub Date : 2021-11-10 DOI: 10.1109/ICSJ52620.2021.9648882

Hayato Sano, Ryota Fujihara, S. Nakamura, M. Binkai, Fumio Shoda, N. Ohata

引用次数: 0

Multi-Gigabit/s LiFi Networking for 6G 多千兆/s LiFi网络6G

2021 IEEE CPMT Symposium Japan (ICSJ) Pub Date : 2021-11-10 DOI: 10.1109/ICSJ52620.2021.9648883

H. Haas

引用次数: 0

Functional interfaces for an openable artificial intestinal tract device as an organ-on-a-chip 一种可打开人工肠道装置作为器官芯片的功能接口

2021 IEEE CPMT Symposium Japan (ICSJ) Pub Date : 2021-11-10 DOI: 10.1109/ICSJ52620.2021.9648551

S. Ishibashi, Y. Inoue, S. Shimizu, S. Konishi

引用次数: 0

Evaluation of Wafer Bond Strength under Vacuum 真空条件下晶圆键合强度的评价

2021 IEEE CPMT Symposium Japan (ICSJ) Pub Date : 2021-11-10 DOI: 10.1109/ICSJ52620.2021.9648866

K. Takeuchi, T. Suga

引用次数: 0

Design and Fabrication of Y-branched Polymer Waveguide based Optical Coupler 基于y支路聚合物波导的光耦合器的设计与制造

2021 IEEE CPMT Symposium Japan (ICSJ) Pub Date : 2021-11-10 DOI: 10.1109/ICSJ52620.2021.9648545

Ryosuke Hatai, Hiroki Hama, T. Ishigure

引用次数: 0

Demonstration of Flexible Polyimide Fibers for Dense Optical Packaging 用于致密光学封装的柔性聚酰亚胺纤维的演示

2021 IEEE CPMT Symposium Japan (ICSJ) Pub Date : 2021-11-10 DOI: 10.1109/ICSJ52620.2021.9648879

Yuki Okada, T. Itatani, Y. Okano, T. Amano, S. Suda

引用次数: 0