Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)最新文献_第3页

A machine vision system of ball grid array inspection on RT-Linux OS 基于RT-Linux的球网格阵列检测机器视觉系统

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809) Pub Date : 2004-04-27 DOI: 10.1109/BEPRL.2004.1308154

X. Nianjiong, C. Qixin, Fu Zhuang, Jey Lee

引用次数: 1

Study on plasma cleaning and strength of wire bonding 等离子清洗及焊线强度的研究

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809) Pub Date : 2004-04-27 DOI: 10.1109/BEPRL.2004.1308151

Guan Rongfeng, Wang Xuefang, Zhu Fulong, Gan Zhiyin, Liu Sheng, Hu Dexiu

{"title":"Study on plasma cleaning and strength of wire bonding","authors":"Guan Rongfeng, Wang Xuefang, Zhu Fulong, Gan Zhiyin, Liu Sheng, Hu Dexiu","doi":"10.1109/BEPRL.2004.1308151","DOIUrl":"https://doi.org/10.1109/BEPRL.2004.1308151","url":null,"abstract":"In IC and MEMS (micro electric mechanical systems) packaging processing, the successful application of plasma cleaning technology depends on cleaning process parameters such as pressure, RF power, cleaning time and cleaning gas etc. The effects of cleaning parameters on the strength of wire bonding are investigated in this paper. We select a type of hybrid PCB to do cleaning experiments using difference process parameters, and then do wire bonding and pull tests. The experimental results demonstrate: (1) the cleaning effect is very good when RF power is around 200/spl sim/600 W, and typical PF power value is 600 W; (2) in the condition between 400-600 W RF power, cleaning for about 10-15 minutes can get a good cleaning effect; (3) the cleaning effect is better when the samples were placed in the ground electrode rather than in the anode; (4) when the gas pressure is 100/spl sim/120 mT or 140/spl sim/180 mT, we can obtain a better cleaning effect; (5) smaller distances and symmetrical electrode structures have a better cleaning effect.","PeriodicalId":186676,"journal":{"name":"Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128026161","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

SMT solder joint's shape and location optimization using modified genetic algorithm in the dynamic loadings 基于改进遗传算法的动态加载SMT焊点形状和位置优化

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809) Pub Date : 2004-04-27 DOI: 10.1109/BEPRL.2004.1308168

Lingyun Wei, Mein Zhao, Qiang Guo, Xiao-chang Zhang

{"title":"SMT solder joint's shape and location optimization using modified genetic algorithm in the dynamic loadings","authors":"Lingyun Wei, Mein Zhao, Qiang Guo, Xiao-chang Zhang","doi":"10.1109/BEPRL.2004.1308168","DOIUrl":"https://doi.org/10.1109/BEPRL.2004.1308168","url":null,"abstract":"Vibration fatigue has become an important factor impacting the SMT solder joint reliability and lifetime in dynamic loadings. In this paper shape and location optimization of SMT solder joints under vibration and shock conditions are investigated to raise their reliability and lifetime. A PBGA256 assembly is chosen to investigate the effect of shape and location of a SMT solder joint on its reliability under vibration and shock conditions. Then a modal experiment was performed to obtain the dynamic characteristics of the PBGA256 assembly. A finite element model, which is close to the PBGA256 assembly sample, is built based on the modal experiment. Then a modified genetic algorithm, which is a global optimization method, is used to perform shape and location of SMT solder joints based on the FEM of the PBGA256 assembly under shock conditions. The optimal results show the SMT solder joint with optimal location and shape has less maximum strain. As a result, reliability of SMT solder joint with those optimal parameters is better.","PeriodicalId":186676,"journal":{"name":"Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129863211","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Implementation of an enhanced FMEA system for the PCBA design testing - a practical case study [failure mode and effects analysis] 针对PCBA设计测试的增强型FMEA系统的实施——一个实际案例研究[失效模式和影响分析]

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809) Pub Date : 2004-04-27 DOI: 10.1109/BEPRL.2004.1308152

T. Chen, Yun-Shiow Chen, Y. Chung

{"title":"Implementation of an enhanced FMEA system for the PCBA design testing - a practical case study [failure mode and effects analysis]","authors":"T. Chen, Yun-Shiow Chen, Y. Chung","doi":"10.1109/BEPRL.2004.1308152","DOIUrl":"https://doi.org/10.1109/BEPRL.2004.1308152","url":null,"abstract":"It is well known that current engineering (CE) has shown its importance in the printed circuit board assembly (PCBA) testing phase. During the PCBA design process, the testing of PCBA quality must be simultaneously engaged with the manufacturing of the PCBA product, otherwise a defective PCBA product could be produced. This article presents a practical case of how to use an enhanced FMEA (called E-FMEA) system in the PCBA design phase to increase and ensure the quality of the PCBA product. The enhancement involves practical PCBA testing experience knowledge in the form of descriptive rules and their computerization using VBA (visual basic applications) macroinstructions in an Excel spreadsheet system. The creation of this enhancement is especially to meet the international customer requirements of the PCBA testing corporation in Taiwan. The proposed E-FMEA system is successfully applied in this studied large-scale PCBA testing corporation and greatly decreases the testing cost and shortens the testing time the customer requests.","PeriodicalId":186676,"journal":{"name":"Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)","volume":"236 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133177914","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Microstructure and interface reaction between Sn-3.5Ag solder and electroplated Ni layer on Cu substrate during high temperature exposure Cu衬底高温暴露时Sn-3.5Ag焊料与镀镍层的微观结构及界面反应

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809) Pub Date : 2004-04-27 DOI: 10.1109/BEPRL.2004.1308146

L. Duan, D.Q. Yu, S.Q. Han, J. Zhao, L. Wang

{"title":"Microstructure and interface reaction between Sn-3.5Ag solder and electroplated Ni layer on Cu substrate during high temperature exposure","authors":"L. Duan, D.Q. Yu, S.Q. Han, J. Zhao, L. Wang","doi":"10.1109/BEPRL.2004.1308146","DOIUrl":"https://doi.org/10.1109/BEPRL.2004.1308146","url":null,"abstract":"The microstructure and interface reaction between Sn-3.5Ag solder and electroplated Ni layer on a Cu substrate was studied. The results show that the electroplated Ni layer can effectively hinder the inter-diffusion between Sn-3.5Ag solder and Cu substrate after soldering and aging. The intermetallic compound (IMC) formed at the interface is quite thin after soldering and nano-size Ag/sub 3/Sn particles are also observed on the surface. Under low temperature (70/spl deg/C) exposure for 1000 h the IMC at the interface is Ni/sub 3/Sn/sub 4/. However, under high temperature (120/spl deg/C, 170/spl deg/C) exposure for 1000 h the IMC formed at the interface changes to (Cu/sub 1-x/Ni/sub x/)/sub 3/Sn/sub 4/ which implies that the Cu atoms from the Cu substrate diffuse into the Ni/sub 3/Sn/sub 4/ layer through the electroplated Ni layer. Coarse Ag/sub 3/Sn particles are also found on the surface of IMC after etching away the remaining solder at 170/spl deg/C aging for 1000 h. The growth kinetic of IMC layer during aging is x=(kt)/sup 1/2/ which implies that the growth of IMC is controlled by a diffusion mechanism. The activation energy of the IMCs is 132.404 KJ/mol which is larger than that of Cu/sub 6/Sn/sub 5/ (58.95 KJ/mol). It means that the growth rate of the IMCs is much slower than that of Cu/sub 6/Sn/sub 5/ under low temperature aging while a bit faster under high temperature aging.","PeriodicalId":186676,"journal":{"name":"Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)","volume":"110 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134433774","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Photonics in China 中国光子学

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809) Pub Date : 2004-04-27 DOI: 10.1109/BEPRL.2004.1308165

D.K. Lau, S. Islam

引用次数: 0

The evaluation of the new composite lead free solders with the novel fabricating process 新型复合无铅焊料制备工艺的评价

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809) Pub Date : 2004-04-27 DOI: 10.1109/BEPRL.2004.1308149

L. Wang, D.Q. Yu, S.Q. Han, H. T. Ma, H.P. Xie

{"title":"The evaluation of the new composite lead free solders with the novel fabricating process","authors":"L. Wang, D.Q. Yu, S.Q. Han, H. T. Ma, H.P. Xie","doi":"10.1109/BEPRL.2004.1308149","DOIUrl":"https://doi.org/10.1109/BEPRL.2004.1308149","url":null,"abstract":"With the development of surface mount technology, especially for optical and optoelectronic devices, solders having improved mechanical properties are required for application that demand high reliability and dimensional stability. Using composite solders, by the addition of reinforcement particles to a conventional solder alloy, is an attractive potential method to enhance the mechanical properties. Recently, we developed a new process to fabricate composite lead free solders. 3%, 5%, and 10% weigh percentage of Y/sub 2/O/sub 3/ rare earth oxides were milled with RMA flux and then Sn-3Ag-0.5Cu powders were added, to form a new solder paste. The microstructures of the new composite solders are investigated and it is proved that with this new process, the reinforcement particles disperse in the solder quite finely and the addition of 3% and 5% rare earth oxides increases the shear strength of the solder joints dramatically, while 10% addition decreased the strength. At the same time, the addition does no harm to the wetting properties.","PeriodicalId":186676,"journal":{"name":"Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121728575","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Analysis on altimeters' reliability growth test data 高度计可靠性增长试验数据分析

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809) Pub Date : 1900-01-01 DOI: 10.1109/BEPRL.2004.1308159

Wen-hua Mei

引用次数: 0

Effects of stress and cracks on the reliability of optoelectronic active components 应力和裂纹对光电有源元件可靠性的影响

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809) Pub Date : 1900-01-01 DOI: 10.1109/BEPRL.2004.1308164

Xu Yong

引用次数: 0