{"title":"基于RT-Linux的球网格阵列检测机器视觉系统","authors":"X. Nianjiong, C. Qixin, Fu Zhuang, Jey Lee","doi":"10.1109/BEPRL.2004.1308154","DOIUrl":null,"url":null,"abstract":"In this paper, a machine vision system for ball grid array (BGA) inspection is proposed. The binocular vision system can provide enough geometrical information by an optical approach for monitoring the quality of solder balls. A new optical method for BGA lead coplanarity measurement has been proposed, whose feasibility was verified in theory. This study is focused on algorithms for evaluating the critical characteristics, including the height of solder balls, the size of solder balls, coplanarity, and pitch, which are used to detect solder ball defects. These algorithms are implemented on an RT-Linux operating system. It provides a reference for the development of higher-speed and real-time inspection methods.","PeriodicalId":186676,"journal":{"name":"Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"A machine vision system of ball grid array inspection on RT-Linux OS\",\"authors\":\"X. Nianjiong, C. Qixin, Fu Zhuang, Jey Lee\",\"doi\":\"10.1109/BEPRL.2004.1308154\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, a machine vision system for ball grid array (BGA) inspection is proposed. The binocular vision system can provide enough geometrical information by an optical approach for monitoring the quality of solder balls. A new optical method for BGA lead coplanarity measurement has been proposed, whose feasibility was verified in theory. This study is focused on algorithms for evaluating the critical characteristics, including the height of solder balls, the size of solder balls, coplanarity, and pitch, which are used to detect solder ball defects. These algorithms are implemented on an RT-Linux operating system. It provides a reference for the development of higher-speed and real-time inspection methods.\",\"PeriodicalId\":186676,\"journal\":{\"name\":\"Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-04-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/BEPRL.2004.1308154\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/BEPRL.2004.1308154","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A machine vision system of ball grid array inspection on RT-Linux OS
In this paper, a machine vision system for ball grid array (BGA) inspection is proposed. The binocular vision system can provide enough geometrical information by an optical approach for monitoring the quality of solder balls. A new optical method for BGA lead coplanarity measurement has been proposed, whose feasibility was verified in theory. This study is focused on algorithms for evaluating the critical characteristics, including the height of solder balls, the size of solder balls, coplanarity, and pitch, which are used to detect solder ball defects. These algorithms are implemented on an RT-Linux operating system. It provides a reference for the development of higher-speed and real-time inspection methods.
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