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Proceeding of Transport Phenomena in Thermal Engineering. Volume 2最新文献

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EFFECT OF THE MODULE FRONT DOOR CLOSING PROCEDURE OF A DIGITAL TRANSMISSION EQUIPMENT ON THE TEMPERATURE OF THE COMPONENTS 数字传输设备模块前门关闭程序对组件温度的影响
Proceeding of Transport Phenomena in Thermal Engineering. Volume 2 Pub Date : 1993-05-01 DOI: 10.1615/istp-vi.610
R. Ramos, L. Milanez
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引用次数: 0
THERMODYNAMIC AND TRANSPORT PROPERTIES OF NON-EQUILIBRIUM PLASMA 非平衡等离子体的热力学和输运性质
Proceeding of Transport Phenomena in Thermal Engineering. Volume 2 Pub Date : 1993-05-01 DOI: 10.1615/istp-vi.1190
K. Cho, T. Eddy
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引用次数: 0
THE DEVELOPMENT OF TITANIUM-AMMONIA VARIABLE CONDUCTANCE HEAT PIPE 钛-氨变导热管的研制
Proceeding of Transport Phenomena in Thermal Engineering. Volume 2 Pub Date : 1993-05-01 DOI: 10.1615/istp-vi.660
M. Ishizuka, T. Sasaki, Y. Miyazaki
{"title":"THE DEVELOPMENT OF TITANIUM-AMMONIA VARIABLE CONDUCTANCE HEAT PIPE","authors":"M. Ishizuka, T. Sasaki, Y. Miyazaki","doi":"10.1615/istp-vi.660","DOIUrl":"https://doi.org/10.1615/istp-vi.660","url":null,"abstract":"","PeriodicalId":168856,"journal":{"name":"Proceeding of Transport Phenomena in Thermal Engineering. Volume 2","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125955780","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
PERFORMANCE OF A HEAT EXCHANGER WITH SECONDARY FLOW EFFECTS IN FLUID STREAMS 流体流中具有二次流效应的热交换器的性能
Proceeding of Transport Phenomena in Thermal Engineering. Volume 2 Pub Date : 1993-05-01 DOI: 10.1615/INTERJFLUIDMECHRES.V25.I4-6.320
T. Chandratilleke, J. C. Ho
{"title":"PERFORMANCE OF A HEAT EXCHANGER WITH SECONDARY FLOW EFFECTS IN FLUID STREAMS","authors":"T. Chandratilleke, J. C. Ho","doi":"10.1615/INTERJFLUIDMECHRES.V25.I4-6.320","DOIUrl":"https://doi.org/10.1615/INTERJFLUIDMECHRES.V25.I4-6.320","url":null,"abstract":"","PeriodicalId":168856,"journal":{"name":"Proceeding of Transport Phenomena in Thermal Engineering. Volume 2","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114443197","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
FINNED RECTANGULAR CAVITIES FILLED WITH PCM FOR THERMAL CONTROL OF ELECTRONIC EQUIPMENTS 用于电子设备热控制的PCM填充矩形翅片腔
Proceeding of Transport Phenomena in Thermal Engineering. Volume 2 Pub Date : 1993-05-01 DOI: 10.1615/istp-vi.580
Kamal A. R. Ismaii, M.R.B. Trullenque
{"title":"FINNED RECTANGULAR CAVITIES FILLED WITH PCM FOR THERMAL CONTROL OF ELECTRONIC EQUIPMENTS","authors":"Kamal A. R. Ismaii, M.R.B. Trullenque","doi":"10.1615/istp-vi.580","DOIUrl":"https://doi.org/10.1615/istp-vi.580","url":null,"abstract":"","PeriodicalId":168856,"journal":{"name":"Proceeding of Transport Phenomena in Thermal Engineering. Volume 2","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116929967","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
A PRACTICAL APPLICATION OF THE INCOMPLETE CHOLESKEY-DECOMPOSITION CONJUGATE GRADIENT METHOD TO LARGE EDDY SIMULATION INNER-BOUNDARY PROBLEMS 不完全胆固醇分解共轭梯度法在大涡模拟内边界问题中的实际应用
Proceeding of Transport Phenomena in Thermal Engineering. Volume 2 Pub Date : 1993-05-01 DOI: 10.1615/istp-vi.1200
Sae Yul Lee, Y. Hassan
{"title":"A PRACTICAL APPLICATION OF THE INCOMPLETE CHOLESKEY-DECOMPOSITION CONJUGATE GRADIENT METHOD TO LARGE EDDY SIMULATION INNER-BOUNDARY PROBLEMS","authors":"Sae Yul Lee, Y. Hassan","doi":"10.1615/istp-vi.1200","DOIUrl":"https://doi.org/10.1615/istp-vi.1200","url":null,"abstract":"","PeriodicalId":168856,"journal":{"name":"Proceeding of Transport Phenomena in Thermal Engineering. Volume 2","volume":"96 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117126563","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
NUMERICAL COMPUTATION FOR CZOCHRALSKI CONVECTION OF LIQUID METAL IN A CUSP MAGNETIC FIELD 尖端磁场中液态金属的直克拉尔斯基对流的数值计算
Proceeding of Transport Phenomena in Thermal Engineering. Volume 2 Pub Date : 1993-05-01 DOI: 10.1615/istp-vi.470
A. Arimura, H. Ozoe
{"title":"NUMERICAL COMPUTATION FOR CZOCHRALSKI CONVECTION OF LIQUID METAL IN A CUSP MAGNETIC FIELD","authors":"A. Arimura, H. Ozoe","doi":"10.1615/istp-vi.470","DOIUrl":"https://doi.org/10.1615/istp-vi.470","url":null,"abstract":"","PeriodicalId":168856,"journal":{"name":"Proceeding of Transport Phenomena in Thermal Engineering. Volume 2","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129603420","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
STABILITY CRITERION FOR A COMPOSITE HIGH-TEMPERATURE TAPE/FILM SUPERCONDUCTOR 复合高温带/膜超导体的稳定性判据
Proceeding of Transport Phenomena in Thermal Engineering. Volume 2 Pub Date : 1993-05-01 DOI: 10.1615/istp-vi.570
S. Seol, M. Chyu
{"title":"STABILITY CRITERION FOR A COMPOSITE HIGH-TEMPERATURE TAPE/FILM SUPERCONDUCTOR","authors":"S. Seol, M. Chyu","doi":"10.1615/istp-vi.570","DOIUrl":"https://doi.org/10.1615/istp-vi.570","url":null,"abstract":"","PeriodicalId":168856,"journal":{"name":"Proceeding of Transport Phenomena in Thermal Engineering. Volume 2","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125626690","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
THE EFFECT OF MODULE/BOARD INTERFACE THERMAL RESISTANCE ON COOLING OF AN AIR-COOLED MODULE 模块/板接口热阻对风冷模块散热的影响
Proceeding of Transport Phenomena in Thermal Engineering. Volume 2 Pub Date : 1993-05-01 DOI: 10.1615/istp-vi.640
S. Park, W. Nakayama
{"title":"THE EFFECT OF MODULE/BOARD INTERFACE THERMAL RESISTANCE ON COOLING OF AN AIR-COOLED MODULE","authors":"S. Park, W. Nakayama","doi":"10.1615/istp-vi.640","DOIUrl":"https://doi.org/10.1615/istp-vi.640","url":null,"abstract":"","PeriodicalId":168856,"journal":{"name":"Proceeding of Transport Phenomena in Thermal Engineering. Volume 2","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116477095","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
ENTROPY: AN EXTRAPHYSICAL PRACTICAL APPLICATION (AN ENTROPIC INDEX FOR THE STATE OF DEVELOPMENT OF A TECHNICAL PROJECT) 熵:一个物理之外的实际应用(一个技术项目发展状态的熵指数)
Proceeding of Transport Phenomena in Thermal Engineering. Volume 2 Pub Date : 1993-05-01 DOI: 10.1615/INTERJFLUIDMECHRES.V25.I4-6.290
R. Arienti, G. Nicoletti
{"title":"ENTROPY: AN EXTRAPHYSICAL PRACTICAL APPLICATION (AN ENTROPIC INDEX FOR THE STATE OF DEVELOPMENT OF A TECHNICAL PROJECT)","authors":"R. Arienti, G. Nicoletti","doi":"10.1615/INTERJFLUIDMECHRES.V25.I4-6.290","DOIUrl":"https://doi.org/10.1615/INTERJFLUIDMECHRES.V25.I4-6.290","url":null,"abstract":"","PeriodicalId":168856,"journal":{"name":"Proceeding of Transport Phenomena in Thermal Engineering. Volume 2","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127250374","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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