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THE EFFECT OF MODULE/BOARD INTERFACE THERMAL RESISTANCE ON COOLING OF AN AIR-COOLED MODULE

Proceeding of Transport Phenomena in Thermal Engineering. Volume 2 Pub Date : 1993-05-01 DOI:10.1615/istp-vi.640
S. Park, W. Nakayama
{"title":"THE EFFECT OF MODULE/BOARD INTERFACE THERMAL RESISTANCE ON COOLING OF AN AIR-COOLED MODULE","authors":"S. Park, W. Nakayama","doi":"10.1615/istp-vi.640","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":168856,"journal":{"name":"Proceeding of Transport Phenomena in Thermal Engineering. Volume 2","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceeding of Transport Phenomena in Thermal Engineering. Volume 2","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1615/istp-vi.640","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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模块/板接口热阻对风冷模块散热的影响
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Proceeding of Transport Phenomena in Thermal Engineering. Volume 2
Proceeding of Transport Phenomena in Thermal Engineering. Volume 2
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