ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems最新文献_第2页

InterPACK2022 Front Matter InterPACK2022前沿问题

ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2022-10-25 DOI: 10.1115/ipack2022-fm1

引用次数: 0

CFD Simulation-Based Comparative Study of Forced Convection Single-Phase Liquid Immersion Cooling for a High-Powered Server 基于CFD模拟的大功率服务器强制对流单相浸没冷却对比研究

ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2022-10-25 DOI: 10.1115/ipack2022-97402

P. Murthy, Gautam Gupta, Joseph Herring, Jacob Lamotte-Dawaghreh, K. Sivaraju, Pratik V. Bansode, Himanshu Modi, D. Agonafer, Poornima Mynampati, Mike Sweeney

{"title":"CFD Simulation-Based Comparative Study of Forced Convection Single-Phase Liquid Immersion Cooling for a High-Powered Server","authors":"P. Murthy, Gautam Gupta, Joseph Herring, Jacob Lamotte-Dawaghreh, K. Sivaraju, Pratik V. Bansode, Himanshu Modi, D. Agonafer, Poornima Mynampati, Mike Sweeney","doi":"10.1115/ipack2022-97402","DOIUrl":"https://doi.org/10.1115/ipack2022-97402","url":null,"abstract":"\u0000 Due to increasing computational workload and thermal design power requirements of high power-density microelectronics, low heat carrying capacity and poor thermal conductivity of air renders air-cooling insufficient to meet the cooling demands of component heat generation in high-performance servers. A more effective method of removing heat from these high-powered components is by using single-phase immersion cooling with a dielectric fluid of superior thermal properties and high boiling point. This study compares traditional forced-air cooling with forced convection single-phase immersion cooling to minimize chip junction temperatures of a 776 W high powered data center server using CFD simulations. The server is of spread-core configuration consisting of 2 CPU heatsink assemblies and 32 DIMM units with their specified chip thermal design power (TDPs). The first method consists of forced-air cooling with a 28°C air inlet supply and 110 CFM inlet air flowrate to establish baseline thermal performance. The second method is forced convection single-phase immersion cooling of the server in EC-110 dielectric fluid at 28 °C temperature and 2 GPM flow rate to observe server performance improvement in CPU case temperatures, maximum DIMM temperature, and server pressure drop through immersion cooling method. Lastly, CFD simulations are performed at different fluid inlet temperatures of 30, 40 and 50 °C, and 2 GPM fluid inlet flow rate, and the percentage change in the CPU case temperatures, server pressure drop and the maximum DIMM temperatures with fluid inlet temperature were studied.","PeriodicalId":117260,"journal":{"name":"ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131045001","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Additive Manufacturing of Electronic Patterns for Harsh Environments 恶劣环境下电子图案的增材制造

ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2022-10-25 DOI: 10.1115/ipack2022-94052

Nicolas Delavault, Tanguy Lacondemine, Rémy Kalmar, M. Fendler, S. Achache, F. Sanchette

引用次数: 1

Study of Interface Monotonic and Fatigue Fracture Measurements at the Substrate Potting Compound Interfaces Under Flexure Loading 弯曲载荷作用下衬底灌封复合界面单调与疲劳断裂测量研究

ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2022-10-25 DOI: 10.1115/ipack2022-97448

P. Lall, Padmanava Choudhury, K. Blecker

{"title":"Study of Interface Monotonic and Fatigue Fracture Measurements at the Substrate Potting Compound Interfaces Under Flexure Loading","authors":"P. Lall, Padmanava Choudhury, K. Blecker","doi":"10.1115/ipack2022-97448","DOIUrl":"https://doi.org/10.1115/ipack2022-97448","url":null,"abstract":"\u0000 Electronics in harsh environments are often subjected to extreme shock loading up to 50,000Gs, moisture, and high temperature. Potting of PCBs is often used to provide protection from extreme mechanical shock loads, vibration loads, and thermo-mechanical loads. The cured potting materials are prone to interfacial delamination under dynamic shock loading, which in turn may potentially cause failures in the package interconnects. The literature on potting compounds primarily focuses on the reliability in end application or the study of bulk material properties. This paper uses a four-point bend specimen to study the Substrate/Epoxy system and measure the fracture parameters of the bi-material strips to determine the interface delamination mechanisms. The bi-material strips of Substrate/Epoxy was kept at elevated temperatures of 100°C for aging. Then the sample specimens were subjected to quasi-static monotonic and cyclic loading to observe the critical stress intensity factors, fatigue slope parameters, and degradation interfaces bond adhesion of bi-material strips. Epoxy-A is a stiff material with 12,260 psi of tensile strength. The monotonic critical stress intensity factors and fatigue crack growth of the interfacial delamination for the two epoxy systems were characterized using strain energy release rate. A prediction of a number of cycles to failure and the performance of different epoxy system resistance was evaluated during cyclic bending loading using Paris Power Law.","PeriodicalId":117260,"journal":{"name":"ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130899201","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Additively Printed Flexible Charging Circuits and Effect on Evolution of Line Resistance and Charging Current in Charging Thin Flexible Batteries 增材印刷柔性充电电路及其对薄柔性电池充电线路电阻和充电电流演变的影响

ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2022-10-25 DOI: 10.1115/ipack2022-97450

P. Lall, Ved Soni, Scott Miller

{"title":"Additively Printed Flexible Charging Circuits and Effect on Evolution of Line Resistance and Charging Current in Charging Thin Flexible Batteries","authors":"P. Lall, Ved Soni, Scott Miller","doi":"10.1115/ipack2022-97450","DOIUrl":"https://doi.org/10.1115/ipack2022-97450","url":null,"abstract":"\u0000 Flexible electronics are increasingly finding commercial applications ranging from wearable activity tracking watches, rollable displays, foldable smartphones, and biometrics. There is an acceleration of effort in the research and development of additively printed electronics on flexible substrates. Aside from device flexibility, the usage of flexible electronics leads to weight and bulk miniaturization of the product leading to compact and sleek devices. In our previous works, we have successfully studied the effect of mechanical stresses on flexible batteries and their integration into the flexible format via battery lamination. However, in addition to the battery, the battery charging circuit is a key component that must be transferred from a rigid PCB to a flexible format. This study aims to employ electrically conductive ink to print a linear battery charging circuit on a flexible polyimide substrate using different additive printing technologies, namely, aerosol jet printing and direct ink writing (DIW). In aerosol jet printing, both the ultrasonic (AJU) and pneumatic atomization (AJP) technologies have been used for depositing ink, and their subsequent results have been compared. COTS have to be attached to the circuit using electronically conductive adhesives (ECA). The flexible charging circuit has been compared for the print platforms of aerosol-jet printing and direct-write during charging-discharge cycling of the circuit.","PeriodicalId":117260,"journal":{"name":"ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"71 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131694527","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days 50℃等温时效120天对SAC+Bi焊料高应变率力学性能的影响

ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2022-10-25 DOI: 10.1115/ipack2022-97449

P. Lall, M. Saha, J. Suhling, K. Blecker

{"title":"Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days","authors":"P. Lall, M. Saha, J. Suhling, K. Blecker","doi":"10.1115/ipack2022-97449","DOIUrl":"https://doi.org/10.1115/ipack2022-97449","url":null,"abstract":"\u0000 In aerospace, military, and automotive applications, various electronic parts may be subjected to sustained operation at high and low surrounding temperatures as well as high strain-rate loads. Previous research studies have shown that material properties of undoped SAC alloys evolve even at moderate temperatures after a prolonged period of storage. A variety of dopants has been introduced into SAC alloy formulations in order to reduce the aging effects. In this study, two doped SAC solder called QSAC10 and QSAC20, have been subjected to high strain rate testing after keeping them in storage at temperature of 50°C for 120 days. Samples with no aging to 120 days aged samples have been subjected to uniaxial tensile tests to measure the mechanical properties of SAC+Bi solders. The High and Low operating temperatures used in this experiment ranged from −65°C to 200°C. Then the experimental material data was used to compute the constants for the Anand Visco-Plasticity model. Using the Anand constitutive model, the material constitutive behavior has been implemented in a finite element framework to simulate the drop events.","PeriodicalId":117260,"journal":{"name":"ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"57 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123339059","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

SOH Degradation Estimation of Thin Flexible Li-Ion Power Sources Subjected to Accelerated Life Cycling With Randomized Charge-Discharge and C-Rates 随机充放电和c -倍率下加速寿命循环的柔性薄锂离子电源SOH降解评价

ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2022-10-25 DOI: 10.1115/ipack2022-97451

P. Lall, Ved Soni

{"title":"SOH Degradation Estimation of Thin Flexible Li-Ion Power Sources Subjected to Accelerated Life Cycling With Randomized Charge-Discharge and C-Rates","authors":"P. Lall, Ved Soni","doi":"10.1115/ipack2022-97451","DOIUrl":"https://doi.org/10.1115/ipack2022-97451","url":null,"abstract":"\u0000 The growing need for wearable devices, fitness accessories, and biomedical equipment has led to the upsurge in research and development of thin, flexible battery research and development. Studying degradation of such power sources used in consumer electronics devices is essential from multiple perspectives, as it allows the manufacturer to determine device warranty, affects the user purchasing decision, and can also be used to inform the user of their device’s battery health and remaining useful life in real-time. In order to achieve these goals via empirical methods, batteries are generally subjected to accelerated life cycling tests with various operating conditions, and their degradation data gathered is then used to model their SOH degradation. However, in the real world, the charge-discharge depth and charge-discharge rates for every cycle are hardly constant and vary greatly for the same user over time and for different users who use their devices differently. The real task for such developed battery models is to estimate the SOH of batteries being used in real-world scenarios with such random variations of charge-discharge depth and C-rates. To this end, the current work conducts accelerated life cycling tests of batteries with random variation in these two parameters, individually and simultaneously. Finally, multiple iterations of the SOH estimation models have been presented with different predictor variables to minimize the model validation error.","PeriodicalId":117260,"journal":{"name":"ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"204 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122587279","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations 单相浸没式两套接服务器槽式与滑橇式的比较研究

ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2022-10-25 DOI: 10.1115/ipack2022-97429

K. Sivaraju, Pratik V. Bansode, Gautam Gupta, Jacob Lamotte-Dawaghreh, S. Saini, V. Simon, Joseph Herring, S. Karajgikar, V. Mulay, D. Agonafer

{"title":"Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations","authors":"K. Sivaraju, Pratik V. Bansode, Gautam Gupta, Jacob Lamotte-Dawaghreh, S. Saini, V. Simon, Joseph Herring, S. Karajgikar, V. Mulay, D. Agonafer","doi":"10.1115/ipack2022-97429","DOIUrl":"https://doi.org/10.1115/ipack2022-97429","url":null,"abstract":"\u0000 Submerging a cluster of servers inside a large tank is the customary way of employing single-phase immersion cooling. But this approach requires a complete renovation of existing air-cooled infrastructure. A practical approach to convert an air-cooled data center to immersion cooled data center can be retaining the rack and server arrangements and supplying each server with immersion liquid in sled configuration – retaining horizontal position. The present study aims at characterizing the thermal performance of a 2-socket server in sled and tank configurations using CFD. In the tank configuration model, the server is immersed vertically with the coolant supply from bottom to top as in the case of a typical single-phase immersion deployments. In the sled configuration, the server orientation is retained (horizontally) and the fluid supply is modeled as an inlet and outlet manifold connected to the same side of the server. The CFD modeling approach is aimed to determine the heat transfer behavior of the server in two configurations being looked at was done for a commercially available dielectric immersion liquid, EC 110. A detailed baseline geometry of the server was first simplified, considering only the components that are significant source of heat and/or impact the server flow characteristics. Some of the components considered for analysis include CPU, storage drives and memory modules. The performance of the server in two configurations is compared to determine the efficiency of both the server configurations while ensuring the components do not exceed their respective thermal threshold. Component temperatures are obtained by varying the coolant flow rates and dielectric temperatures.","PeriodicalId":117260,"journal":{"name":"ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126076026","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Evolution of the Interface Critical Stress Intensity Factors Between TIM Copper Substrates due to High-Temperature Isothermal Aging 高温等温时效下TIM铜衬底界面临界应力强度因子的演化

ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2022-10-25 DOI: 10.1115/ipack2022-97440

P. Lall, Padmanava Choudhury, J. Williamson

{"title":"Evolution of the Interface Critical Stress Intensity Factors Between TIM Copper Substrates due to High-Temperature Isothermal Aging","authors":"P. Lall, Padmanava Choudhury, J. Williamson","doi":"10.1115/ipack2022-97440","DOIUrl":"https://doi.org/10.1115/ipack2022-97440","url":null,"abstract":"\u0000 Modern computing platforms used in data centers or harsh environment platforms would be exposed to sustained high temperatures over an extended period of time. Thermal interface materials are extensively used to transport heat from the die surfaces to the Cu-heat spreader. The TIM interface may be exposed to compression in addition to thermal mismatch during power cycling and environmental temperature cycling. Failure of the interface may be a precursor of system failure owing to the subsequent temperature rise. Reliability assurance in the use case scenario requires a fundamental understanding of the interface’s robustness and evolution under operational loads. In this study, the TIM-Cu interfaces were subjected to high temperatures prior to measuring the interface’s critical stress intensity factors. Four-point bend specimens were fabricated and subjected to sustained high temperatures for 15 days, 30 days, 45 days, 60 days, 90 days, and 120 days at temperatures of 100°C, and 150°C. Tests were conducted to determine interfacial delamination of the sample specimen and identify the critical steady-state energy release rates. A digital image correlation approach was also employed to comprehend the progression of crack growth and the crack tip opening displacement (CTOD) to assess the deterioration of various TIM interfaces at various aging durations.","PeriodicalId":117260,"journal":{"name":"ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120945752","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Liquid Cooling Practice on Meta’s AI Training Platform Meta人工智能训练平台的液冷练习

ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Pub Date : 2022-10-25 DOI: 10.1115/ipack2022-96972

Cheng Chen, Noman Mithani, Tiffany Jin, Allen Guo

{"title":"Liquid Cooling Practice on Meta’s AI Training Platform","authors":"Cheng Chen, Noman Mithani, Tiffany Jin, Allen Guo","doi":"10.1115/ipack2022-96972","DOIUrl":"https://doi.org/10.1115/ipack2022-96972","url":null,"abstract":"\u0000 Due to continuous growth of AI accelerator chip power and heat flux, implementation of advanced cooling technologies for AI platforms seems to be inevitable for hyper scale users. Liquid cooling is one of the relatively more mature category of advanced cooling technologies, and has been adopted in a variety of forms across industry. However, not all liquid cooling solutions are able to deliver high performance with reasonable cost and efficiency. In addition, it’s not straightforward to arrive at proper balance of performance, reliability, serviceability, and scalability for a product, and prepare the facility accordingly to align with long term strategy.\u0000 In this presentation, we will introduce a passive cold plate loop solution (Tide 1.0), based on Meta’s AI training platform (Zion) with eight Open Accelerator Modules (OAM). It reflects the design considerations on performance and serviceability. Thermal simulation and optimization studies will be presented. The solution was tested on dummy thermal test vehicles and real functional system, along with cooling capability forecast. Results showed a good match between simulation, TTV test and real system test. The resulting performance demonstrated strong use case of liquid cooling solutions on upcoming AI platforms.","PeriodicalId":117260,"journal":{"name":"ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems","volume":"283 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116229952","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0