2020 IEEE 33rd International System-on-Chip Conference (SOCC)最新文献

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2020 Technical Program Committee 2020年技术计划委员会
2020 IEEE 33rd International System-on-Chip Conference (SOCC) Pub Date : 2020-09-08 DOI: 10.1109/socc49529.2020.9524772
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引用次数: 0
Evolution of Embedded Platform Security Technologies: Past, Present & Future Challenges 嵌入式平台安全技术的演变:过去、现在和未来的挑战
2020 IEEE 33rd International System-on-Chip Conference (SOCC) Pub Date : 2020-07-01 DOI: 10.1109/socc49529.2020.9524778
F. Siddiqui, S. Sezer
{"title":"Evolution of Embedded Platform Security Technologies: Past, Present & Future Challenges","authors":"F. Siddiqui, S. Sezer","doi":"10.1109/socc49529.2020.9524778","DOIUrl":"https://doi.org/10.1109/socc49529.2020.9524778","url":null,"abstract":"In recent years, the proliferation of intelligent embedded technologies is opening venues to new service and computing models, providing diverse socio-economic benefits. These intelligent technologies are giving rise to a wide range of public and private applications by sharing and analysing generated data. This includes smart home, smart health, smart city, autonomous vehicles, smart grid and smart manufacturing etc. However, where this sharing of data brings benefits and opportunities, it simultaneously presents security risks and challenges. The realisation and prototyping of such technologies require a computing hardware widely available in the form of an embedded platform. The security perimeter and the attack surface of these platforms rely on their supported security and defence mechanisms. This paper aims to build a body-of-knowledge in this area for the security research community. It present the state-of-the-art security frameworks and architectures, discuss architectural shortcomings and root-causes of leading security technologies rather than discussing vulnerabilities and attacks. The paper concludes advocating secure-by-design platform approach and classifying platform security methods to realise robust embedded platform security architecture.","PeriodicalId":114740,"journal":{"name":"2020 IEEE 33rd International System-on-Chip Conference (SOCC)","volume":"193 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133760150","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Welcome Message from the General Chairs 主席的欢迎辞
2020 IEEE 33rd International System-on-Chip Conference (SOCC) Pub Date : 2020-02-01 DOI: 10.1109/bci48061.2020.9061614
Youmin Zhang, Antonios Tzes
{"title":"Welcome Message from the General Chairs","authors":"Youmin Zhang, Antonios Tzes","doi":"10.1109/bci48061.2020.9061614","DOIUrl":"https://doi.org/10.1109/bci48061.2020.9061614","url":null,"abstract":"We would have wished to begin our foreword by welcoming you to beautiful Lake Como, Italy, where the conference was intended to take place. However, due to the pandemic of coronavirus, the in-presence event had to be cancelled. Nevertheless, we decided to replace it with a live event that, albeit attended remotely via conference tools, preserves and fosters as much as possible the interaction and sense of community that characterizes in-presence events in general, and SECON in particular.","PeriodicalId":114740,"journal":{"name":"2020 IEEE 33rd International System-on-Chip Conference (SOCC)","volume":"130 ","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120863235","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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