2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)最新文献

Reliability Analysis of Wireless Power Transfer for Electric Vehicle Charging based on Continuous Markov Process 基于连续马尔可夫过程的电动汽车无线充电可靠性分析

2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) Pub Date : 2023-02-01 DOI: 10.1109/3D-PEIM55914.2023.10052353

Milad Behnamfar, Md. Abu Taher, Alexis Polowsky, Sukanta Roy, Mohd Tariq, A. Sarwat

引用次数: 0

Low-Frequency Power Telemetry Using Multiferroic Laminate Heterostructures 利用多铁层合异质结构进行低频功率遥测

2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) Pub Date : 2023-02-01 DOI: 10.1109/3D-PEIM55914.2023.10052239

Veeru Jaiswal, Pawan Gaire, S. Bhardwaj, A. Hassan, J. Volakis, P. Raj

引用次数: 0

Reticular Graphene Reinforced Copper for Electromagnetic Shielding Application 用于电磁屏蔽的网状石墨烯增强铜

2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) Pub Date : 2023-02-01 DOI: 10.1109/3D-PEIM55914.2023.10052591

Ambreen Nisar, Ghaleb Al Duhni, Cheng Zhang, P. Raj, Arvind Agarwal

引用次数: 0

Power Systems on Chiplet: Inductor-Linked Multi-Output Switched-Capacitor Multi-Rail Power Delivery on Chiplets 小晶片上的电力系统:电感连接的多输出开关电容器小晶片上的多轨电力输送

2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) Pub Date : 2023-02-01 DOI: 10.1109/3D-PEIM55914.2023.10052630

Mian Liao, Daniel H. Zhou, P. Wang, Minjie Chen

引用次数: 0

Laser-induced graphene supercapacitors on flex substrates for package-integrated power supply 用于封装集成电源的柔性基板激光诱导石墨烯超级电容器

2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) Pub Date : 2023-02-01 DOI: 10.1109/3D-PEIM55914.2023.10052332

Reshmi Banerjee, A. Chowdhury, Pavar Sai Kumar, Chunlei Wang, S. Goel, P. Raj

引用次数: 2

Inverter/converter power density and flexibility improvements through modularity and novel thermal management architecture 通过模块化和新颖的热管理架构提高逆变器/转换器的功率密度和灵活性

2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) Pub Date : 2023-02-01 DOI: 10.1109/3D-PEIM55914.2023.10052206

Ian Byers, Stuart N. Wooters

引用次数: 0

Design Considerations for 48-V VRM: Architecture, Magnetics, and Performance Tradeoffs 48v VRM的设计注意事项:架构、磁性和性能权衡

2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) Pub Date : 2023-02-01 DOI: 10.1109/3D-PEIM55914.2023.10052608

Minjie Chen, Shuai Jiang, J. Cobos, Brad Lehman

引用次数: 0

Wide Band Gap Semiconductor Devices for Power Electronic Converters 用于电力电子变换器的宽带隙半导体器件

2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) Pub Date : 2023-02-01 DOI: 10.1109/3D-PEIM55914.2023.10052586

S. M. S. H. Rafin, Roni Ahmed, O. Mohammed

{"title":"Wide Band Gap Semiconductor Devices for Power Electronic Converters","authors":"S. M. S. H. Rafin, Roni Ahmed, O. Mohammed","doi":"10.1109/3D-PEIM55914.2023.10052586","DOIUrl":"https://doi.org/10.1109/3D-PEIM55914.2023.10052586","url":null,"abstract":"Wide Band Gap (WBG) semiconductors provide superior material qualities that could allow for the functioning of prospective power devices at higher temperatures, voltages, and switching rates than is now possible with Si technology. However, Si is reaching its limits, and as a result, Si-based semiconductors have restricted voltage blocking, limited heat transmission, limited efficiency, and limited maximum junction temperature. Wide-band gap materials like Silicon Carbide (SiC) and Gallium Nitride (GaN) have recently been used to construct power semiconductor devices. The development of new power converters and the significant improvement in the performance of current ones will be made possible using these new power semiconductor devices, resulting in an improvement in the efficiency of the electric energy transformations and more intelligent use of the electric energy. Due to their exceptional qualities, commercial availability of starting material, and maturity of their technological processes, SiC and GaN are now the more promising semiconductor materials for these new power devices. The introduction of these novel components in the converter has several ramifications that must be understood to fully profit from these devices. This study serves as a review that enumerates the traits and advancement of contemporary GaN and SiC power devices and assesses the condition of the research, and projects the future of semiconductor device applications. The issues and difficulties with GaN and SiC devices are also covered.","PeriodicalId":106578,"journal":{"name":"2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)","volume":"385 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122842296","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Laminate-Embedded Multimodal Energy Harvester for Multilevel Power Supply 用于多级电源的层压板嵌入式多模态能量采集器

2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) Pub Date : 2023-02-01 DOI: 10.1109/3D-PEIM55914.2023.10052323

Jorge A. Caripidis Troccola, Sweta Gupta, Maxence Carvalho, S. B. Venkatakrishnan, P. Raj, J. Volakis

{"title":"Laminate-Embedded Multimodal Energy Harvester for Multilevel Power Supply","authors":"Jorge A. Caripidis Troccola, Sweta Gupta, Maxence Carvalho, S. B. Venkatakrishnan, P. Raj, J. Volakis","doi":"10.1109/3D-PEIM55914.2023.10052323","DOIUrl":"https://doi.org/10.1109/3D-PEIM55914.2023.10052323","url":null,"abstract":"A unique, multimodal 3D power packaging concept for simultaneous energy harvesting from RF, Solar, and TEG is proposed and demonstrated. The key innovations are five-fold: 1) 3D vertical stacking with substrate-embedding of RF and solar-TEG module assembly to achieve high power from TEG, while also reducing the overall module thickness. 2) High-gain linear antenna arrays for RF power harvesting. 3) Remateable clamped fuzz-button assembly from the module to the panel for easy removal and re-assembly by the operator, giving modularity and reparability to the stack. 4) Simultaneous 48 V and 1.5 V harvesting. By simultaneously harvesting multi-voltage domains, the power supply architecture can be simplified by selectively eliminating certain voltage converters. 5) Glass encasing for increased thermal gradient and output power. The 3D and embedded technology are scalable to both high power grid and low power wearable and IoT applications, integrated with other harvesting modes from RF, making it an innovative platform for power harvesting.","PeriodicalId":106578,"journal":{"name":"2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)","volume":"186 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116514389","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

New Design Concepts for PCB-Integration Technology in Power Electronics reducing Circuit Parasitics to a Minimum 电力电子中pcb集成技术的新设计概念，将电路寄生降到最低

2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) Pub Date : 2023-02-01 DOI: 10.1109/3D-PEIM55914.2023.10052616

Rando Raßmann, Jasper Schnack, Knud Gripp, Ulf Schümann

{"title":"New Design Concepts for PCB-Integration Technology in Power Electronics reducing Circuit Parasitics to a Minimum","authors":"Rando Raßmann, Jasper Schnack, Knud Gripp, Ulf Schümann","doi":"10.1109/3D-PEIM55914.2023.10052616","DOIUrl":"https://doi.org/10.1109/3D-PEIM55914.2023.10052616","url":null,"abstract":"With the introduction of fast switching wide-bandgap (WBG) power semiconductors, the focus in the development of power modules has increasingly been shifted to reducing parasitic elements. To fully use the advantages of WBG power semiconductors, the relevant parasitic elements within the power modules must be minimized. Due to the limited degrees of freedom in the design, the parasitic elements in conventional power module structures can’t be further reduced. Consequently, new structures for power module designs and new solutions for the assembly and connection technology must be developed. Multi-layer, three-dimensional (3-D) structures are suggested for fast switching power semiconductors. Due to the 3-D structure new degrees of freedom in the module design can be used. This allows to reduce parasitic elements with new design and connection concepts. This paper presents design guidelines for 3-D power modules based on printed circuit boards (PCBs). By using PCB manufacturing technologies, a multi-layer, 3-D power module is developed. The proposed module structure does not require any bond wires in the power loop. To verify the advantages of the presented design, the module is assembled, measured, and compared with a simplified 3-D power module.","PeriodicalId":106578,"journal":{"name":"2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124647077","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0