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adhesion ADHESIVES + SEALANTS最新文献

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Trends and Events 趋势和事件
adhesion ADHESIVES + SEALANTS Pub Date : 2022-11-25 DOI: 10.1007/s35784-022-0905-6
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引用次数: 0
High-Adhesion Silicone Gels for Wound Care with Less Pain 高黏附性有机硅凝胶用于伤口护理，减轻疼痛
adhesion ADHESIVES + SEALANTS Pub Date : 2022-11-25 DOI: 10.1007/s35784-022-0900-y
Thomas Gröer, Andrea Bogner
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引用次数: 0
With Polysiloxane-Epoxy Copolymers towards Flexible Electronics 用聚硅氧烷-环氧共聚物制备柔性电子器件
adhesion ADHESIVES + SEALANTS Pub Date : 2022-11-25 DOI: 10.1007/s35784-022-0901-x
Jaclyn Balthasar, Torsten Lubenow,  Andreas Funck,  Stephan Sprenger
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引用次数: 0
Products 产品
adhesion ADHESIVES + SEALANTS Pub Date : 2022-11-25 DOI: 10.1007/s35784-022-0904-7
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引用次数: 0
Laboratory Automation for New Adhesive Formulations 新粘合剂配方的实验室自动化
adhesion ADHESIVES + SEALANTS Pub Date : 2022-11-25 DOI: 10.1007/s35784-022-0903-8
Füll Lab Automation GmbH
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引用次数: 0
Robots in the Lab 实验室里的机器人
adhesion ADHESIVES + SEALANTS Pub Date : 2022-11-25 DOI: 10.1007/s35784-022-0906-5
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引用次数: 0
Trends and Events 趋势和事件
adhesion ADHESIVES + SEALANTS Pub Date : 2022-08-24 DOI: 10.1007/s35784-022-0395-6
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引用次数: 0
Adhesive Safety Evaluation by Holistic Fracture Analysis 用整体断裂分析法评价胶粘剂的安全性
adhesion ADHESIVES + SEALANTS Pub Date : 2022-08-24 DOI: 10.1007/s35784-022-0394-7
Martin Brandtner-Hafner
{"title":"Adhesive Safety Evaluation by Holistic Fracture Analysis","authors":"Martin Brandtner-Hafner","doi":"10.1007/s35784-022-0394-7","DOIUrl":"10.1007/s35784-022-0394-7","url":null,"abstract":"","PeriodicalId":100026,"journal":{"name":"adhesion ADHESIVES + SEALANTS","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2022-08-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"50045243","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
New Editor-In-Chief of adhesion 附着力新主编
adhesion ADHESIVES + SEALANTS Pub Date : 2022-08-24 DOI: 10.1007/s35784-022-0393-8
{"title":"New Editor-In-Chief of adhesion","authors":"","doi":"10.1007/s35784-022-0393-8","DOIUrl":"10.1007/s35784-022-0393-8","url":null,"abstract":"","PeriodicalId":100026,"journal":{"name":"adhesion ADHESIVES + SEALANTS","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2022-08-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"50044828","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Resource Efficiency in Electronics Manufacturing 电子制造业的资源效率
adhesion ADHESIVES + SEALANTS Pub Date : 2022-08-24 DOI: 10.1007/s35784-022-0392-9
Karin Steinmetzer, Sebastian Piller, Sebastian Schmitt
{"title":"Resource Efficiency in Electronics Manufacturing","authors":"Karin Steinmetzer, Sebastian Piller, Sebastian Schmitt","doi":"10.1007/s35784-022-0392-9","DOIUrl":"10.1007/s35784-022-0392-9","url":null,"abstract":"","PeriodicalId":100026,"journal":{"name":"adhesion ADHESIVES + SEALANTS","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2022-08-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"50045244","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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