British Polymer Journal最新文献_第6页

Understanding enzymes, 2nd edition. By T. Palmer, Ellis Horwood, Chichester, 1985. pp. 411, price £33.00, $42.90 (hardback), ISBN 0-85312-873-1; £13.75, (softback), ISBN 0-85312-874-X 理解酶，第二版。埃利斯·霍伍德，t·帕尔默著，奇切斯特，1985年。第411页，售价33.00英镑，42.90美元(精装本)，ISBN 0-85312-873-1;13.75英镑，(平装本)，ISBN 0-85312-874-X

British Polymer Journal Pub Date : 1986-09-01 DOI: 10.1002/PI.4980180523

J. Kennedy, C. White

引用次数: 0

Developments in Epoxies 环氧树脂的发展

British Polymer Journal Pub Date : 1986-09-01 DOI: 10.1002/PI.4980180502

W. W. Wright

引用次数: 0

Hygrothermal Aging Effects in Cured Epoxies 固化环氧树脂的湿热老化效应

British Polymer Journal Pub Date : 1986-09-01 DOI: 10.1002/PI.4980180505

J. A. Barrie, H. Rudd, P. Sagoo, P. Johncock

引用次数: 3

Structure and Properties Relationships of Epoxy Resins Part 1: Crosslink Density of Cured Resin: (II) Model Networks Properties 环氧树脂的结构和性能关系第1部分:固化树脂的交联密度;(II)模型网络的性能

British Polymer Journal Pub Date : 1986-09-01 DOI: 10.1002/PI.4980180508

C. H. Lau, K. Hodd, W. W. Wright

{"title":"Structure and Properties Relationships of Epoxy Resins Part 1: Crosslink Density of Cured Resin: (II) Model Networks Properties","authors":"C. H. Lau, K. Hodd, W. W. Wright","doi":"10.1002/PI.4980180508","DOIUrl":"https://doi.org/10.1002/PI.4980180508","url":null,"abstract":"Carefully designed resin precursors of high purity, viz. N,N-bis-(2,3-epoxypropyl)-N',N-dimethyl-4,4′-diaminodiphenylenemethane (G2A) and N,N-bis-(2,3-epoxypropyl)-N,N-dimethyl-4,4′-diamino-diphenylenemethane (G2S) were used in combination with N,N,N',N-tetrakis-(2,3-epoxypropyl)-4,4′-diaminodiphenylene methane, TGDDM, and cured with stoichiometric amounts of 4,4′-diamino-diphenylene methane (DDM) to produce networks with a range of controlled crosslink density. The tensile moduli E of the networks in the rubbery state, at Tg+30°C, Tg+45°C and Tg+60°C, were measured using a thermal mechanical analyser. Using the statistical theory of rubber elasticity and the observed values of E, the number average molecular weights between crosslink points Mc for the cured resins were deduced. The experimental Mc values were then compared with those derived by calculations based on a probabilistic model of the network proposed by Chu and Seferis.1 The experimental Mc values were 2.5 to 5.5 times larger than the calculated ones. The differences were attributable to a consumption of only 40% of the available secondary amino hydrogen via epoxy-amine reaction. A direct relationship was established between the glass transition temperature and the crosslink density 1/Mc for the resins, and the dynamic mechanical properties were studied. The thermal stability of cured resins studied by thermo-gravimetric analysis indicated an enhancement of stability as 1/Mc was reduced. The amount of water absorbed by cured resin was directly proportional to 1/Mc.","PeriodicalId":9298,"journal":{"name":"British Polymer Journal","volume":"40 1","pages":"316-322"},"PeriodicalIF":0.0,"publicationDate":"1986-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90181795","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 19

Epoxy resins and composites II (Advances in polymer science, Volume 75). Edited by K. Dusek, Springer‐Verlag, Berlin, Heidelberg, 1986. pp. xiii+l80, price DM 118.00. ISBN 3‐540‐15825‐1

British Polymer Journal Pub Date : 1986-09-01 DOI: 10.1002/PI.4980180514

W. Wright

引用次数: 8

Investigation and Development of Epoxy Foams 环氧泡沫材料的研究与发展

British Polymer Journal Pub Date : 1986-09-01 DOI: 10.1002/PI.4980180506

Mike Hajimichael, A. Lewis, Dave Scholey, C. Simmonds

{"title":"Investigation and Development of Epoxy Foams","authors":"Mike Hajimichael, A. Lewis, Dave Scholey, C. Simmonds","doi":"10.1002/PI.4980180506","DOIUrl":"https://doi.org/10.1002/PI.4980180506","url":null,"abstract":"The development of low toxicity rigid epoxy foams as an alternative to polyurethane foams for electronics encapsulation is described. The basic foam components - epoxy resin, hardener, accelerator, blowing agent and surfactant - are blended to form a two part system which is mixed and foamed when required. Each foam component is selected for its contribution to the foaming reaction and the final foam properties. The balance of component miscibility, viscosity, reaction rate and exotherm determine foam quality. Foam properties are affected by (1) density (2) cell structure and (3) the molecular structure of the reactants. Initial foam development utilised epoxy/amine chemistry and produced two foams, Feldex F3 and F4. Subsequently, use of a more reactive polymercaptan hardener improved foam strength and process times, resulting in Feldex F5 and F6 which have been used successfully to prepare quality mouldings and encapsulated electronics. Recently, development has been extended to new areas of application, e.g. high temperature foams. The mechanical, electrical, thermal and chemical properties of the best epoxy foams have been evaluated; selected results are reported. The epoxy foams developed offer low density, high strength, low dielectric constant and loss tangent, high volume resistivity, good thermal insulation, low corrosivity and low toxicity. In addition, epoxy foams soften in acetone, an advantage over their polyurethane counterparts since encapsulated electronics may be retrieved without employing corrosive solvents. (Feldex is a registered trade mark of THORN EMI Electronics.)","PeriodicalId":9298,"journal":{"name":"British Polymer Journal","volume":"41 1","pages":"307-311"},"PeriodicalIF":0.0,"publicationDate":"1986-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88444311","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Recent Advances with Glycidylamine Resins 缩水甘油胺树脂的研究进展

British Polymer Journal Pub Date : 1986-09-01 DOI: 10.1002/PI.4980180503

M. R. Thoseby, B. Dobinson, Christopher H. Bull

引用次数: 6

Some effects of structure, composition and cure on the water absorption and glass transition temperature of amine-cured epoxies 胺固化环氧树脂的结构、组成和固化对其吸水性和玻璃化转变温度的影响

British Polymer Journal Pub Date : 1986-09-01 DOI: 10.1002/PI.4980180504

P. Johncock, G. Tudgey

{"title":"Some effects of structure, composition and cure on the water absorption and glass transition temperature of amine-cured epoxies","authors":"P. Johncock, G. Tudgey","doi":"10.1002/PI.4980180504","DOIUrl":"https://doi.org/10.1002/PI.4980180504","url":null,"abstract":"The effect of structure, composition, and cure on the water absorption and Tg of amine-cured epoxies was investigated. Water absorption is considered to depend on the polar group concentration and type, and on the amount of free volume in the polymer network. The contribution of polar groups in terms of their hydrogen bonding capabilities is reflected by the effect of meta (with respect to the diglycidylamino group) chloro, bromo, and methyl substituents on the water absorption of bis[N,N-bis(2,3-epoxypropyl)-4-aminophenyl]methane cured with 4,4′-diaminodiphenylsulphone. The observed water absorptions are in line with the expected electronic effects of the substituents on the basicity of the amine group. Substituents in the ortho position adversely affect the hydrogen bonding capability of the amine group and limit the extent of reaction by steric interference. Examination of four O-glycidyl systems (Epon 825, Epon 1153/114, Epon 1031, and Dow XD-7342) cured with 4,4′-diaminodiphenylsulphone has revealed quite a good linear relationship between the equilibrium water absorption and Tg for a particular hardener concentration irrespective of the epoxy compound employed. Networks ranged from those of low Tg (110°C) and water absorption (1.3%) to those of high values (300°C and 6.1%) for these parameters. Differences in slope for low (50-65%) and high (100%) stoichiometric amounts of hardener are attributed to differences in the relative importance of OH/epoxy and NH2 or NH/epoxy reactions. The theoretical polar group concentrations and polar group type are much the same for these different systems and thus, free volume is considered to be a function of Tg and to play an important part in determining the level of water absorption.","PeriodicalId":9298,"journal":{"name":"British Polymer Journal","volume":"51 1","pages":"292-302"},"PeriodicalIF":0.0,"publicationDate":"1986-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80967312","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 44

Adhesives, sealants, and coatings for the electronics industry. By E. W. Flick, Noyes Publications, New Jersey, 1986. pp. xviii+197, price $39.00. ISBN 0-8155-1055-1 电子工业用粘合剂、密封剂和涂料。E. W. Flick著，新泽西Noyes出版社，1986年。第xviii+197页，价格39.00美元。ISBN 0-8155-1055-1

British Polymer Journal Pub Date : 1986-09-01 DOI: 10.1002/PI.4980180518

W. Wake

引用次数: 0

Rubber-modified thermoset resins. Edited by C. K. Riew and J. K. Gillham, ACS, Advances Chemistry Series No. 208, American Chemical Society, Washington, D.C., 1984. pp. xi + 372, price $89.95 (USA Canada), $107.95 (rest of world). ISBN 0-8412-0828-X 橡胶改性热固性树脂。C. K. view和J. K. Gillham编辑，ACS，先进化学系列第208期，美国化学学会，华盛顿特区，1984年。pp. xi + 372，价格89.95美元(美国加拿大)，107.95美元(世界其他地区)。ISBN 0 - 8412 - 0828 - x

British Polymer Journal Pub Date : 1986-07-01 DOI: 10.1002/PI.4980180425

W. Wright

引用次数: 0