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2023 IEEE Symposium on VLSI Technology and Circuits最新文献

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A Wireless Neural Stimulator IC for Cortical Visual Prosthesis. 一种用于皮质视觉假体的无线神经刺激IC。
2023 IEEE Symposium on VLSI Technology and Circuits Pub Date : 2023-06-01 Epub Date: 2023-07-24 DOI: 10.23919/vlsitechnologyandcir57934.2023.10185375
Jungho Lee, Joseph Letner, Jongyup Lim, Yi Sun, Seokhyeon Jeong, Yejoong Kim, Beomseo Koo, Gabriele Atzeni, Jiawei Liao, Julianna Richie, Elena Della Valle, Paras Patel, Taekwang Jang, Cynthia Chestek, Jamie Phillips, James Weiland, Dennis Sylvester, Hun-Seok Kim, David Blaauw
{"title":"A Wireless Neural Stimulator IC for Cortical Visual Prosthesis.","authors":"Jungho Lee,&nbsp;Joseph Letner,&nbsp;Jongyup Lim,&nbsp;Yi Sun,&nbsp;Seokhyeon Jeong,&nbsp;Yejoong Kim,&nbsp;Beomseo Koo,&nbsp;Gabriele Atzeni,&nbsp;Jiawei Liao,&nbsp;Julianna Richie,&nbsp;Elena Della Valle,&nbsp;Paras Patel,&nbsp;Taekwang Jang,&nbsp;Cynthia Chestek,&nbsp;Jamie Phillips,&nbsp;James Weiland,&nbsp;Dennis Sylvester,&nbsp;Hun-Seok Kim,&nbsp;David Blaauw","doi":"10.23919/vlsitechnologyandcir57934.2023.10185375","DOIUrl":"10.23919/vlsitechnologyandcir57934.2023.10185375","url":null,"abstract":"<p><p>We propose a 0.25 × 0.25 × 0.3 mm (~0.02 mm<sup>3</sup>) optically powered mote for visual cortex stimulation to restore vision. Up to 1024 implanted motes can be individually addressed. The complete StiMote system was confirmed fully functional when optically powered and cortex stimulation was confirmed in-vivo with a live rat brain.</p>","PeriodicalId":72034,"journal":{"name":"2023 IEEE Symposium on VLSI Technology and Circuits","volume":"2023 ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10566303/pdf/nihms-1934536.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"41221519","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Wireless, Mechanically Flexible, 25μm-Thick, 65,536-Channel Subdural Surface Recording and Stimulating Microelectrode Array with Integrated Antennas. 一种具有集成天线的无线、机械柔性、厚25μm、65,536通道硬膜下表面记录和刺激微电极阵列。
2023 IEEE Symposium on VLSI Technology and Circuits Pub Date : 2023-06-01 DOI: 10.23919/vlsitechnologyandcir57934.2023.10185321
Nanyu Zeng, Taesung Jung, Mohit Sharma, Guy Eichler, Jason Fabbri, R James Cotton, Eleonora Spinazzi, Brett Youngerman, Luca Carloni, Kenneth L Shepard
{"title":"A Wireless, Mechanically Flexible, 25μm-Thick, 65,536-Channel Subdural Surface Recording and Stimulating Microelectrode Array with Integrated Antennas.","authors":"Nanyu Zeng,&nbsp;Taesung Jung,&nbsp;Mohit Sharma,&nbsp;Guy Eichler,&nbsp;Jason Fabbri,&nbsp;R James Cotton,&nbsp;Eleonora Spinazzi,&nbsp;Brett Youngerman,&nbsp;Luca Carloni,&nbsp;Kenneth L Shepard","doi":"10.23919/vlsitechnologyandcir57934.2023.10185321","DOIUrl":"https://doi.org/10.23919/vlsitechnologyandcir57934.2023.10185321","url":null,"abstract":"<p><p>This paper presents a fully wireless microelectrode array (MEA) system-on-chip (SoC) with 65,536 electrodes for non-penetrative cortical recording and stimulation, featuring a total sensing area of 6.8mm×7.4mm with a 26.5μm×29μm electrode pitch. Sensing, data telemetry, and powering are monolithically integrated on a single chip, which is made mechanically flexible to conform to the surface of the brain by substrate removal to a total thickness of 25μm allowing it to be contained entirely in the subdural space under the skull.</p>","PeriodicalId":72034,"journal":{"name":"2023 IEEE Symposium on VLSI Technology and Circuits","volume":"2023 ","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10478373/pdf/nihms-1915830.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"10541237","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), Honolulu, HI, USA, June 12-17, 2022 IEEE VLSI技术和电路研讨会(VLSI技术和电路2022)，檀香山，HI, USA, 6月12日至17日，2022
2023 IEEE Symposium on VLSI Technology and Circuits Pub Date : 2022-01-01 DOI: 10.1109/VLSITechnologyandCir46769.2022
{"title":"IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), Honolulu, HI, USA, June 12-17, 2022","authors":"","doi":"10.1109/VLSITechnologyandCir46769.2022","DOIUrl":"https://doi.org/10.1109/VLSITechnologyandCir46769.2022","url":null,"abstract":"","PeriodicalId":72034,"journal":{"name":"2023 IEEE Symposium on VLSI Technology and Circuits","volume":"119 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91396415","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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