Nanyu Zeng, Taesung Jung, Mohit Sharma, Guy Eichler, Jason Fabbri, R James Cotton, Eleonora Spinazzi, Brett Youngerman, Luca Carloni, Kenneth L Shepard
{"title":"一种具有集成天线的无线、机械柔性、厚25μm、65,536通道硬膜下表面记录和刺激微电极阵列。","authors":"Nanyu Zeng, Taesung Jung, Mohit Sharma, Guy Eichler, Jason Fabbri, R James Cotton, Eleonora Spinazzi, Brett Youngerman, Luca Carloni, Kenneth L Shepard","doi":"10.23919/vlsitechnologyandcir57934.2023.10185321","DOIUrl":null,"url":null,"abstract":"<p><p>This paper presents a fully wireless microelectrode array (MEA) system-on-chip (SoC) with 65,536 electrodes for non-penetrative cortical recording and stimulation, featuring a total sensing area of 6.8mm×7.4mm with a 26.5μm×29μm electrode pitch. Sensing, data telemetry, and powering are monolithically integrated on a single chip, which is made mechanically flexible to conform to the surface of the brain by substrate removal to a total thickness of 25μm allowing it to be contained entirely in the subdural space under the skull.</p>","PeriodicalId":72034,"journal":{"name":"2023 IEEE Symposium on VLSI Technology and Circuits","volume":"2023 ","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2023-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10478373/pdf/nihms-1915830.pdf","citationCount":"0","resultStr":"{\"title\":\"A Wireless, Mechanically Flexible, 25μm-Thick, 65,536-Channel Subdural Surface Recording and Stimulating Microelectrode Array with Integrated Antennas.\",\"authors\":\"Nanyu Zeng, Taesung Jung, Mohit Sharma, Guy Eichler, Jason Fabbri, R James Cotton, Eleonora Spinazzi, Brett Youngerman, Luca Carloni, Kenneth L Shepard\",\"doi\":\"10.23919/vlsitechnologyandcir57934.2023.10185321\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p><p>This paper presents a fully wireless microelectrode array (MEA) system-on-chip (SoC) with 65,536 electrodes for non-penetrative cortical recording and stimulation, featuring a total sensing area of 6.8mm×7.4mm with a 26.5μm×29μm electrode pitch. Sensing, data telemetry, and powering are monolithically integrated on a single chip, which is made mechanically flexible to conform to the surface of the brain by substrate removal to a total thickness of 25μm allowing it to be contained entirely in the subdural space under the skull.</p>\",\"PeriodicalId\":72034,\"journal\":{\"name\":\"2023 IEEE Symposium on VLSI Technology and Circuits\",\"volume\":\"2023 \",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10478373/pdf/nihms-1915830.pdf\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2023 IEEE Symposium on VLSI Technology and Circuits\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/vlsitechnologyandcir57934.2023.10185321\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE Symposium on VLSI Technology and Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/vlsitechnologyandcir57934.2023.10185321","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A Wireless, Mechanically Flexible, 25μm-Thick, 65,536-Channel Subdural Surface Recording and Stimulating Microelectrode Array with Integrated Antennas.
This paper presents a fully wireless microelectrode array (MEA) system-on-chip (SoC) with 65,536 electrodes for non-penetrative cortical recording and stimulation, featuring a total sensing area of 6.8mm×7.4mm with a 26.5μm×29μm electrode pitch. Sensing, data telemetry, and powering are monolithically integrated on a single chip, which is made mechanically flexible to conform to the surface of the brain by substrate removal to a total thickness of 25μm allowing it to be contained entirely in the subdural space under the skull.
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