2018 International Flexible Electronics Technology Conference (IFETC)最新文献

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Printed Multifunctional Flexible Healthcare Patch 打印多功能柔性医疗贴片
2018 International Flexible Electronics Technology Conference (IFETC) Pub Date : 2018-08-01 DOI: 10.1109/IFETC.2018.8583894
K. Takei
{"title":"Printed Multifunctional Flexible Healthcare Patch","authors":"K. Takei","doi":"10.1109/IFETC.2018.8583894","DOIUrl":"https://doi.org/10.1109/IFETC.2018.8583894","url":null,"abstract":"Macroscale, multifunctional, flexible/stretchable devices are of great interest for the human-interactive applications including health monitoring as one of wearable device concepts. For the device applications, flexible sensor sheets directly attached onto skin may be a next class of wearable electronics to collect a variety of information from human body such as body temperature, electrocardiogram (ECG), aspiration, and chemical contents of glucose etc, which multiple information detections cannot be realized by a conventional watch-type wearable device. These multiple simultaneous condition detections allow it to predict the disease in advance by just attaching the sensor sheets. For moving forward to the future healthcare society, there are still a lot of issues and problems to address. The first important technology is how to realize disposal low-cost devices for considering hygiene issue due to direct attachment on skin like a bandage. Another is multiple functionalities to collect different conditions simultaneously to diagnose it. Based on these, realizing the low-cost multifunctional flexible healthcare patch is important advance not only for healthcare application [1], but also for internet of things (IoT) and trillion sensor concepts. This study demonstrates macroscale printing techniques and their flexible sensor sheet applications. Using printed strain [2–3], temperature [4–5], ultraviolet [6], and electrocardiogram (ECG) sensors [6–7], healthcare patch is presented to detect health conditions as well as human motion using printed flexible three-axis acceleration sensor [6,8]. In addition, although the study is still preliminary, high sensitive sweat chemical sensor is discussed for the future electronics [9]. Our studies focus on the low-cost multi-functional sensor components. To realize a practical sensor sheet, different components such as signal processing/wireless circuits and batteries are required to develop. Step-by-step developments and collaborations between different fields of researchers will be important to build a next generation electronics platform.","PeriodicalId":6609,"journal":{"name":"2018 International Flexible Electronics Technology Conference (IFETC)","volume":"10 1","pages":"1-1"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84016086","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Hybrid Systems-in-Foil - Combining Thin Chips with Large-Area Electronics 混合系统箔-结合薄芯片与大面积电子
2018 International Flexible Electronics Technology Conference (IFETC) Pub Date : 2018-08-01 DOI: 10.1109/IFETC.2018.8583909
J. Burghartz, G. Alavi, B. Albrecht, Thomad Deuble, Mourad Elsobky, S. Ferwana, C. Harendt, Y. Mahsereci, H. Richter, Zili Yu
{"title":"Hybrid Systems-in-Foil - Combining Thin Chips with Large-Area Electronics","authors":"J. Burghartz, G. Alavi, B. Albrecht, Thomad Deuble, Mourad Elsobky, S. Ferwana, C. Harendt, Y. Mahsereci, H. Richter, Zili Yu","doi":"10.1109/IFETC.2018.8583909","DOIUrl":"https://doi.org/10.1109/IFETC.2018.8583909","url":null,"abstract":"This paper reports on the status of a comprehensive ten-year research and development effort towards Hybrid System-in-Foil (HySiF). In HySiF, the merits of high-performance integrated circuits on ultra-thin chips and of large-area and discrete electronic component implementation are combined in a complementary fashion attached on or laminated in a flexible carrier substrate. HySiF paves the way to entirely new applications of electronic products where form factor, form adaptivity or form flexibility are key enablers. In this review paper the various aspects of thin-chip fabrication and embedding, device and circuit design under impact of unknown or variable mechanical stress, and the on- and off-chip implementation of sensor, actuator, microwave and energy supply components are discussed.","PeriodicalId":6609,"journal":{"name":"2018 International Flexible Electronics Technology Conference (IFETC)","volume":"35 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76006922","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
IFETC 2018 Copyright Page IFETC 2018版权页面
2018 International Flexible Electronics Technology Conference (IFETC) Pub Date : 2018-08-01 DOI: 10.1109/ifetc.2018.8583941
{"title":"IFETC 2018 Copyright Page","authors":"","doi":"10.1109/ifetc.2018.8583941","DOIUrl":"https://doi.org/10.1109/ifetc.2018.8583941","url":null,"abstract":"","PeriodicalId":6609,"journal":{"name":"2018 International Flexible Electronics Technology Conference (IFETC)","volume":"49 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81403814","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Surface Potential Based Compact Model for Thin Film Transistor 基于表面电位的薄膜晶体管紧凑模型
2018 International Flexible Electronics Technology Conference (IFETC) Pub Date : 2018-08-01 DOI: 10.1109/IFETC.2018.8583907
Ling Li
{"title":"Surface Potential Based Compact Model for Thin Film Transistor","authors":"Ling Li","doi":"10.1109/IFETC.2018.8583907","DOIUrl":"https://doi.org/10.1109/IFETC.2018.8583907","url":null,"abstract":"Amorphous-InGaZnO (a-IGZO) TFTs are increasingly important for the circuit application, such as flexible display and transparent TFTs. Oxide semiconductor TFTs, such as a-IGZO TFTs, are expected to be a promising candidate constructing RFID tags [1] . A circuit friendly compact model of a-IGZO is therefore required. Due to the different charge transport mechanism, compact model for a-IGZO TFTs cannot directly use organic TFT or amorphous TFT model [2] .","PeriodicalId":6609,"journal":{"name":"2018 International Flexible Electronics Technology Conference (IFETC)","volume":"12 1","pages":"1-1"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75463554","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
3D Printed Flexible Coreless Transformers 3D打印柔性无芯变压器
2018 International Flexible Electronics Technology Conference (IFETC) Pub Date : 2018-08-01 DOI: 10.1109/IFETC.2018.8584017
Taeil Kim, Kevin Andrews, W. Kim
{"title":"3D Printed Flexible Coreless Transformers","authors":"Taeil Kim, Kevin Andrews, W. Kim","doi":"10.1109/IFETC.2018.8584017","DOIUrl":"https://doi.org/10.1109/IFETC.2018.8584017","url":null,"abstract":"This report presents 3D printed flexible coreless transformers, which can be used in RF band for various applications such as voltage conversion and impedance matching for maximizing power transfer. Two types of transformers composed of a pair of coil inductors with opposing and complementary windings were printed on flexible polyimide film by using a 3D printer. Behaviors of printed transformers were simulated with parameters such as mutual inductance, coupling factor, power gain with 3D transformer models. And then, inductance value were compared with measured one.","PeriodicalId":6609,"journal":{"name":"2018 International Flexible Electronics Technology Conference (IFETC)","volume":"389 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74936872","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Highly Robust Oxide Thin Film Transistors for Stretchable Electronics 用于可拉伸电子器件的高鲁棒氧化薄膜晶体管
2018 International Flexible Electronics Technology Conference (IFETC) Pub Date : 2018-08-01 DOI: 10.1109/IFETC.2018.8583949
M. Hasan, Jin Jang
{"title":"Highly Robust Oxide Thin Film Transistors for Stretchable Electronics","authors":"M. Hasan, Jin Jang","doi":"10.1109/IFETC.2018.8583949","DOIUrl":"https://doi.org/10.1109/IFETC.2018.8583949","url":null,"abstract":"We report the excellent stretchability of oxide TFT by attaching it on elastic PDMS substrate using double-sided PI tape. The device can be stretched by 50% elongation up to 1000 repeated cycles. The electrical resistance of Liquid metal electrode (LME) changed by 11 % after elongation from 5 to 7.5 cm. This technique can be used for the TFTs of stretchable electronics.","PeriodicalId":6609,"journal":{"name":"2018 International Flexible Electronics Technology Conference (IFETC)","volume":"36 1","pages":"1-3"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82968587","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A Versatile Low Temperature Curing Molecular Silver Ink Platform for Printed Electronics 用于印刷电子器件的多功能低温固化分子银墨水平台
2018 International Flexible Electronics Technology Conference (IFETC) Pub Date : 2018-08-01 DOI: 10.1109/IFETC.2018.8583881
Xiangyang Liu, A. Kell, C. Paquet, A. Lakhani, Olga Mozenson Thomas Lacelle, B. Deore, P. Malenfant
{"title":"A Versatile Low Temperature Curing Molecular Silver Ink Platform for Printed Electronics","authors":"Xiangyang Liu, A. Kell, C. Paquet, A. Lakhani, Olga Mozenson Thomas Lacelle, B. Deore, P. Malenfant","doi":"10.1109/IFETC.2018.8583881","DOIUrl":"https://doi.org/10.1109/IFETC.2018.8583881","url":null,"abstract":"The development and sale of conductive silver flake-based inks remains one of the most profitable areas within the printed electronics (PE) industry. However, the volatility of the silver market is a concern for conductive ink manufacturers, so cost effective alternatives that can minimize the amount of metal used to produce a functional trace are actively being investigated and developed in order decrease costs. Here we present a simple formulation containing a silver compound that provides a screen printable ink capable of producing traces with thicknesses under 1 micometer, linewidths as narrow as 42 μm separated by 38 μm and excellent electrical properties (22 μΩ·cm) following thermal sintering at temperatures of 120 °C on PET substrates. The molecular ink is also quite versatile, enabling the metallization of common textile threads and allowing their incorporation into applications where the threads can serve as wires to power LEDs driven by a wearable electronic platform. The silver traces derived from the silver ink also demonstrate impressive stretchability on both metalized latex/polyester threads and as printed traces on thermoplastic polyurethane (TPU) substrates, where the threads/traces remain conductive up to strains as high as 126%. The ability for the traces produced from the silver molecular ink to maintain conductivity as they are strained/stretched also enables their incorporation into structural and in-mold electronics applications, where conductive 3D traces can be produced through a simple thermoforming process. Together these results represent a significant advance for the PE industry","PeriodicalId":6609,"journal":{"name":"2018 International Flexible Electronics Technology Conference (IFETC)","volume":"10 1","pages":"1-1"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73135437","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Flexible LED Displays for Electronic Textiles 电子纺织品柔性LED显示屏
2018 International Flexible Electronics Technology Conference (IFETC) Pub Date : 2018-08-01 DOI: 10.1109/IFETC.2018.8583963
Wilson Hou-Sheng Huang, Yu-Chi Wang, Po‐Chun Hsu, Wei-Chung Wang, Alice Cavalier, T. Huang, Chien-Lung Shen
{"title":"Flexible LED Displays for Electronic Textiles","authors":"Wilson Hou-Sheng Huang, Yu-Chi Wang, Po‐Chun Hsu, Wei-Chung Wang, Alice Cavalier, T. Huang, Chien-Lung Shen","doi":"10.1109/IFETC.2018.8583963","DOIUrl":"https://doi.org/10.1109/IFETC.2018.8583963","url":null,"abstract":"Flexible electrical device is the next generation of wearable technological application direction. In this study, the integrating printed textile circuit board, FPCB (flexible printed circuit board), and lighting chips onto a fabric were applicable for display. The size of the conductive junction can be tremendously down to 1mm*1mm compared with the current buckle junction. This novel design of the printed electronics embedded textile technology leads the e-textile crossing to display system to a higher tendency of the flexible, stretchable and thin characteristic of textile.","PeriodicalId":6609,"journal":{"name":"2018 International Flexible Electronics Technology Conference (IFETC)","volume":"1 1","pages":"1-3"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77025377","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Stretchable Optical and Electronic Fibers via Thermal Drawing 热拉伸可拉伸光学和电子纤维
2018 International Flexible Electronics Technology Conference (IFETC) Pub Date : 2018-08-01 DOI: 10.1109/IFETC.2018.8583875
Y. Qu, T. Nguyen‐Dang, A. Page, Wei Yan, Tapajyoti Das Gupta, G. Rotaru, R. Rossi, V. Favrod, Nicola Bartolomei, F. Sorin
{"title":"Stretchable Optical and Electronic Fibers via Thermal Drawing","authors":"Y. Qu, T. Nguyen‐Dang, A. Page, Wei Yan, Tapajyoti Das Gupta, G. Rotaru, R. Rossi, V. Favrod, Nicola Bartolomei, F. Sorin","doi":"10.1109/IFETC.2018.8583875","DOIUrl":"https://doi.org/10.1109/IFETC.2018.8583875","url":null,"abstract":"Stretchable optical and electronic fibers constitute increasingly important building blocks for a myriad of emerging applications, such as smart textile, robotics, or medical implants. Yet, it remains challenging to fabricate efficient and advanced soft fiber-base devices in a simple and scalable way. Conventional fiber manufacturing methods, such as wet and dry spinning, or extrusion, are not well adapted to fabricate multi-material functional fibers. The preform-to-fiber thermal drawing technique on the other hand is an emerging powerful platform to fabricate multi-material fibers with complex architectures and functionalities. Thus far however, this fabrication approach has been restricted to rigid thermoplastic or glass fibers. In this contribution we will show how we could revisit the selection criteria for cladding materials compatible with the thermal drawing process. In particular, thanks to a deeper rheological characterization, we could identify thermoplastic elastomers that could be drawn from a solid preform at high viscosity. Subsequently, we will demonstrate that thermoplastics, metals, and conductive polymer composites could be co-drawn with prescribed architectures within thermoplastic elastomer cladding. This allowed us to successfully fabricate stretchable optical and electronic fibers that are used as precise and robust pressure and strain sensors, as well as soft and stretchable waveguides as we will show via concrete examples, the ability to thermally draw soft multi-material fibers open new opportunities not only for exploring new academic research directions, but also in industrializing fiber-based flexible and stretchable devices for applications in sensing, health care, robotics and smart textiles.","PeriodicalId":6609,"journal":{"name":"2018 International Flexible Electronics Technology Conference (IFETC)","volume":"80 1","pages":"1-1"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76043045","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Fabrication and Performance Evaluation of Carbon-based Stretchable RFID Tags on Textile Substrates 纺织基材上碳基可拉伸RFID标签的制备及性能评价
2018 International Flexible Electronics Technology Conference (IFETC) Pub Date : 2018-08-01 DOI: 10.1109/IFETC.2018.8583938
Han He, Xiaochen Chen, O. Mokhtari, H. Nishikawa, L. Ukkonen, J. Virkki
{"title":"Fabrication and Performance Evaluation of Carbon-based Stretchable RFID Tags on Textile Substrates","authors":"Han He, Xiaochen Chen, O. Mokhtari, H. Nishikawa, L. Ukkonen, J. Virkki","doi":"10.1109/IFETC.2018.8583938","DOIUrl":"https://doi.org/10.1109/IFETC.2018.8583938","url":null,"abstract":"We fabricate carbon-based stretchable antennas for passive UHF RFID tags. The tag antennas are created on a stretchable elastic band by brush-painting. In addition to wireless evaluation of the fabricated RFID tags before and after cyclic stretching, the properties of the novel carbon-based antenna material are studied. The wireless performance of the established RFID tags is compared to similar stretchable silver-based RFID tags. Based on the achieved results, the established carbon-based tag antennas do not perform in the same high level as the silver-based tag antennas but their read ranges of around 2 to 2.4 meters are suitable for versatile textile-integrated RFID applications. Stretching causes permanent decrease to the tag read range but they remain functional even after 100 stretching cycles. These preliminary results are very promising, considering the current trend towards more environmentally friendly and cost-effective materials in electronics.","PeriodicalId":6609,"journal":{"name":"2018 International Flexible Electronics Technology Conference (IFETC)","volume":"56 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2018-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"72648746","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
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