Components and Packaging for Laser Systems X最新文献

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High power triple clad fiber combiner and its application for the power scaling of 2.1 µm Ho3+-doped fiber lasers pumped at 1.9 µm 高功率三包层光纤合路器及其在 1.9 微米泵浦的 2.1 微米 Ho3+ 掺杂光纤激光器功率扩展中的应用
Components and Packaging for Laser Systems X Pub Date : 2024-03-12 DOI: 10.1117/12.3002237
N. Dalloz, C. Louot, Stefano Bigotta, T. Ibach, Thierry Robin, B. Cadier, A. Hildenbrand-Dhollande
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引用次数: 0
S2 mode content measurement of a 7+1 to 1 backward pump-signal combiner 7+1 至 1 后向泵信号组合器的 S2 模式内容测量
Components and Packaging for Laser Systems X Pub Date : 2024-03-12 DOI: 10.1117/12.3003085
Lalitkumar Bansal, R. Sienkowski, Christopher Neale, Joel Mann, Jeffrey W. Nicholson
{"title":"S2 mode content measurement of a 7+1 to 1 backward pump-signal combiner","authors":"Lalitkumar Bansal, R. Sienkowski, Christopher Neale, Joel Mann, Jeffrey W. Nicholson","doi":"10.1117/12.3003085","DOIUrl":"https://doi.org/10.1117/12.3003085","url":null,"abstract":"","PeriodicalId":517967,"journal":{"name":"Components and Packaging for Laser Systems X","volume":"114 7","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140394938","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Wavelength stabilized external cavity diode laser at 461 nm in hermetic 14-pin butterfly package 波长稳定的 461 nm 外腔二极管激光器,采用 14 针蝶形密封封装
Components and Packaging for Laser Systems X Pub Date : 2024-03-12 DOI: 10.1117/12.3002299
Daniel Brauda, Dennis Krug, Moritz von Sivers, H. Thiem, Markus Schütz, Alexander Bachmann, Miroslawa Malach, Björn Globisch
{"title":"Wavelength stabilized external cavity diode laser at 461 nm in hermetic 14-pin butterfly package","authors":"Daniel Brauda, Dennis Krug, Moritz von Sivers, H. Thiem, Markus Schütz, Alexander Bachmann, Miroslawa Malach, Björn Globisch","doi":"10.1117/12.3002299","DOIUrl":"https://doi.org/10.1117/12.3002299","url":null,"abstract":"","PeriodicalId":517967,"journal":{"name":"Components and Packaging for Laser Systems X","volume":"2 5","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140395962","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
High uniformity and high peak power 808nm QCW laser diode arrays 高均匀性和高峰值功率 808nm QCW 激光二极管阵列
Components and Packaging for Laser Systems X Pub Date : 2024-03-12 DOI: 10.1117/12.3003948
Wei Ma, Linwei Yang, Qiang Tang, JieRu Li, Zhenkun Yu, Xiaohua Chen, Michael Stoiber, Jens Biesenbach
{"title":"High uniformity and high peak power 808nm QCW laser diode arrays","authors":"Wei Ma, Linwei Yang, Qiang Tang, JieRu Li, Zhenkun Yu, Xiaohua Chen, Michael Stoiber, Jens Biesenbach","doi":"10.1117/12.3003948","DOIUrl":"https://doi.org/10.1117/12.3003948","url":null,"abstract":"","PeriodicalId":517967,"journal":{"name":"Components and Packaging for Laser Systems X","volume":"74 3","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140395553","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Novel fiber optic components for high efficiency fiber amplifiers 用于高效光纤放大器的新型光纤元件
Components and Packaging for Laser Systems X Pub Date : 2024-03-12 DOI: 10.1117/12.3003323
Chun He, Lei Gao, Yong Li, Kai Zhou, Xingsheng Liu
{"title":"Novel fiber optic components for high efficiency fiber amplifiers","authors":"Chun He, Lei Gao, Yong Li, Kai Zhou, Xingsheng Liu","doi":"10.1117/12.3003323","DOIUrl":"https://doi.org/10.1117/12.3003323","url":null,"abstract":"","PeriodicalId":517967,"journal":{"name":"Components and Packaging for Laser Systems X","volume":"99 s1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140395493","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Miniaturized external-cavity diode laser and tapered amplifier in hermetic 14-pin butterfly 微型外腔二极管激光器和锥形放大器封装在密封式 14 针蝶形激光器中
Components and Packaging for Laser Systems X Pub Date : 2024-03-12 DOI: 10.1117/12.3004656
Daniel Brauda, H. Thiem, Dennis Krug, Markus Schütz, Miroslawa Malach, Björn Globisch
{"title":"Miniaturized external-cavity diode laser and tapered amplifier in hermetic 14-pin butterfly","authors":"Daniel Brauda, H. Thiem, Dennis Krug, Markus Schütz, Miroslawa Malach, Björn Globisch","doi":"10.1117/12.3004656","DOIUrl":"https://doi.org/10.1117/12.3004656","url":null,"abstract":"","PeriodicalId":517967,"journal":{"name":"Components and Packaging for Laser Systems X","volume":"34 S137","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140395297","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Cutting-edge fused end fiber bundle technology for multi kW range applications 用于多千瓦范围应用的尖端熔端光纤束技术
Components and Packaging for Laser Systems X Pub Date : 2024-03-12 DOI: 10.1117/12.3000484
Kalvis Alps, Ivo Bruvers, Jurgis Grube, Martins Narels
{"title":"Cutting-edge fused end fiber bundle technology for multi kW range applications","authors":"Kalvis Alps, Ivo Bruvers, Jurgis Grube, Martins Narels","doi":"10.1117/12.3000484","DOIUrl":"https://doi.org/10.1117/12.3000484","url":null,"abstract":"","PeriodicalId":517967,"journal":{"name":"Components and Packaging for Laser Systems X","volume":"104 8","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140395689","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Hybrid semiconductor master-oscillator power-amplifiers with more than 5 W optical output power 光输出功率超过 5 W 的混合半导体主振荡器功率放大器
Components and Packaging for Laser Systems X Pub Date : 2024-03-12 DOI: 10.1117/12.3000836
G. Blume, A. Müller, P. Hildenstein, N. Werner, A. Maaßdorf, D. Feise, S. Kreutzmann, A. Ginolas, Alexander Sahm, B. Sumpf, Andrea C. Knigge, K. Paschke
{"title":"Hybrid semiconductor master-oscillator power-amplifiers with more than 5 W optical output power","authors":"G. Blume, A. Müller, P. Hildenstein, N. Werner, A. Maaßdorf, D. Feise, S. Kreutzmann, A. Ginolas, Alexander Sahm, B. Sumpf, Andrea C. Knigge, K. Paschke","doi":"10.1117/12.3000836","DOIUrl":"https://doi.org/10.1117/12.3000836","url":null,"abstract":"","PeriodicalId":517967,"journal":{"name":"Components and Packaging for Laser Systems X","volume":"112 6","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140395135","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Micro channel cooled single emitter housing 微通道冷却单发射器外壳
Components and Packaging for Laser Systems X Pub Date : 2024-03-12 DOI: 10.1117/12.3000061
J. Wiesend, Fabian Wagle, S. Lutter
{"title":"Micro channel cooled single emitter housing","authors":"J. Wiesend, Fabian Wagle, S. Lutter","doi":"10.1117/12.3000061","DOIUrl":"https://doi.org/10.1117/12.3000061","url":null,"abstract":"","PeriodicalId":517967,"journal":{"name":"Components and Packaging for Laser Systems X","volume":"50 12","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140284809","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
(6+1)x1 taper-fused side pump and signal combiner for kW-class fiber laser applications 用于千瓦级光纤激光器应用的 (6+1)x1 锥形熔丝侧泵浦和信号合路器
Components and Packaging for Laser Systems X Pub Date : 2024-03-12 DOI: 10.1117/12.3000135
Yin-Wen Lee, Yu-Ting Chen, Hsiao-Lung Tu, J. J. Liau, Po-Chin Hsu, Benson Shen
{"title":"(6+1)x1 taper-fused side pump and signal combiner for kW-class fiber laser applications","authors":"Yin-Wen Lee, Yu-Ting Chen, Hsiao-Lung Tu, J. J. Liau, Po-Chin Hsu, Benson Shen","doi":"10.1117/12.3000135","DOIUrl":"https://doi.org/10.1117/12.3000135","url":null,"abstract":"","PeriodicalId":517967,"journal":{"name":"Components and Packaging for Laser Systems X","volume":"120 22","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140284983","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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