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Informacije MIDEM - Journal of Microelectronics, Electronic Components and Materials最新文献

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Analysis and Mitigation of Negative Differential Resistance Effects with Hetero-gate Dielectric Layer in Negative-capacitance Field-effect Transistors 利用负电容场效应晶体管中的异质栅极电介质层分析和缓解负差分电阻效应
Informacije MIDEM - Journal of Microelectronics, Electronic Components and Materials Pub Date : 2024-04-11 DOI: 10.33180/infmidem2024.106
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引用次数: 0
Centimeter positioning accuracy in modern wireless cellular networks – wish or reality? 现代无线蜂窝网络的厘米级定位精度--愿望还是现实？
Informacije MIDEM - Journal of Microelectronics, Electronic Components and Materials Pub Date : 2024-03-03 DOI: 10.33180/infmidem2023.404
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引用次数: 0
Examination of Resistive Switching Energy of Some Nonlinear Dopant Drift Memristor Models 检验某些非线性掺杂漂移晶闸管模型的电阻开关能量
Informacije MIDEM - Journal of Microelectronics, Electronic Components and Materials Pub Date : 2024-03-03 DOI: 10.33180/infmidem2024.103
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引用次数: 0
The effect of firing conditions on the characteris-tics of thick-film resistors for temperature sensors 烧制条件对温度传感器厚膜电阻器特性的影响
Informacije MIDEM - Journal of Microelectronics, Electronic Components and Materials Pub Date : 2024-03-03 DOI: 10.33180/infmidem2024.102
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引用次数: 0
Delay Efficient Cosine Modulated Reconfigurable Filter Bank for Digital Hearing Aids targeting Noise Induced Hearing Loss 针对噪声性听力损失的数字助听器的延迟高效余弦调制可重构滤波器组
Informacije MIDEM - Journal of Microelectronics, Electronic Components and Materials Pub Date : 2024-03-03 DOI: 10.33180/infmidem2024.101
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引用次数: 0
Virtual Reference Tag Assisted Radio Frequency Identification Localization And Tracking Using Artificial Intellect Techniques In Indoor Environment 在室内环境中使用人工智能技术进行虚拟参考标签辅助射频识别定位和跟踪
Informacije MIDEM - Journal of Microelectronics, Electronic Components and Materials Pub Date : 2024-02-13 DOI: 10.33180/infmidem2023.401
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引用次数: 0
PPC-based wafer-level temporary bonding/ debonding triggered by microwave 微波触发的基于 PPC 的晶圆级临时粘接/剥离
Informacije MIDEM - Journal of Microelectronics, Electronic Components and Materials Pub Date : 2024-02-13 DOI: 10.33180/infmidem2023.402
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引用次数: 0
Linear Thermal Expansion of 0.5Ba(Zr0.2Ti0.8)O3-0.5(Ba0.7Ca0.3)TiO3 Bulk Ceramic 0.5Ba(Zr0.2Ti0.8)O3-0.5(Ba0.7Ca0.3)TiO3 块状陶瓷的线性热膨胀率
Informacije MIDEM - Journal of Microelectronics, Electronic Components and Materials Pub Date : 2024-02-13 DOI: 10.33180/infmidem2023.403
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引用次数: 0
PPC-based wafer-level temporary bonding/ debonding triggered by microwave 微波触发的基于 PPC 的晶圆级临时粘接/剥离
Informacije MIDEM - Journal of Microelectronics, Electronic Components and Materials Pub Date : 2024-02-13 DOI: 10.33180/infmidem2023.402
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引用次数: 0
Linear Thermal Expansion of 0.5Ba(Zr0.2Ti0.8)O3-0.5(Ba0.7Ca0.3)TiO3 Bulk Ceramic 0.5Ba(Zr0.2Ti0.8)O3-0.5(Ba0.7Ca0.3)TiO3 块状陶瓷的线性热膨胀率
Informacije MIDEM - Journal of Microelectronics, Electronic Components and Materials Pub Date : 2024-02-13 DOI: 10.33180/infmidem2023.403
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引用次数: 0
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