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Development of Transfer Bonding Sheet Using Copper Nanoparticles 纳米铜转移键合片的研制
Sumato Purosesu Gakkaishi Pub Date : 2023-09-10 DOI: 10.7791/jspmee.12.271
Kentaro MIYOSHI, Katsunori TAKADA, Hiroshi IGARASHI
{"title":"Development of Transfer Bonding Sheet Using Copper Nanoparticles","authors":"Kentaro MIYOSHI, Katsunori TAKADA, Hiroshi IGARASHI","doi":"10.7791/jspmee.12.271","DOIUrl":"https://doi.org/10.7791/jspmee.12.271","url":null,"abstract":"We have tech nology to manufacture copper nanoparticles by dry process. In this study, we investigated the basic characteristics of transfer bonding sheet using our copper nanoparticles with the goal of developing transfer bonding sheet that can be transferred to the same size as SiC and can be bonded at low temperature （250℃ or less）. As a result, transfer bonding sheet with shear strength of 70 MPa or more was produced under the bonding conditions of 250℃, 10 MPa and 5 min in nitrogen atmosphere.","PeriodicalId":488853,"journal":{"name":"Sumato Purosesu Gakkaishi","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-09-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"136072445","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Evaluation of Solder Joints on a Lead Frame Using 3-Dimentional Crack Detection Analysis 用三维裂纹检测分析评价引线框架上的焊点
Sumato Purosesu Gakkaishi Pub Date : 2023-09-10 DOI: 10.7791/jspmee.12.275
Riri ONIZUKA, Masashi HASEGAWA, Ryusuke UEKI, Katsuhisa KONISHI, Masanori TAKAHASHI
{"title":"Evaluation of Solder Joints on a Lead Frame Using 3-Dimentional Crack Detection Analysis","authors":"Riri ONIZUKA, Masashi HASEGAWA, Ryusuke UEKI, Katsuhisa KONISHI, Masanori TAKAHASHI","doi":"10.7791/jspmee.12.275","DOIUrl":"https://doi.org/10.7791/jspmee.12.275","url":null,"abstract":"In electronic devices, a crack initi ation and propagation of solder joints lead to failure. A cross-sectional observation and bonding strength test （pull or shear） are often carried out to confirm whether a crack exists or not. However, it has been known that bonding strength of solder joints depends on various factors so that it is unidentified the condition of a crack contributes to the value of strength. In this study, we obtained a 3-dimentional crack structure from X-ray CT data by using deep-learning technique before pull strength test and investigated their correlation.","PeriodicalId":488853,"journal":{"name":"Sumato Purosesu Gakkaishi","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-09-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"136072631","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
銅系導電性ペーストの電気伝導特性に及ぼすアミノエタノールおよび その誘導体のフィラー表面処理効果の分子構造依存性 氨基乙醇及其衍生物的填料表面处理效果对铜基导电膏的导电特性的分子结构依赖性
Sumato Purosesu Gakkaishi Pub Date : 2023-09-10 DOI: 10.7791/jspmee.12.257
Yukari MATSUNAMI, Daisuke OTAJIMA, Masahiro INOUE
{"title":"銅系導電性ペーストの電気伝導特性に及ぼすアミノエタノールおよび その誘導体のフィラー表面処理効果の分子構造依存性","authors":"Yukari MATSUNAMI, Daisuke OTAJIMA, Masahiro INOUE","doi":"10.7791/jspmee.12.257","DOIUrl":"https://doi.org/10.7791/jspmee.12.257","url":null,"abstract":"Improving the electrical conductivity and reliability is a critical issue for developing copper-filled electrically conductive pastes that are expected to alternate the conventional silver-filled pastes in the electronics packaging field. This work investigated the effect of surface treatment through amino ethanol and its derivatives on copper fillers to improve the electrical conductivity and reliability of copper-filled electrically conductive pastes composed of a resol-phenolic resin binder. The amino ethanol surfactants effectively accelerated the electrical conductivity development in the pastes during curing, increasing the magnitude of the acceleration effect with the number of terminal hydroxyl groups. Although using amino ethanol surfactant alone could not improve the electrical reliability during exposure to a humid environment, co-treatment with oleic acid enhanced the reliability. By contrast, introducing a terminal amino group to the surfactant improved electrical conductivity and reliability. The chemical behavior of copper complexes formed by the interfacial reaction during the surface treatment is needed to clarify the mechanisms of enhancing electrical conductivity and reliability. This means control of the interfacial chemistry will be essential for developing advanced copper-filled conductive pastes.","PeriodicalId":488853,"journal":{"name":"Sumato Purosesu Gakkaishi","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-09-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"136072439","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Heating Characteristics of Non-Contact Soldering Technique by Using Localized Induction Heating 局部感应加热非接触焊接技术的加热特性
Sumato Purosesu Gakkaishi Pub Date : 2023-09-10 DOI: 10.7791/jspmee.12.246
Izumi KUMADA, Yuichi SAKAI, Takaaki SHIMIZU, Takeshi TAKAYANAGI, Daisuke ISHIBASHI
{"title":"Heating Characteristics of Non-Contact Soldering Technique by Using Localized Induction Heating","authors":"Izumi KUMADA, Yuichi SAKAI, Takaaki SHIMIZU, Takeshi TAKAYANAGI, Daisuke ISHIBASHI","doi":"10.7791/jspmee.12.246","DOIUrl":"https://doi.org/10.7791/jspmee.12.246","url":null,"abstract":"Localized, quick, and non-contact soldering technique has been required for soldering leaded components to printed circuit board. In order to satisfy these requirements, induction heating （IH） soldering technique was studied. In the case of conventional iron soldering, many factors affecting heat loss in the heat pass from heat source to component lead exists. On the other hand, in the case of IH soldering, component lead can be directly heated by IH. Therefore, adopting simulation technique for IH soldering is reasonable. Using the thruhole - lead model, heating power of IH heating was calculated by magnetic simulation. Joule loss densities of the IH soldering model were calculated. Skin-depth effect in component lead during IH soldering was confirmed by the calculation. Temperatures of component lead were also calculated from joule loss density. The calculated temperatures agreed with observed temperatures of component lead during IH soldering.","PeriodicalId":488853,"journal":{"name":"Sumato Purosesu Gakkaishi","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-09-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"136072441","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
LPD 法によるSnO<sub>2</sub> を用いたガラス基板に対する銅めっき皮膜の密着機構 基于LPD方法的sno&lt;sub & gt;2 &爱尔蒂;/ sub & gt;使用的镀铜皮膜对玻璃基板的贴合机构
Sumato Purosesu Gakkaishi Pub Date : 2023-09-10 DOI: 10.7791/jspmee.12.265
Mayu TSUKUDA, Toshimitsu NAGAO, Jun-ichi KATAYAMA, Asuka HIROOKA, Shunsaku SENOO, Masahito HAYAMIZU, Toshihiko SAKATA
{"title":"LPD 法によるSnO&lt;sub&gt;2&lt;/sub&gt; を用いたガラス基板に対する銅めっき皮膜の密着機構","authors":"Mayu TSUKUDA, Toshimitsu NAGAO, Jun-ichi KATAYAMA, Asuka HIROOKA, Shunsaku SENOO, Masahito HAYAMIZU, Toshihiko SAKATA","doi":"10.7791/jspmee.12.265","DOIUrl":"https://doi.org/10.7791/jspmee.12.265","url":null,"abstract":"We investigated a method of copper plating on glass substrates wit h high smoothness and insulation properties and excellent transmission characteristics, while maintaining the smoothness of the substrate. The tin oxide deposited by the liquid phase deposition method acts as an adhesion layer between the glass substrate and the plating film, which was obtained to copper plating film with excellent adhesion. In this report, we discuss the microstructure of the plating film interface where high adhesion is obtained.","PeriodicalId":488853,"journal":{"name":"Sumato Purosesu Gakkaishi","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-09-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"136072443","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Interfacial Behavior Between Mold Resin and Sputtered Film Deposited on Electromagnetic Shield Packages 电磁屏蔽封装上沉积的模树脂与溅射膜的界面行为
Sumato Purosesu Gakkaishi Pub Date : 2023-09-10 DOI: 10.7791/jspmee.12.291
Soichi HOMMA, Daichi OKADA, Akihito SAWANOBORI, Susumu YAMAMOTO, Takashi IMOTO, Hiroshi NISHIKAWA
{"title":"Interfacial Behavior Between Mold Resin and Sputtered Film Deposited on Electromagnetic Shield Packages","authors":"Soichi HOMMA, Daichi OKADA, Akihito SAWANOBORI, Susumu YAMAMOTO, Takashi IMOTO, Hiroshi NISHIKAWA","doi":"10.7791/jspmee.12.291","DOIUrl":"https://doi.org/10.7791/jspmee.12.291","url":null,"abstract":"Many studies have examined electromagnetic shield packages for preventing electromagnetic interference, and several have discussed adhesion between the mold resin and the electromagnetic wave shielding film. In this study, we investigated the interfacial behavior between mold resin and sputtered stainless steel film as an electromagnetic wave shielding film. Two mold resin samples with different amounts of SiO2 filler formed on an organic wiring substrate were plasma etched with different gas flow ratios of Ar and N2. After etching, stainless steel film and Cu film were formed on the mold resin by sputtering. Adhesion was evaluated by the crosscut method. The results showed that adhesion between the mold resin and the sputtered stainless steel film improved as the exposure of the SiO2 filler increased and as the N2/（Ar + N2） gas flow ratio in the etching gas was increased. As the N2/（Ar + N2） gas flow rate ratio increased, the amount of resin etched increased, exposing more SiO2 filler. XPS analysis showed that this increased adhesion by enabling polar interactions between metal atoms and amino group nitrogen atoms. IR reflow after moisture absorption decreased the amount of nitrogen at the interface, breaking the metal-nitrogen polar interaction and oxidizing the metal, resulting in reduced adhesion.","PeriodicalId":488853,"journal":{"name":"Sumato Purosesu Gakkaishi","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-09-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"136072446","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
液相拡散接合における粒子構造が接合強度に及ぼす影響 液相扩散接合中粒子结构对接合强度的影响
Sumato Purosesu Gakkaishi Pub Date : 2023-09-10 DOI: 10.7791/jspmee.12.238
Yumi TAKAO, Shinji ISHITANI, Akio FURUSAWA, Naomichi OHASHI, Hirohisa HINO
{"title":"液相拡散接合における粒子構造が接合強度に及ぼす影響","authors":"Yumi TAKAO, Shinji ISHITANI, Akio FURUSAWA, Naomichi OHASHI, Hirohisa HINO","doi":"10.7791/jspmee.12.238","DOIUrl":"https://doi.org/10.7791/jspmee.12.238","url":null,"abstract":"With the evolution of power device elements, there is a demand for bonding materials that can bond devices with low thermal stress and realize high heat resistance bonding that supports high temperature operation. We propose a new bonding material that achieves high heat resistance in a low-temperature, short-time process by using metal fine particles and based on the characteristics of fine particles and the concept of liquid-phase diffusion bonding. In this study, we investigated the relationship between the metal composition in the bonding material and the bonding strength for bonding materials using SnBi and Cu, and reported that the particle structure affects the formation of the bonding layer.","PeriodicalId":488853,"journal":{"name":"Sumato Purosesu Gakkaishi","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-09-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"136072442","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Study of Soldering Process with Formic Acid 甲酸焊接工艺的研究
Sumato Purosesu Gakkaishi Pub Date : 2023-09-10 DOI: 10.7791/jspmee.12.281
Nobuhiro ASAJI, Yuya SHIMIZU, Hitoshi TOKUMARU, Dai NAKAJIMA
{"title":"Study of Soldering Process with Formic Acid","authors":"Nobuhiro ASAJI, Yuya SHIMIZU, Hitoshi TOKUMARU, Dai NAKAJIMA","doi":"10.7791/jspmee.12.281","DOIUrl":"https://doi.org/10.7791/jspmee.12.281","url":null,"abstract":"Soldering technique using formic acid is being applied to power module’s assembly process, but detailed research on this process has been few reported. This paper presents the results of basic evaluation focusing on the gas generated by chemical reduction with formic acid atmosphere and reduction rate. It was observed that a compound of formic acid and tin oxide was formed at 150℃, and the compound was decomposed into hydrogen and carbon dioxide at 180℃ or higher. Furthermore, it was found that the chemical reduction rate of tin oxide is proportional to the temperature and concentration of formic acid if the amount of formic acid is more than the amount of oxide, but it does not increase if the amount of formic acid is less than the amount of oxide.","PeriodicalId":488853,"journal":{"name":"Sumato Purosesu Gakkaishi","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-09-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"136072444","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Development of In-Situ Measurement Method for Wire-Bonding Lifetime Utilizing the 4-Terminal Method 利用四端法原位测量焊线寿命方法的发展
Sumato Purosesu Gakkaishi Pub Date : 2023-01-01 DOI: 10.7791/jspmee.12.251
Kento KARIYA, Nobuyuki SHISHIDO, Jinya OZAKI, Masaya UKITA, Ken NAKAHARA
{"title":"Development of In-Situ Measurement Method for Wire-Bonding Lifetime Utilizing the 4-Terminal Method","authors":"Kento KARIYA, Nobuyuki SHISHIDO, Jinya OZAKI, Masaya UKITA, Ken NAKAHARA","doi":"10.7791/jspmee.12.251","DOIUrl":"https://doi.org/10.7791/jspmee.12.251","url":null,"abstract":"The authors developed a test system to easily measure the fatigue life of wire bonding. The test specimens were prepared by bonding Al wires onto Al electrodes with current applied and voltage measured area. By applying a 10 A square-wave current to them, the current application path was heated and a repetitive thermal load of 110－240℃ was applied to the wire bonding part. At the same time, we attempted to measure the thermal fatigue nondestructively by measuring the resistance change ratio（ ΔR/R0） of the wire bonding part using the 4-terminal method. As a result of the verification, it was found that Δ R/R0 and crack length of wire bonding parts are closely correlated. Then, the observed fatigue lifetime was close to those predicted from conventional thermal shock test results. These results indicate that the developed system is a reasonable lifetime measurement technique and that this system has the potential to efficiently collect the fatigue life of wire bonding, which is necessary for the reliability design of power devices.","PeriodicalId":488853,"journal":{"name":"Sumato Purosesu Gakkaishi","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135700961","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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