Development of Transfer Bonding Sheet Using Copper Nanoparticles

Abstract

We have tech nology to manufacture copper nanoparticles by dry process. In this study, we investigated the basic characteristics of transfer bonding sheet using our copper nanoparticles with the goal of developing transfer bonding sheet that can be transferred to the same size as SiC and can be bonded at low temperature （250℃ or less）. As a result, transfer bonding sheet with shear strength of 70 MPa or more was produced under the bonding conditions of 250℃, 10 MPa and 5 min in nitrogen atmosphere.