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Bulletin Board: APEC 2024 公告栏：2024 年亚太经合组织
IF 2.6 4区 工程技术
IEEE Electrical Insulation Magazine Pub Date : 2024-06-21 DOI: 10.1109/MEI.2024.10568096
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引用次数: 0
Guide to Changes Made in Edition 4 of IEC 60270, Charge-Based Partial Discharge Measurements IEC 60270《基于电荷的局部放电测量》第 4 版修改指南
IF 2.6 4区 工程技术
IEEE Electrical Insulation Magazine Pub Date : 2024-06-21 DOI: 10.1109/MEI.2024.10568081
Glenn Behrmann;Detlev Gross;Michael Muhr
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引用次数: 0
Trends in Diagnostics and Monitoring of High-Voltage Insulation 高压绝缘诊断和监测的发展趋势
IF 2.6 4区 工程技术
IEEE Electrical Insulation Magazine Pub Date : 2024-06-21 DOI: 10.1109/MEI.2024.10568085
B. Biswas;B. X. Du;M. Florkowski;T. Hammarström;M. D. Judd;W. Kołtunowicz;B. Kordi;M. Kuniewski;G. Ma;C. Pan;C. Park;A. K. Pradhan;L. Satish;G. Stone
{"title":"Trends in Diagnostics and Monitoring of High-Voltage Insulation","authors":"B. Biswas;B. X. Du;M. Florkowski;T. Hammarström;M. D. Judd;W. Kołtunowicz;B. Kordi;M. Kuniewski;G. Ma;C. Pan;C. Park;A. K. Pradhan;L. Satish;G. Stone","doi":"10.1109/MEI.2024.10568085","DOIUrl":"https://doi.org/10.1109/MEI.2024.10568085","url":null,"abstract":"This paper is a joint contribution from members of the IEEE DEIS Technical Committee for Diagnostics that highlights selected trends, challenges, and techniques in diagnostics and monitoring of high-voltage electrical insulation. Especially important are broad application areas including traditional generation, transmission and distribution, and renewable energy, along with emerging fields including new sectors in transportation electrification such as electromobility and electric aviation.","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"40 4","pages":"6-26"},"PeriodicalIF":2.6,"publicationDate":"2024-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141439332","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Young Professionals 青年专业人员
IF 2.6 4区 工程技术
IEEE Electrical Insulation Magazine Pub Date : 2024-06-21 DOI: 10.1109/MEI.2024.10568080
Ashok Narayan Tripathi
{"title":"Young Professionals","authors":"Ashok Narayan Tripathi","doi":"10.1109/MEI.2024.10568080","DOIUrl":"https://doi.org/10.1109/MEI.2024.10568080","url":null,"abstract":"The IEEE DEIS Student Branch Chapter Indian Institute of Technology Kanpur has completed its first year. Since its inauguration, we have been constantly promoting the motto of IEEE, “Advancing Technology for Humanity.” We have organized events throughout the year, which include webinars, expert talks, panel discussions, and social gatherings.","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"40 4","pages":"46-47"},"PeriodicalIF":2.6,"publicationDate":"2024-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10568080","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141439446","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Share Your Preprint Research with the World! 与世界分享您的预印本研究成果
IF 2.6 4区 工程技术
IEEE Electrical Insulation Magazine Pub Date : 2024-06-21 DOI: 10.1109/MEI.2024.10568103
{"title":"Share Your Preprint Research with the World!","authors":"","doi":"10.1109/MEI.2024.10568103","DOIUrl":"https://doi.org/10.1109/MEI.2024.10568103","url":null,"abstract":"","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"40 4","pages":"1-1"},"PeriodicalIF":2.6,"publicationDate":"2024-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10568103","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141439397","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Bulletin Board: 2024 Graduate Fellowship 公告栏：2024 年研究生奖学金
IF 2.6 4区 工程技术
IEEE Electrical Insulation Magazine Pub Date : 2024-06-21 DOI: 10.1109/MEI.2024.10566873
{"title":"Bulletin Board: 2024 Graduate Fellowship","authors":"","doi":"10.1109/MEI.2024.10566873","DOIUrl":"https://doi.org/10.1109/MEI.2024.10566873","url":null,"abstract":"","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"40 4","pages":"58-58"},"PeriodicalIF":2.6,"publicationDate":"2024-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10566873","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141439400","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Bulletin Board: Call for Papers 公告栏：论文征集
IF 2.9 4区 工程技术
IEEE Electrical Insulation Magazine Pub Date : 2024-04-25 DOI: 10.1109/MEI.2024.10508420
{"title":"Bulletin Board: Call for Papers","authors":"","doi":"10.1109/MEI.2024.10508420","DOIUrl":"https://doi.org/10.1109/MEI.2024.10508420","url":null,"abstract":"","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"40 3","pages":"43-43"},"PeriodicalIF":2.9,"publicationDate":"2024-04-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10508420","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140647867","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Effect of Thermal Aging on Electrical Performance of Perfluoroalkoxy- and Polyamide-Imide-Coated Magnet Wire 热老化对全氟烷氧基和聚酰胺-酰亚胺包覆电磁线电气性能的影响
IF 2.9 4区 工程技术
IEEE Electrical Insulation Magazine Pub Date : 2024-04-25 DOI: 10.1109/MEI.2024.10508410
Sakina Zeynalova;Enrico Cepparrone;Edoardo Roffino;Davide Barbero
{"title":"Effect of Thermal Aging on Electrical Performance of Perfluoroalkoxy- and Polyamide-Imide-Coated Magnet Wire","authors":"Sakina Zeynalova;Enrico Cepparrone;Edoardo Roffino;Davide Barbero","doi":"10.1109/MEI.2024.10508410","DOIUrl":"https://doi.org/10.1109/MEI.2024.10508410","url":null,"abstract":"A study of the effect of thermal aging on the dielectric properties of rectangular magnetic copper wire showed the stability of perfluo-roalkoxy-coated wire against thermal aging and aging in oil, in contrast to polyamide-imide-coated enameled copper wire.","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"40 3","pages":"6-14"},"PeriodicalIF":2.9,"publicationDate":"2024-04-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140647887","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Bulletin Board: IEEE EIC 2024 公告栏：IEEE EIC 2024
IF 2.9 4区 工程技术
IEEE Electrical Insulation Magazine Pub Date : 2024-04-25 DOI: 10.1109/MEI.2024.10508425
{"title":"Bulletin Board: IEEE EIC 2024","authors":"","doi":"10.1109/MEI.2024.10508425","DOIUrl":"https://doi.org/10.1109/MEI.2024.10508425","url":null,"abstract":"","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"40 3","pages":"40-41"},"PeriodicalIF":2.9,"publicationDate":"2024-04-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10508425","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140647959","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Bulletin Board: DEIS WIE 公告栏：DEIS WIE
IF 2.9 4区 工程技术
IEEE Electrical Insulation Magazine Pub Date : 2024-04-25 DOI: 10.1109/MEI.2024.10508423
{"title":"Bulletin Board: DEIS WIE","authors":"","doi":"10.1109/MEI.2024.10508423","DOIUrl":"https://doi.org/10.1109/MEI.2024.10508423","url":null,"abstract":"","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"40 3","pages":"39-39"},"PeriodicalIF":2.9,"publicationDate":"2024-04-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10508423","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140647896","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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