Journal of Engineering Technology and Applied Physics最新文献

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Enhancement of Undergraduate Time Management Through the Use of A Lab Schedule Reminder App 利用实验日程提醒App加强大学生的时间管理
Journal of Engineering Technology and Applied Physics Pub Date : 2019-06-19 DOI: 10.33093/jetap.2019.1.3
Khobinath Varma Perumal, Siva Priya Thiagarajah
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引用次数: 0
Modeling of Capacitance in A Supercapacitor 超级电容器中电容的建模
Journal of Engineering Technology and Applied Physics Pub Date : 2019-06-19 DOI: 10.33093/jetap.2019.1.1.50
A. You, P. L. Cheang
{"title":"Modeling of Capacitance in A Supercapacitor","authors":"A. You, P. L. Cheang","doi":"10.33093/jetap.2019.1.1.50","DOIUrl":"https://doi.org/10.33093/jetap.2019.1.1.50","url":null,"abstract":"A general supercapacitor model is developed by incorporating the effective surface area in the presence of pores. An analytical solution has been derived from the generic equation in Laplace domain based on the porous-electrode theory. This model demonstrates the effects of solution to matrix conductivity ratio, separator to electrode resistance ratio and discharge current density on the electrochemical impedance, capacitance and energy density of supercapacitor. The electrochemical impedance, capacitance and energy density of supercapacitor are calculated in this work. The maximum capacitance of 12.71 F/cm2was computed in low frequency range in this device. The proposed model can be applied to simulate the characteristics of polymer-based supercapacitor in near future.","PeriodicalId":441201,"journal":{"name":"Journal of Engineering Technology and Applied Physics","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127399114","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Enhancement of Undergraduate Time Management Through the Use of A Lab Schedule Reminder App 利用实验日程提醒App加强大学生的时间管理
Journal of Engineering Technology and Applied Physics Pub Date : 2019-06-15 DOI: 10.33093/JETAP.2019.1.1.3
Khobinath Varma Perumal, Siva Priya Thiagarajah
{"title":"Enhancement of Undergraduate Time Management Through the Use of A Lab Schedule Reminder App","authors":"Khobinath Varma Perumal, Siva Priya Thiagarajah","doi":"10.33093/JETAP.2019.1.1.3","DOIUrl":"https://doi.org/10.33093/JETAP.2019.1.1.3","url":null,"abstract":"","PeriodicalId":441201,"journal":{"name":"Journal of Engineering Technology and Applied Physics","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125334688","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Viscous Dissipation Effects in A Microchannel Caused by Oscillation of One Surface 单面振荡引起的微通道粘滞耗散效应
Journal of Engineering Technology and Applied Physics Pub Date : 2019-06-15 DOI: 10.33093/jetap.2019.1.4
Hor Chee Hao, Tso Chih Ping, Chen Gooi Mee
{"title":"Viscous Dissipation Effects in A Microchannel Caused by Oscillation of One Surface","authors":"Hor Chee Hao, Tso Chih Ping, Chen Gooi Mee","doi":"10.33093/jetap.2019.1.4","DOIUrl":"https://doi.org/10.33093/jetap.2019.1.4","url":null,"abstract":"","PeriodicalId":441201,"journal":{"name":"Journal of Engineering Technology and Applied Physics","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123214681","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Modeling of Capacitance in A Supercapacitor 超级电容器中电容的建模
Journal of Engineering Technology and Applied Physics Pub Date : 2019-06-15 DOI: 10.33093/jetap.2019.1.5
You Ah Heng, Cheang Pei Ling
{"title":"Modeling of Capacitance in A Supercapacitor","authors":"You Ah Heng, Cheang Pei Ling","doi":"10.33093/jetap.2019.1.5","DOIUrl":"https://doi.org/10.33093/jetap.2019.1.5","url":null,"abstract":"","PeriodicalId":441201,"journal":{"name":"Journal of Engineering Technology and Applied Physics","volume":"82 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133270186","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Effect of Laminating Press’s Opening-Stacking Position on Adhesive Thickness in Coverlay/Adhesive/Flexible-Printed-Circuit Sheet 层压机开堆位置对覆盖/粘接/挠性电路片胶粘剂厚度的影响
Journal of Engineering Technology and Applied Physics Pub Date : 2019-06-15 DOI: 10.33093/jetap.2019.1.1
K. Lau, Hoi Ern Kok, H. E. A. Maulod, N. A. Latiff, A. Aziz, N. Rosli
{"title":"Effect of Laminating Press’s Opening-Stacking Position on Adhesive Thickness in Coverlay/Adhesive/Flexible-Printed-Circuit Sheet","authors":"K. Lau, Hoi Ern Kok, H. E. A. Maulod, N. A. Latiff, A. Aziz, N. Rosli","doi":"10.33093/jetap.2019.1.1","DOIUrl":"https://doi.org/10.33093/jetap.2019.1.1","url":null,"abstract":"This study is to investigate the dependence of coverlay’s adhesive thickness on the laminating press’s opening-stacking position. Coverlays using acrylic-and epoxy-based adhesives were laminated onto similar size copper clad laminate (CCL) at 140 bars and195°C for 150 min. Adhesive thickness measurements show opening-stacking positions near to the bottom of laminating press machine produced more consistent adhesive thickness as compared to the top positions","PeriodicalId":441201,"journal":{"name":"Journal of Engineering Technology and Applied Physics","volume":"65 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127530719","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Viscous Dissipation Effects in A Microchannel Caused by Oscillation of One Surface 单面振荡引起的微通道粘滞耗散效应
Journal of Engineering Technology and Applied Physics Pub Date : 2019-06-15 DOI: 10.33093/JETAP.2019.1.1.4
Hor Chee Hao, T. C. Ping, C. G. Mee
{"title":"Viscous Dissipation Effects in A Microchannel Caused by Oscillation of One Surface","authors":"Hor Chee Hao, T. C. Ping, C. G. Mee","doi":"10.33093/JETAP.2019.1.1.4","DOIUrl":"https://doi.org/10.33093/JETAP.2019.1.1.4","url":null,"abstract":"","PeriodicalId":441201,"journal":{"name":"Journal of Engineering Technology and Applied Physics","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122450242","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Modeling of Capacitance in A Supercapacitor 超级电容器中电容的建模
Journal of Engineering Technology and Applied Physics Pub Date : 2019-06-15 DOI: 10.33093/JETAP.2019.1.1.5
Y. Heng, C. P. Ling
{"title":"Modeling of Capacitance in A Supercapacitor","authors":"Y. Heng, C. P. Ling","doi":"10.33093/JETAP.2019.1.1.5","DOIUrl":"https://doi.org/10.33093/JETAP.2019.1.1.5","url":null,"abstract":"","PeriodicalId":441201,"journal":{"name":"Journal of Engineering Technology and Applied Physics","volume":"330 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122826352","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Influence of Process Parameters on Rapid Prototype Part Using Response Surface Methodology 基于响应面法的工艺参数对快速成型零件的影响
Journal of Engineering Technology and Applied Physics Pub Date : 2019-06-15 DOI: 10.33093/JETAP.2019.1.1.2
Chockalingam Palanisamy, N. Chinnasamy, K. Muthu
{"title":"Influence of Process Parameters on Rapid Prototype Part Using Response Surface Methodology","authors":"Chockalingam Palanisamy, N. Chinnasamy, K. Muthu","doi":"10.33093/JETAP.2019.1.1.2","DOIUrl":"https://doi.org/10.33093/JETAP.2019.1.1.2","url":null,"abstract":"In this research the influencing process parameters on fused deposition modelling of Acrylonitrile Butadiene Styrene (ABS) parts were studied. The two process parameters, layer thickness and model interior fill style are studied. The specimens were built, tests carried out to find out the surface roughness quality of the specimens. The results analyzed using Response Surface Methodology (RSM). The result indicates that the specimen Type 1 with the 0.254mm layer thickness and solid model interior fill style is the best specimen among the types of specimens tested.","PeriodicalId":441201,"journal":{"name":"Journal of Engineering Technology and Applied Physics","volume":"95 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122285994","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
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