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AMD announces $135m Irish investment AMD宣布向爱尔兰投资1.35亿美元
New Electronics Pub Date : 2023-07-01 DOI: 10.12968/s0047-9624(23)60772-2
{"title":"AMD announces $135m Irish investment","authors":"","doi":"10.12968/s0047-9624(23)60772-2","DOIUrl":"https://doi.org/10.12968/s0047-9624(23)60772-2","url":null,"abstract":"AMD TO EXPAND ADAPTIVE COMPUTING RESEARCH, DEVELOPMENT AND ENGINEERING OPERATIONS IN IRELAND","PeriodicalId":427821,"journal":{"name":"New Electronics","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122091280","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
SoC for emulation and prototyping 用于仿真和原型的SoC
New Electronics Pub Date : 2023-07-01 DOI: 10.12968/s0047-9624(23)60762-x
{"title":"SoC for emulation and prototyping","authors":"","doi":"10.12968/s0047-9624(23)60762-x","DOIUrl":"https://doi.org/10.12968/s0047-9624(23)60762-x","url":null,"abstract":"AMD INTRODUCES LATEST FPGA-BASED ADAPTIVE SOC FOR EMULATION AND PROTOTYPING","PeriodicalId":427821,"journal":{"name":"New Electronics","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116747399","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Motor-Drive Design Hub 电机驱动设计中心
New Electronics Pub Date : 2023-07-01 DOI: 10.12968/s0047-9624(23)60768-0
{"title":"Motor-Drive Design Hub","authors":"","doi":"10.12968/s0047-9624(23)60768-0","DOIUrl":"https://doi.org/10.12968/s0047-9624(23)60768-0","url":null,"abstract":"ARROW ELECTRONICS CREATES NEW ONLINE HUB TO SUPPORT MOTOR-DRIVE DESIGN","PeriodicalId":427821,"journal":{"name":"New Electronics","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129832600","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Relationship Building 建立关系
New Electronics Pub Date : 2023-07-01 DOI: 10.12968/s0047-9624(23)60779-5
{"title":"Relationship Building","authors":"","doi":"10.12968/s0047-9624(23)60779-5","DOIUrl":"https://doi.org/10.12968/s0047-9624(23)60779-5","url":null,"abstract":"NEIL TYLER talks to DAN ATWELL, of Offshore Electronics, about current trends in contract electronics manufacturing","PeriodicalId":427821,"journal":{"name":"New Electronics","volume":"77 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134099419","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Toshiba Introduces ARM Cortex-M3 MCUs 东芝推出ARM Cortex-M3 mcu
New Electronics Pub Date : 2023-07-01 DOI: 10.12968/s0047-9624(23)60766-7
{"title":"Toshiba Introduces ARM Cortex-M3 MCUs","authors":"","doi":"10.12968/s0047-9624(23)60766-7","DOIUrl":"https://doi.org/10.12968/s0047-9624(23)60766-7","url":null,"abstract":"NEW DEVICES SUPPORT FIRMWARE UPDATES WITHOUT INTERRUPTING MICROCONTROLLER OPERATION","PeriodicalId":427821,"journal":{"name":"New Electronics","volume":"785 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134183318","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
World’s First Optical Network-on-Chip Processor 世界上第一个光网络片上处理器
New Electronics Pub Date : 2023-07-01 DOI: 10.12968/s0047-9624(23)60760-6
{"title":"World’s First Optical Network-on-Chip Processor","authors":"","doi":"10.12968/s0047-9624(23)60760-6","DOIUrl":"https://doi.org/10.12968/s0047-9624(23)60760-6","url":null,"abstract":"PROCESSOR DESIGNED FOR DOMAIN-SPECIFIC ARTIFICIAL INTELLIGENCE (AI) WORKLOADS.","PeriodicalId":427821,"journal":{"name":"New Electronics","volume":"148 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129083783","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Securing AI
New Electronics Pub Date : 2023-07-01 DOI: 10.12968/s0047-9624(23)60777-1
{"title":"Securing AI","authors":"","doi":"10.12968/s0047-9624(23)60777-1","DOIUrl":"https://doi.org/10.12968/s0047-9624(23)60777-1","url":null,"abstract":"","PeriodicalId":427821,"journal":{"name":"New Electronics","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124477827","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Terahertz-to-Visible Light Conversion 太赫兹到可见光的转换
New Electronics Pub Date : 2023-07-01 DOI: 10.12968/s0047-9624(23)60781-3
{"title":"Terahertz-to-Visible Light Conversion","authors":"","doi":"10.12968/s0047-9624(23)60781-3","DOIUrl":"https://doi.org/10.12968/s0047-9624(23)60781-3","url":null,"abstract":"","PeriodicalId":427821,"journal":{"name":"New Electronics","volume":"173 1-2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134129624","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Wind Tunnel Network Receives Funding 风洞网络获得资助
New Electronics Pub Date : 2023-07-01 DOI: 10.12968/s0047-9624(23)60778-3
{"title":"Wind Tunnel Network Receives Funding","authors":"","doi":"10.12968/s0047-9624(23)60778-3","DOIUrl":"https://doi.org/10.12968/s0047-9624(23)60778-3","url":null,"abstract":"","PeriodicalId":427821,"journal":{"name":"New Electronics","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129832233","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
>Cadence Expands Samsung Foundry Collaboration Cadence扩大三星代工合作
New Electronics Pub Date : 2023-07-01 DOI: 10.12968/s0047-9624(23)60763-1
{"title":">Cadence Expands Samsung Foundry Collaboration","authors":"","doi":"10.12968/s0047-9624(23)60763-1","DOIUrl":"https://doi.org/10.12968/s0047-9624(23)60763-1","url":null,"abstract":"COLLABORATION TO ACCELERATE 3D-IC DESIGN DEVELOPMENT","PeriodicalId":427821,"journal":{"name":"New Electronics","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125539729","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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