Nano-Bio- Electronic, Photonic and MEMS Packaging最新文献

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Graphene-Based Materials with Tailored Nanostructures for Lithium-Ion Batteries 锂离子电池用定制纳米结构石墨烯基材料
Nano-Bio- Electronic, Photonic and MEMS Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-3-030-49991-4_21
Cuiping Han, Hongfei Li, Jizhang Chen, Baohua Li, C. Wong
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引用次数: 0
Packaging for Bio-micro-electro-mechanical Systems (BioMEMS) and Microfluidic Chips 生物微机电系统(BioMEMS)和微流控芯片封装
Nano-Bio- Electronic, Photonic and MEMS Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-1-4419-0040-1_15
Edward S. Park, J. Krajniak, Hang Lu
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引用次数: 0
Evolution of Advanced Miniaturization for Active Implantable Medical Devices 有源植入式医疗器械先进小型化的发展
Nano-Bio- Electronic, Photonic and MEMS Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-3-030-49991-4_17
Chun-Seok Kim
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引用次数: 2
On-Chip Thermal Management and Hot-Spot Remediation 片内热管理和热点修复
Nano-Bio- Electronic, Photonic and MEMS Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-1-4419-0040-1_12
A. Bar-Cohen, Peng Wang
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引用次数: 15
Molecular Dynamics Applications in Packaging 分子动力学在包装中的应用
Nano-Bio- Electronic, Photonic and MEMS Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-1-4419-0040-1_18
Yao Li, J. Hinkley, K. Jacob
{"title":"Molecular Dynamics Applications in Packaging","authors":"Yao Li, J. Hinkley, K. Jacob","doi":"10.1007/978-1-4419-0040-1_18","DOIUrl":"https://doi.org/10.1007/978-1-4419-0040-1_18","url":null,"abstract":"","PeriodicalId":418916,"journal":{"name":"Nano-Bio- Electronic, Photonic and MEMS Packaging","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131207801","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Nanomaterials via NanoSpray Combustion Chemical Vapor Condensation and Their Electronic Applications 纳米喷雾燃烧的纳米材料及其电子应用
Nano-Bio- Electronic, Photonic and MEMS Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-3-030-49991-4_4
A. Hunt, Yongdong Jiang, Zhiyong Zhao, G. Venugopal
{"title":"Nanomaterials via NanoSpray Combustion Chemical Vapor Condensation and Their Electronic Applications","authors":"A. Hunt, Yongdong Jiang, Zhiyong Zhao, G. Venugopal","doi":"10.1007/978-3-030-49991-4_4","DOIUrl":"https://doi.org/10.1007/978-3-030-49991-4_4","url":null,"abstract":"","PeriodicalId":418916,"journal":{"name":"Nano-Bio- Electronic, Photonic and MEMS Packaging","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116791694","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Thermally Conductive Nanocomposites 导热纳米复合材料
Nano-Bio- Electronic, Photonic and MEMS Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-1-4419-0040-1_10
J. Felba
{"title":"Thermally Conductive Nanocomposites","authors":"J. Felba","doi":"10.1007/978-1-4419-0040-1_10","DOIUrl":"https://doi.org/10.1007/978-1-4419-0040-1_10","url":null,"abstract":"","PeriodicalId":418916,"journal":{"name":"Nano-Bio- Electronic, Photonic and MEMS Packaging","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125577199","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Nano-conductive Adhesives for Nano-electronics Interconnection 纳米电子互连用纳米导电胶粘剂
Nano-Bio- Electronic, Photonic and MEMS Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-1-4419-0040-1_2
Yi Li, K. Moon, C. Wong
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引用次数: 8
Physical Properties and Mechanical Behavior of Carbon Nano-tubes (CNTs) and Carbon Nano-fibers (CNFs) as Thermal Interface Materials (TIMs) for High-Power Integrated Circuit (IC) Packages: Review and Extension 碳纳米管(CNTs)和碳纳米纤维(CNFs)作为大功率集成电路(IC)封装热界面材料(TIMs)的物理性能和力学行为:综述与扩展
Nano-Bio- Electronic, Photonic and MEMS Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-1-4419-0040-1_11
Yi Zhang, E. Suhir, C. Gu
{"title":"Physical Properties and Mechanical Behavior of Carbon Nano-tubes (CNTs) and Carbon Nano-fibers (CNFs) as Thermal Interface Materials (TIMs) for High-Power Integrated Circuit (IC) Packages: Review and Extension","authors":"Yi Zhang, E. Suhir, C. Gu","doi":"10.1007/978-1-4419-0040-1_11","DOIUrl":"https://doi.org/10.1007/978-1-4419-0040-1_11","url":null,"abstract":"","PeriodicalId":418916,"journal":{"name":"Nano-Bio- Electronic, Photonic and MEMS Packaging","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129956253","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Nano-scale and Atomistic-Scale Modeling of Advanced Materials 先进材料的纳米尺度和原子尺度建模
Nano-Bio- Electronic, Photonic and MEMS Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-1-4419-0040-1_20
R. L. Dai, W. Liao, Chun-Te Lin, K. Chiang, S. Lee
{"title":"Nano-scale and Atomistic-Scale Modeling of Advanced Materials","authors":"R. L. Dai, W. Liao, Chun-Te Lin, K. Chiang, S. Lee","doi":"10.1007/978-1-4419-0040-1_20","DOIUrl":"https://doi.org/10.1007/978-1-4419-0040-1_20","url":null,"abstract":"","PeriodicalId":418916,"journal":{"name":"Nano-Bio- Electronic, Photonic and MEMS Packaging","volume":"174 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127308822","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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