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High Temporal Resolution Time-Gating for Wideband Radar Cross Section Measurements 宽带雷达截面测量的高时间分辨率时间门控
2021 51st European Microwave Conference (EuMC) Pub Date : 2022-04-04 DOI: 10.23919/EuMC50147.2022.9784213
Rachel E. Jarvis, J. Metcalf, J. Ruyle, J. Mcdaniel
{"title":"High Temporal Resolution Time-Gating for Wideband Radar Cross Section Measurements","authors":"Rachel E. Jarvis, J. Metcalf, J. Ruyle, J. Mcdaniel","doi":"10.23919/EuMC50147.2022.9784213","DOIUrl":"https://doi.org/10.23919/EuMC50147.2022.9784213","url":null,"abstract":"This paper discusses the challenges and advantages of calibration in radar cross section (RCS) measurements across a wide bandwidth. Due to the high temporal resolution in the time domain, and the time difference of the reflections as a result of different sphere diameters, a hybrid windowing scheme is proposed to gate undesired clutter while leaving the desired reflections unaltered. A full calibration process is discussed, and a time-gating algorithm is explored with a focus on optimizing the width and shape of the window for time-gating. These methods are applied to metallic sphere measurements taken in an anechoic chamber over the 2–18 GHz frequency range.","PeriodicalId":413113,"journal":{"name":"2021 51st European Microwave Conference (EuMC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121820420","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
A Novel GaN/SiC MMIC Gain Switch Using a Resonant Bidirectional FET Amplifier 一种基于谐振双向场效应管放大器的新型GaN/SiC MMIC增益开关
2021 51st European Microwave Conference (EuMC) Pub Date : 2022-04-04 DOI: 10.23919/EuMC50147.2022.9784301
H. Mizutani, R. Ishikawa, K. Honjo
{"title":"A Novel GaN/SiC MMIC Gain Switch Using a Resonant Bidirectional FET Amplifier","authors":"H. Mizutani, R. Ishikawa, K. Honjo","doi":"10.23919/EuMC50147.2022.9784301","DOIUrl":"https://doi.org/10.23919/EuMC50147.2022.9784301","url":null,"abstract":"This paper presents a novel gain switch circuit using a resonant bidirectional field-effect transistor (FET) amplifier. The proposed switch circuit can provide insertion gain even at the millimeter-wave frequencies by using a resonant bidirectional FET amplifier. The fundamental operation of a single pole single throw (SPST) FET gain switch is successfully demonstrated as a GaN/SiC microwave monolithic integrated circuit (MMIC), which is a quite essential material to ensure the watt-class RF power handling capability for the transmission signal even at the millimeter-wave frequencies. It shows the insertion gain and isolation of 0.98 dB and 11.2 dB, respectively, at 25 GHz. Input power for 1-dB gain compression, P1dB, is around 6 dBm at 25 GHz. For further improvement of insertion gain and isolation, maximizing transconductance of FET and minimizing feedback capacitance by bias optimization and/or increasing stage number of a bidirectional amplifier are found to be efficient from principle analysis of the presented switch circuit. Furthermore, optimization of gate width and bias voltage improves power handling capability.","PeriodicalId":413113,"journal":{"name":"2021 51st European Microwave Conference (EuMC)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121322814","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Heterodyne Transceiver With Integrated Calibrator for K/Ka-Band Phased Arrays 一种用于K/ ka波段相控阵的外差式集成校准器收发器
2021 51st European Microwave Conference (EuMC) Pub Date : 2022-04-04 DOI: 10.23919/EuMC50147.2022.9784214
Anton Sieganschin, Nils C. Albrecht, Bartosz Tegowski, Thomas Jaschke, Jan Waldhelm, Nadja J. Lamann, A. Jacob
{"title":"A Heterodyne Transceiver With Integrated Calibrator for K/Ka-Band Phased Arrays","authors":"Anton Sieganschin, Nils C. Albrecht, Bartosz Tegowski, Thomas Jaschke, Jan Waldhelm, Nadja J. Lamann, A. Jacob","doi":"10.23919/EuMC50147.2022.9784214","DOIUrl":"https://doi.org/10.23919/EuMC50147.2022.9784214","url":null,"abstract":"This work presents a heterodyne K/Ka-band transceiver with integrated transmit (Tx)/receive (Rx) calibrator for satellite communication terminal antennas. To reduce the system complexity, the circuit features only three active mixers compared to four in conventional designs, which is also beneficial in terms of power consumption. The signal distribution requires a radio frequency (RF) switch, a local oscillator (LO) diplexer, and a power divider. The transceiver interfaces the back-end circuitry with merely three intermediate frequency (IF) signals and a dual-tone LO signal. Despite the reduced system complexity, it provides full-duplex communication at 20 GHz (Rx) and 30 GHz (Tx) as well as sequential calibration for the Rx and the Tx antennas. The demonstrator realized in standard printed circuit board technology is compact enough to meet phased array requirements and fully verifies the desired functionality.","PeriodicalId":413113,"journal":{"name":"2021 51st European Microwave Conference (EuMC)","volume":"110 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125548556","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Quad-Band Bandpass Filter Using Modified Asymmetric Stepped Impedance Resonators 采用改进非对称阶跃阻抗谐振器的四带带通滤波器
2021 51st European Microwave Conference (EuMC) Pub Date : 2022-04-04 DOI: 10.23919/EuMC50147.2022.9784328
Shi-Peng Chen, Yung-Wei Chen, Sung-Pu Wu, Hung-Wei Wu, C. Sim
{"title":"Quad-Band Bandpass Filter Using Modified Asymmetric Stepped Impedance Resonators","authors":"Shi-Peng Chen, Yung-Wei Chen, Sung-Pu Wu, Hung-Wei Wu, C. Sim","doi":"10.23919/EuMC50147.2022.9784328","DOIUrl":"https://doi.org/10.23919/EuMC50147.2022.9784328","url":null,"abstract":"This paper proposes a compact quad-band bandpass filter designed by new modified asymmetric stepped impedance resonators (SIRs). The four passbands are generated by controlling the impedance and length ratios of the traditional asymmetric and new modified asymmetric stepped impedance resonators (SIRs). The bandpass filter response is designed at 2.35, 3.8, 5.2, and 6.55 GHz, respectively. The filter can achieve compact circuit size, and it can provide multipath propagation to enhance frequency response. The measurement results are in good agreement with the full-wave electromagnetic (EM) simulation results.","PeriodicalId":413113,"journal":{"name":"2021 51st European Microwave Conference (EuMC)","volume":"366 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116449635","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
First Demonstration of Ultra-Miniaturized, High-Performance Filters on Alumina Ribbon Ceramic Substrates for 5G Applications 首次展示用于5G应用的氧化铝带陶瓷基板上的超小型化高性能滤波器
2021 51st European Microwave Conference (EuMC) Pub Date : 2022-04-04 DOI: 10.23919/EuMC50147.2022.9784327
Nahid Aslani-Amoli, Fuhan Liu, Madhavan Swaminathan, Cheng-Gang Zhuang, N. Zhelev, Seong-ho Seok, Cheolbok Kim
{"title":"First Demonstration of Ultra-Miniaturized, High-Performance Filters on Alumina Ribbon Ceramic Substrates for 5G Applications","authors":"Nahid Aslani-Amoli, Fuhan Liu, Madhavan Swaminathan, Cheng-Gang Zhuang, N. Zhelev, Seong-ho Seok, Cheolbok Kim","doi":"10.23919/EuMC50147.2022.9784327","DOIUrl":"https://doi.org/10.23919/EuMC50147.2022.9784327","url":null,"abstract":"This paper reports the first demonstration of ultra-thin, ultra-miniaturized filters with footprint smaller than $0. 65lambda_{0}times 0.16lambda_{0}times 0.009lambda_{0}$ fabricated on Alumina Ribbon Ceramic substrate operating at the frequency of 28-GHz band for 5G and mm-wave applications. A newly developed substrate material technology by Corning, Alumina Ribbon Ceramic can be utilized for realizing ultra-miniaturized, high-performance passive components due to its high dielectric constant and very low loss tangent. To show the effectiveness of Alumina Ribbon Ceramic for such applications, three bandpass filter (BPF) topologies, namely edge-coupled, interdigital and hairpin, and semi-lumped elliptical low-pass filter (LPF) topologies were modeled, designed, and fabricated on an $80-mu mathrm{m}$-thick Alumina Ribbon Ceramic metallized on both sides using a Semi-Additive Patterning (SAP) process. The performance of filters was characterized in the frequency range of 14–40 GHz using a vector network analyzer (VNA). In addition to exhibiting excellent agreement between the simulated and measured results of Alumina Ribbon Ceramic-based filters, their superiority is demonstrated through comparisons with those reported in the literature on other substrates in terms of performance and size. It is also highlighted that an insertion loss less than 1.3 dB is achieved for all filters.","PeriodicalId":413113,"journal":{"name":"2021 51st European Microwave Conference (EuMC)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122657275","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Inter-Laboratory Comparison of On-Wafer Broadband 70kHz-220GHz Single-Sweep Measurements 片上宽带70kHz-220GHz单扫测量的实验室间比较
2021 51st European Microwave Conference (EuMC) Pub Date : 2022-04-04 DOI: 10.23919/EuMC50147.2022.9784277
A. Rumiantsev, R. Doerner, J. Martens, S. Reyes
{"title":"Inter-Laboratory Comparison of On-Wafer Broadband 70kHz-220GHz Single-Sweep Measurements","authors":"A. Rumiantsev, R. Doerner, J. Martens, S. Reyes","doi":"10.23919/EuMC50147.2022.9784277","DOIUrl":"https://doi.org/10.23919/EuMC50147.2022.9784277","url":null,"abstract":"This paper discusses methods and results of the first known inter-laboratory on-wafer measurement comparison campaign for a 70 kHz-220 GHz single-sweep measurement system. Intra- and inter-laboratory repeatability metrics are evaluated from measurements of several passive DUTs corrected by mTRL calibrations. Two evaluation approaches are discussed: the NIST calibration comparison method and the estimate of the measurement confidence interval based on the measurement reproducibility. Presented results can support cross-laboratory data comparison when the evaluation and propagation of the measurement uncertainties through the measurement chain is more difficult to apply.","PeriodicalId":413113,"journal":{"name":"2021 51st European Microwave Conference (EuMC)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116839868","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Optimised Hot-Via Transition with 20 dB Return Loss for MMIC Packaging from DC to 110 GHz MMIC封装从DC到110 GHz的优化热过孔转换，20 dB回波损耗
2021 51st European Microwave Conference (EuMC) Pub Date : 2022-04-04 DOI: 10.23919/EuMC50147.2022.9784265
Leigh E. Milner, Shyam G. Mehta, L. Hall, S. Mahon, S. Chakraborty, M. Heimlich
{"title":"Optimised Hot-Via Transition with 20 dB Return Loss for MMIC Packaging from DC to 110 GHz","authors":"Leigh E. Milner, Shyam G. Mehta, L. Hall, S. Mahon, S. Chakraborty, M. Heimlich","doi":"10.23919/EuMC50147.2022.9784265","DOIUrl":"https://doi.org/10.23919/EuMC50147.2022.9784265","url":null,"abstract":"A hot-via transition from a monolithic microwave integrated circuit (MMIC) to a printed circuit board (PCB) has been developed with a measured back-to-back insertion loss less than 0.88 dB and return loss higher than 20 dB from dc to 110 GHz. Two techniques are proposed to extend the maximum operating frequency of the microstrip to grounded coplanar waveguide (GCPW) transition. An oversized microstrip line is used on the MMIC to increase capacitance, and a critical return path via in the PCB is positioned near the edge of the hot-via gap to lower inductance. Both techniques improve the maximum operating frequency to 110 GHz for a transition with return loss better than 20 dB and insertion loss of 0.39 dB. To the authors' best knowledge, this MMIC packaging technique demonstrates the highest bandwidth achieved for a dc connected hot-via transition with less than 1 dB back-to-back insertion loss.","PeriodicalId":413113,"journal":{"name":"2021 51st European Microwave Conference (EuMC)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128393892","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Design and Measurement of Interconnects in Fan-Out Wafer-Level Packaging (FOWLP) for mm-Wave Applications up to 100 GHz 用于高达100 GHz毫米波应用的扇出晶圆级封装(FOWLP)互连的设计和测量
2021 51st European Microwave Conference (EuMC) Pub Date : 2022-04-04 DOI: 10.23919/EuMC50147.2022.9783613
S. Zinal, K. Murugesan, Marco Rossi, M. Böttcher, I. Ndip, K. Lang, M. Wieland, Christian Goetze, Saquib Bin Halim, J. Trewhella
{"title":"Design and Measurement of Interconnects in Fan-Out Wafer-Level Packaging (FOWLP) for mm-Wave Applications up to 100 GHz","authors":"S. Zinal, K. Murugesan, Marco Rossi, M. Böttcher, I. Ndip, K. Lang, M. Wieland, Christian Goetze, Saquib Bin Halim, J. Trewhella","doi":"10.23919/EuMC50147.2022.9783613","DOIUrl":"https://doi.org/10.23919/EuMC50147.2022.9783613","url":null,"abstract":"This paper presents the results obtained by the design, fabrication and measurements of redistribution layer (RDL) interconnects in Fan-Out Wafer-Level packaging (FOWLP) technology, including straight and bend transmission lines and through layer transitions designed in grounded coplanar wave guide (GCPW) type. The interconnection structures were fabricated in polymer based thin-film technology using 3µm copper sheets separated by 6 µm polyimide layers and providing a minimum lateral line/space of 9µm /9 µm. Measurement results up to 100 GHz are compared to simulation results of both the nominal designs and those fitted to the real geometrical dimensions of the fabricated structures. Surface roughness of the fabricated structures has been measured and considered in the simulation models. The results demonstrate the reliability of the fabrication as well as the robustness of the designed structures against tolerances in the fabrication process.","PeriodicalId":413113,"journal":{"name":"2021 51st European Microwave Conference (EuMC)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128488947","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Broadband Ku- and Ka-Band Circulators in LTCC Using Sintered Bulk Ferrites 使用烧结体铁氧体的LTCC宽带Ku和ka波段环行器
2021 51st European Microwave Conference (EuMC) Pub Date : 2022-04-04 DOI: 10.23919/EuMC50147.2022.9784350
C. Weil, Tim Hauck, Johannes Schur, Jens Müller
{"title":"Broadband Ku- and Ka-Band Circulators in LTCC Using Sintered Bulk Ferrites","authors":"C. Weil, Tim Hauck, Johannes Schur, Jens Müller","doi":"10.23919/EuMC50147.2022.9784350","DOIUrl":"https://doi.org/10.23919/EuMC50147.2022.9784350","url":null,"abstract":"This paper presents a novel approach of designing and fabricating compact microstrip circulators in low-temperature co-fired ceramics (LTCC) for Ku- and Ka-band satellite communications. State-of-the-art soft ferrites are embedded into LTCC boards as sintered bulk ceramics by using an advanced co-firing technology. The combination of (1) precise machining of the ferrites and low tolerance shrinking and (2) careful EM modelling by taking into account technological constraints, leads to reproducible fabrication and good circulator characteristics. We report simulation and measurement results in good agreement for broadband designs in Ku- and Ka-band.","PeriodicalId":413113,"journal":{"name":"2021 51st European Microwave Conference (EuMC)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129156607","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A 600-W Enhancement-Mode GaN Multi-Level Dynamic Converter for Supply Modulated PAs 用于电源调制PAs的600 w增强模式GaN多电平动态变换器
2021 51st European Microwave Conference (EuMC) Pub Date : 2022-04-04 DOI: 10.23919/EuMC50147.2022.9784375
Connor Nogales, Z. Popovic, G. Lasser
{"title":"A 600-W Enhancement-Mode GaN Multi-Level Dynamic Converter for Supply Modulated PAs","authors":"Connor Nogales, Z. Popovic, G. Lasser","doi":"10.23919/EuMC50147.2022.9784375","DOIUrl":"https://doi.org/10.23919/EuMC50147.2022.9784375","url":null,"abstract":"A high power multi-level supply modulator (SM) for phased array applications using E-mode GaN HEMTs is presented. The switching device selection and circuit considerations are discussed, as well as the required electromagnetic (EM) modeling of the output trace to accurately predict the output waveforms. The SM experimentally demonstrates switching up to 10 MHz between four discrete output voltages from 10 V to 20 V, delivering peak powers of 600 W at 92.6% efficiency.","PeriodicalId":413113,"journal":{"name":"2021 51st European Microwave Conference (EuMC)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129479746","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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