Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics最新文献

Polymeric Coating of Optical Silica Fibers, and a Nanomaterial-Based Coating System 光学二氧化硅纤维的聚合物涂层及纳米材料涂层体系

Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2007-10-08 DOI: 10.1109/POLYTR.2007.4339162

E. Suhir

引用次数: 2

Printed touch sensor for interactive packaging and display 用于交互式包装和显示的印刷触摸传感器

Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2007-10-08 DOI: 10.1109/POLYTR.2007.4339128

T. Unander, H. Nilsson, B. Oelmann

引用次数: 24

Design of organic-inorganic hybrid membrane for polymer type fuel cell applications 聚合物型燃料电池用有机-无机杂化膜的设计

Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2007-10-08 DOI: 10.1109/POLYTR.2007.4339178

P. Knauth, M. Di Vona

引用次数: 0

Novel Low-Transmission-Loss Multilayer Materials for PWBs Applied to High GHz Bands 应用于高GHz频段的新型低传输损耗pcb多层材料

Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2007-10-08 DOI: 10.1109/POLYTR.2007.4339139

H. Shimizu

引用次数: 1

Silicon Wafer Bonding by Modified Surface Activated Bonding Methods 改良表面活化键合方法之矽晶圆键合

Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2007-10-08 DOI: 10.1109/POLYTR.2007.4339133

Chenxi Wang, E. Higurashi, T. Suga

引用次数: 2

Intermediate Temperature Proton Electrolytes for Polymer Fuel Cells 聚合物燃料电池用中温质子电解质

Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2007-10-08 DOI: 10.1109/POLYTR.2007.4339144

Jedeok Kim, T. Mori, I. Honma

引用次数: 1

Stress Monitoring in Epoxy Resins and Embedded Components during Packaging and Curing Processes 环氧树脂和嵌入式组件在封装和固化过程中的应力监测

Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2007-10-08 DOI: 10.1109/POLYTR.2007.4339180

T. Schreier-Alt, K. Badstuebner, C. Rebholz, F. Ansorge, H. Reichl

引用次数: 0

Flexible LCP and Paper-based Substrates with Embedded Actives, Passives, and RFIDs 柔性LCP和纸质基板与嵌入式有源，无源，和rfid

Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2007-10-08 DOI: 10.1109/POLYTR.2007.4339159

S. Bhattacharya, M. Tentzeris, Li Yang, S. Basat, A. Rida

{"title":"Flexible LCP and Paper-based Substrates with Embedded Actives, Passives, and RFIDs","authors":"S. Bhattacharya, M. Tentzeris, Li Yang, S. Basat, A. Rida","doi":"10.1109/POLYTR.2007.4339159","DOIUrl":"https://doi.org/10.1109/POLYTR.2007.4339159","url":null,"abstract":"Miniaturization with increased functionality at reduced cost historically has been the key driver for the evolution of electronics products. However, the size reduction was traditionally confined to lateral dimensions, until recently in the 21st century, the real estate in the Z-direction has been severely compromised, therefore, THIN has become the buzz word encompassing thin die, thin dielectric, thin passives, thin core and ultimately leading to thin packages. This paper overviews the trends from thick to thin electronic products, materials, processes, and manufacturing of the thick and thin packages with embedded passive components such as resistors, capacitors, inductors, and lately the Actives. Flexible organics with embedded IC and thin film passive materials and substrates that can perform at frequencies in the range 2-110 GHz has been established with liquid crystal polymers . A roadmap for the realization of highly integrated RPID tags with wireless sensors and thin film batteries on ULTIMATE low-cost synthetic material such as photocopy papers has been addressed. To this regard, special attention is given to miniaturization of antennas and on specific techniques for ultra-high-efficiency (95%) RFID's. Examples of paper-based conductive Ink-Jet printed circuits as well as copper circuitary by etching have been investigated as a means for further cost reduction including ultra-thin printed batteries and power-scavenging devices, as well as to miniaturized sensors (temperature, chemical, pressure) that would enable long-range ubiquitous sensing. Dielectric constants and dielectric loss measurements on paper-substrates are reported for the first time at frequency >1GHz.","PeriodicalId":412754,"journal":{"name":"Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-10-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117048999","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 8

Metallization of Cu on Parylene-C Film Micro-patterned by Hot-embossing 热压成型聚苯二烯- c薄膜上Cu的金属化

Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2007-10-08 DOI: 10.1109/POLYTR.2007.4339135

S. Youn, A. Ueno, M. Takahashi, R. Maeda

引用次数: 1

Temperature Controlled Capillary Driven Sequential Stacking Self-Assembly using Two Different Adhesives 温度控制毛细管驱动顺序堆叠自组装使用两种不同的粘合剂

Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2007-10-08 DOI: 10.1109/POLYTR.2007.4339153

Y. Higuchi, K. Sugano, T. Tsuchiya, O. Tabata

{"title":"Temperature Controlled Capillary Driven Sequential Stacking Self-Assembly using Two Different Adhesives","authors":"Y. Higuchi, K. Sugano, T. Tsuchiya, O. Tabata","doi":"10.1109/POLYTR.2007.4339153","DOIUrl":"https://doi.org/10.1109/POLYTR.2007.4339153","url":null,"abstract":"In this paper, a new temperature controlled sequential stacking self-assembly technique is proposed. This method utilizes capillary force generated by two different liquid of TEGDMA (triethyleneglycol dimethacrylate) and 42Sn-58Bi solder as adhesives. TEGDMA with an additional thermal initiator is liquid at room temperature and hardens by heat. 42Sn-58Bi solder is solid at room temperature and melts at 138 degC. Since TEGDMA and 42Sn-58Bi solder are selectively utilized as adhesives by setting the process temperature at room temperature for TEGDMA and 150 degC for 42Sn-58Bi solder, the sequential self-assembly of different components can be realized. The feasibility of the proposed process and alignment accuracy are experimentally and theoretically examined using 1 mm square silicon chips as test components. The first component assembly on a substrate is carried out at room temperature using TEGDMA, and the second component assembly on the assembled component is carried out at 150 degC using 42Sn-58Bi solder. Both assembly steps are carried out in EG (Ethylene Glycol) solvent with an additional sulfuric acid. It was confirmed that the first and the second assembly were successfully done at room temperature and at 150 degC, and alignment accuracy of the first and the second assembly were 33 mum and a few mum, respectively.","PeriodicalId":412754,"journal":{"name":"Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-10-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125943241","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1