Annual Review of Heat Transfer最新文献

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THERMAL TRANSPORT IN NANOSTRUCTURED ORGANIC-INORGANIC HYBRID MATERIALS 纳米结构有机-无机杂化材料的热输运
Annual Review of Heat Transfer Pub Date : 1900-01-01 DOI: 10.1615/ANNUALREVHEATTRANSFER.2016014222
W. Ong, J. Malen
{"title":"THERMAL TRANSPORT IN NANOSTRUCTURED ORGANIC-INORGANIC HYBRID MATERIALS","authors":"W. Ong, J. Malen","doi":"10.1615/ANNUALREVHEATTRANSFER.2016014222","DOIUrl":"https://doi.org/10.1615/ANNUALREVHEATTRANSFER.2016014222","url":null,"abstract":"","PeriodicalId":402656,"journal":{"name":"Annual Review of Heat Transfer","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115712827","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
PHOTOACOUSTIC TECHNIQUE FOR THERMAL CONDUCTIVITY AND THERMAL INTERFACE MEASUREMENTS 热导率和热界面测量的光声技术
Annual Review of Heat Transfer Pub Date : 1900-01-01 DOI: 10.1615/ANNUALREVHEATTRANSFER.V16.50
Xinwei Wang, B. Cola, Thomas L. Bougher, S. Hodson, T. Fisher, Xianfan Xu
{"title":"PHOTOACOUSTIC TECHNIQUE FOR THERMAL CONDUCTIVITY AND THERMAL INTERFACE MEASUREMENTS","authors":"Xinwei Wang, B. Cola, Thomas L. Bougher, S. Hodson, T. Fisher, Xianfan Xu","doi":"10.1615/ANNUALREVHEATTRANSFER.V16.50","DOIUrl":"https://doi.org/10.1615/ANNUALREVHEATTRANSFER.V16.50","url":null,"abstract":"The photoacoustic (PA) technique is one of many techniques for characterizing thermal conductivity of materials, including thermal interface conductance or resistance. Compared with other techniques, the PA method is relatively simple, yet is able to provide accurate thermal conductivity data over a wide range of materials and properties. In the last decade, the PA method has been developed and employed for measuring thermal properties of many materials. In this chapter, we will discuss the theory of the PA method for thermal conductivity/thermal interface resistance measurement. We will also describe experimental implementation of the PA method. Finally, we will discuss a recent application of using the PA method for characterizing thermal interface resistance of carbon nanotube–based thermal interface materials.","PeriodicalId":402656,"journal":{"name":"Annual Review of Heat Transfer","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116893056","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 21
NUMERICAL METHODS FOR MULTIDIMENSIONAL RADIATIVE TRANSFER ANALYSIS IN PARTICIPATING MEDIA 参与介质中多维辐射传递分析的数值方法
Annual Review of Heat Transfer Pub Date : 1900-01-01 DOI: 10.1615/ANNUALREVHEATTRANSFER.V1.80
S. Chan
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引用次数: 15
PREFACE: THERMAL TRANSPORT IN ADVANCED MATERIALS MANUFACTURING 前言:先进材料制造中的热传递
Annual Review of Heat Transfer Pub Date : 1900-01-01 DOI: 10.1615/ANNUALREVHEATTRANSFER.V20.10
Gang Chen
{"title":"PREFACE: THERMAL TRANSPORT IN ADVANCED MATERIALS MANUFACTURING","authors":"Gang Chen","doi":"10.1615/ANNUALREVHEATTRANSFER.V20.10","DOIUrl":"https://doi.org/10.1615/ANNUALREVHEATTRANSFER.V20.10","url":null,"abstract":"","PeriodicalId":402656,"journal":{"name":"Annual Review of Heat Transfer","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127487275","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
EXPERIMENTAL EXPLORATION OF NEAR-FIELD RADIATIVE HEAT TRANSFER 近场辐射换热的实验研究
Annual Review of Heat Transfer Pub Date : 1900-01-01 DOI: 10.1615/annualrevheattransfer.2020032656
M. Ghashami, Amun Jarzembski, Mikyung Lim, Bong Jae Lee, Keunhan Park
{"title":"EXPERIMENTAL EXPLORATION OF NEAR-FIELD RADIATIVE HEAT TRANSFER","authors":"M. Ghashami, Amun Jarzembski, Mikyung Lim, Bong Jae Lee, Keunhan Park","doi":"10.1615/annualrevheattransfer.2020032656","DOIUrl":"https://doi.org/10.1615/annualrevheattransfer.2020032656","url":null,"abstract":"","PeriodicalId":402656,"journal":{"name":"Annual Review of Heat Transfer","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125331715","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
CRITICAL HEAT FLUX: AN OVERVIEW 临界热通量:概述
Annual Review of Heat Transfer Pub Date : 1900-01-01 DOI: 10.1615/annualrevheattransfer.2020033343
D. K. Chandraker, A. Dasgupta, A. Nayak
{"title":"CRITICAL HEAT FLUX: AN OVERVIEW","authors":"D. K. Chandraker, A. Dasgupta, A. Nayak","doi":"10.1615/annualrevheattransfer.2020033343","DOIUrl":"https://doi.org/10.1615/annualrevheattransfer.2020033343","url":null,"abstract":"","PeriodicalId":402656,"journal":{"name":"Annual Review of Heat Transfer","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125512882","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
THIN FILM THERMOELECTRIC CHARACTERIZATION TECHNIQUES 薄膜热电表征技术
Annual Review of Heat Transfer Pub Date : 1900-01-01 DOI: 10.1615/ANNUALREVHEATTRANSFER.V16.30
J. Bahk, T. Favaloro, A. Shakouri
{"title":"THIN FILM THERMOELECTRIC CHARACTERIZATION TECHNIQUES","authors":"J. Bahk, T. Favaloro, A. Shakouri","doi":"10.1615/ANNUALREVHEATTRANSFER.V16.30","DOIUrl":"https://doi.org/10.1615/ANNUALREVHEATTRANSFER.V16.30","url":null,"abstract":"The key thin film thermoelectric characterization techniques are described. Due to the small dimensions, a careful examination of electrical and thermal paths in the device is necessary. We describe both in-plane and cross-plane measurement methodologies. Sample requirements for four-probe and van der Pauw methods for in-plane electrical conductivity measurement are discussed. The in-plane Seebeck coefficient is characterized under a temperature gradient which generates a voltage. Precise measurements of temperature and voltage at the same location in the sample are very important. For the cross-plane electrical conductivity, the modified transmission line method is evaluated. To eliminate parasitic contact and substrate resistances, several samples with varying thicknesses are required. Two approaches, a DC method and the 3ω method, are described in detail for the cross-plane Seebeck coefficient characterization. Next, we focus on the transient Harman method to directly measure the cross-plane thermoelectric figure of merit of a thin film. The device requirements for reducing parasitic heat losses and current nonuniformity are presented. Thermoreflectance imaging can be used together with transient Harman in order to extract electrical and thermal conductivities and the Seebeck coefficient simultaneously. Finally, Z-meters are described for directly determining the figure of merit and efficiency of a thermoelectric element or module under a large temperature gradient. Recent developments have significantly reduced thermal and electrical parasitics, as well as radiation heat loss in the system, enabling ZT measurement of legs as thin as one hundred microns.","PeriodicalId":402656,"journal":{"name":"Annual Review of Heat Transfer","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125684054","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 20
AN OVERVIEW OF PROCESS TEMPERATURE CONTROL IN SOLAR THERMOCHEMICAL ENERGY STORAGE SYSTEMS 太阳能热化学储能系统过程温度控制综述
Annual Review of Heat Transfer Pub Date : 1900-01-01 DOI: 10.1615/annualrevheattransfer.2023047757
Assaad Alsahlani, Nesrin Ozalp
{"title":"AN OVERVIEW OF PROCESS TEMPERATURE CONTROL IN SOLAR THERMOCHEMICAL ENERGY STORAGE SYSTEMS","authors":"Assaad Alsahlani, Nesrin Ozalp","doi":"10.1615/annualrevheattransfer.2023047757","DOIUrl":"https://doi.org/10.1615/annualrevheattransfer.2023047757","url":null,"abstract":"","PeriodicalId":402656,"journal":{"name":"Annual Review of Heat Transfer","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115044706","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
PROBING NANOSCALE HEAT TRANSFER PHENOMENA 探索纳米尺度的传热现象
Annual Review of Heat Transfer Pub Date : 1900-01-01 DOI: 10.1615/ANNUALREVHEATTRANSFER.V16.10
Gang Chen
{"title":"PROBING NANOSCALE HEAT TRANSFER PHENOMENA","authors":"Gang Chen","doi":"10.1615/ANNUALREVHEATTRANSFER.V16.10","DOIUrl":"https://doi.org/10.1615/ANNUALREVHEATTRANSFER.V16.10","url":null,"abstract":"","PeriodicalId":402656,"journal":{"name":"Annual Review of Heat Transfer","volume":"134 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122296268","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
COATING DEPOSITION BY THERMAL SPRAY PROCESSES 采用热喷涂工艺沉积涂层
Annual Review of Heat Transfer Pub Date : 1900-01-01 DOI: 10.1615/ANNUALREVHEATTRANSFER.2018019747
S. Chandra
{"title":"COATING DEPOSITION BY THERMAL SPRAY PROCESSES","authors":"S. Chandra","doi":"10.1615/ANNUALREVHEATTRANSFER.2018019747","DOIUrl":"https://doi.org/10.1615/ANNUALREVHEATTRANSFER.2018019747","url":null,"abstract":"","PeriodicalId":402656,"journal":{"name":"Annual Review of Heat Transfer","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116820904","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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