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IEICE technical report. Component parts and materials最新文献

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Evaluation of GaN substrates for vertical GaN power device applications 垂直GaN功率器件应用GaN衬底的评价
IEICE technical report. Component parts and materials Pub Date : 2012-05-10 DOI: 10.18494/sam.2013.881
Kachi Tetsu, Uesugi Tsutomu
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引用次数: 6
Normally-off AlGaN/GaN HEMT with Recessed Gate for High Power Applications 常关AlGaN/GaN HEMT与嵌入式栅极高功率应用
IEICE technical report. Component parts and materials Pub Date : 2005-09-13 DOI: 10.7567/SSDM.2005.I-1-3
K. Nakata, T. Kawasaki, S. Yaegassi
{"title":"Normally-off AlGaN/GaN HEMT with Recessed Gate for High Power Applications","authors":"K. Nakata, T. Kawasaki, S. Yaegassi","doi":"10.7567/SSDM.2005.I-1-3","DOIUrl":"https://doi.org/10.7567/SSDM.2005.I-1-3","url":null,"abstract":"","PeriodicalId":366248,"journal":{"name":"IEICE technical report. Component parts and materials","volume":"201 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116167906","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
High-speed signal transmission at the front of a bookshelf packaging system 高速信号传输在书架包装系统的前端
IEICE technical report. Component parts and materials Pub Date : 1996-08-20 DOI: 10.1109/96.641503
S. Koike, K. Kaizu
{"title":"High-speed signal transmission at the front of a bookshelf packaging system","authors":"S. Koike, K. Kaizu","doi":"10.1109/96.641503","DOIUrl":"https://doi.org/10.1109/96.641503","url":null,"abstract":"A front-connection technique using the front-side of the circuit board in rack systems configured like bookshelves is proposed to increase pin-counts for high-throughput switching modules (>20 Gb/s). This configuration technique was implemented using newly developed front connectors and flexible printed-circuit (FPC) cables that are both impedance-matched. This configuration enables the use of a new transmission route that meanders through every signal transmission line of every circuit board, backplane, and FPC cable. This route can extend the functional block size from the size of the circuit board to that of the unit, In a signal transmission experiment between circuit boards with this meander route passing through signal lines of an 18-cm-long FPC cable and over a distance of ten slots in the backplane, error-free (<10/sup -11/) signal transmission of 2/sup 23/-1 nonreturn-to-zero (NRZ) pseudo-random bit sequences (PRBS) at 622.08 Mb/s was obtained.","PeriodicalId":366248,"journal":{"name":"IEICE technical report. Component parts and materials","volume":"96 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-08-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128853123","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
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