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Proceedings of the International Conference Modern Problems of Radio Engineering, Telecommunications and Computer Science, 2004.最新文献

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MVC model, struts framework and file upload issues in web applications based on J2EE platform 基于J2EE平台的web应用程序中的MVC模型、struts框架和文件上传问题
Proceedings of the International Conference Modern Problems of Radio Engineering, Telecommunications and Computer Science, 2004. Pub Date : 2004-12-20 DOI: 10.1109/TCSET.2004.1365980
J. Wojciechowski, B. Sakowicz, K. Dura, A. Napieralski
{"title":"MVC model, struts framework and file upload issues in web applications based on J2EE platform","authors":"J. Wojciechowski, B. Sakowicz, K. Dura, A. Napieralski","doi":"10.1109/TCSET.2004.1365980","DOIUrl":"https://doi.org/10.1109/TCSET.2004.1365980","url":null,"abstract":"This work describes the web applications based on the J2EE platform indicating the model-view-controller (MVC) model, struts framework and file upload issues. The development of internet technology and the will to standardize the mechanisms used in implementation of internet applications was the basis background for the development of J2EE platform. The project of international office TUL internet service is an application based on the above mentioned environment. The specification of the project is closely connected with the activities and needs of the staff of the international office. The article presents the use of MVC model on J2EE platform on an example of open source Apache/Tomcat server and the database management system MySql.","PeriodicalId":363064,"journal":{"name":"Proceedings of the International Conference Modern Problems of Radio Engineering, Telecommunications and Computer Science, 2004.","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-12-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115295989","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 49
Layout based thermal simulations of 3D integrated circuits 基于布局的三维集成电路热仿真
Proceedings of the International Conference Modern Problems of Radio Engineering, Telecommunications and Computer Science, 2004. Pub Date : 2004-12-20 DOI: 10.1007/978-3-540-25944-2_133
K. Slusarczyk, M. Kamiński, A. Napieralski
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引用次数: 2
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