{"title":"Layout based thermal simulations of 3D integrated circuits","authors":"K. Slusarczyk, M. Kamiński, A. Napieralski","doi":"10.1007/978-3-540-25944-2_133","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":363064,"journal":{"name":"Proceedings of the International Conference Modern Problems of Radio Engineering, Telecommunications and Computer Science, 2004.","volume":"17 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-12-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the International Conference Modern Problems of Radio Engineering, Telecommunications and Computer Science, 2004.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1007/978-3-540-25944-2_133","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}