2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)最新文献

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Highly Thermally Conductive Substrate Based on Graphene Film 基于石墨烯薄膜的高导热衬底

2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) Pub Date : 2021-09-13 DOI: 10.23919/empc53418.2021.9584965

Zhenlin Lv, Chenfei Zhou, Xiuzhen Lu, Johan Liu

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