{"title":"Fault Detection And Classification In Linear Microcircuits","authors":"B. R. Epstein, M. Czigler","doi":"10.1109/ELECTR.1991.718227","DOIUrl":"https://doi.org/10.1109/ELECTR.1991.718227","url":null,"abstract":"Classical discrimination analysis and neural network techniques are used to detect and classify possible faults in linear microcircuits. The success rates of simulated fault detection and classification are described for various types of analog and mixed-mode circuits.","PeriodicalId":339281,"journal":{"name":"Electro International, 1991","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122180061","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"New Innovative Specialty Memory Devices Speed Up System Performance","authors":"Z. Amitai, D. Wyland","doi":"10.1109/ELECTR.1991.718187","DOIUrl":"https://doi.org/10.1109/ELECTR.1991.718187","url":null,"abstract":"Specialty memory devices has been a driving force in innovative system design. Specialty devices are combinations of memory and logic, other than the microcomputer combination, that address a wide variety of applications. They have traditionally offered solutions to critical performance requirements that were otherwise prohibitively expensive or not feasible. As system speeds and integration levels of integrated circuits change, specialty memory devices follow suit, while gaining new applications, and larger markets.","PeriodicalId":339281,"journal":{"name":"Electro International, 1991","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123933524","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Quality And Capacity In Cellular","authors":"W.C.-Y. Lee","doi":"10.1109/ELECTR.1991.718267","DOIUrl":"https://doi.org/10.1109/ELECTR.1991.718267","url":null,"abstract":"In cellular systems, voice quality should be the first concern, then capacity, then cost. Otherwise by increasing system capacity, voice quality will be degraded. This paper will use the radio capacity formula to measure the capacity and deduce many findings.","PeriodicalId":339281,"journal":{"name":"Electro International, 1991","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130156048","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Metal Insulator Structures For Multichip Modules","authors":"P. Kohl","doi":"10.1109/ELECTR.1991.718215","DOIUrl":"https://doi.org/10.1109/ELECTR.1991.718215","url":null,"abstract":"The technology and material choices available for MCMs are discussed in terms of a cost-yield model. The basic building blocks of MCMs are presented and viewed in terms of the number of processing steps, defect density and processing costs.","PeriodicalId":339281,"journal":{"name":"Electro International, 1991","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130383942","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Status And Future Prospects For Thin Film Amorphous Silicon And Polycrystalline Solar Cells","authors":"R. Arya","doi":"10.1109/ELECTR.1991.718295","DOIUrl":"https://doi.org/10.1109/ELECTR.1991.718295","url":null,"abstract":"Thin-film photovoltaics are emerging as a low cost alternative to the present crystalline silicon solar cell technology. The present status and future prospects of three thin-film technologies based on Amorphous Silicon, Copper-Indium-Selenide and Cadmium Telluride are reviewed.","PeriodicalId":339281,"journal":{"name":"Electro International, 1991","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129422764","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Low, Medium And High Circuit Density Multichip Modules","authors":"A. Prabhu","doi":"10.1109/ELECTR.1991.718213","DOIUrl":"https://doi.org/10.1109/ELECTR.1991.718213","url":null,"abstract":"Multichip modules (MCMS) employ uncased chips mounted and interconnected on multilayer circuit boards. The interconnect is fabricated using alternate layers of conductor and dielectric thin films connected by vias through the interlayer dielectric. Depending upon the performance, assembly flexibility and cost considerations, various approches can be used for fabricating and packaging MCMs. A number of circuit board technologies and packaging schemes applicable to different MCM applications are summarized in this paper. An effort is made to classify these MCMs into low, moderabe or high circuit density types. Several examples are provided to point out the suitability of various MCM approaches to the selected applications.","PeriodicalId":339281,"journal":{"name":"Electro International, 1991","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129005919","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Designing Serial EEPROMS Into Microcontroller Systems","authors":"P. Lee","doi":"10.1109/ELECTR.1991.718169","DOIUrl":"https://doi.org/10.1109/ELECTR.1991.718169","url":null,"abstract":"Serial EEPROM devices are finding their way into more and more microcontroller applications. Almost any microcontroller system can find a use for EEPROM to store necessary software parameters or to provide read/write flexibility to the product. For the most part, semiconductor manufacturers have not found cost effective means for processing EEPROM on the same chip as the microcontroller. As a result semiconductor manufacturers such as National Semiconductor and ICT have developed families of low density serial EEPROMs targeted for use in microcontroller applications. The serial EEPROM provides microcontroller system designers with a simple interface to accessing small amounts of nonvolatile memory with virtually no sacrifice to board space.","PeriodicalId":339281,"journal":{"name":"Electro International, 1991","volume":"173 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122660332","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Regulatory Issues Of Field Exposure","authors":"F. Sterzer","doi":"10.1109/ELECTR.1991.718198","DOIUrl":"https://doi.org/10.1109/ELECTR.1991.718198","url":null,"abstract":"","PeriodicalId":339281,"journal":{"name":"Electro International, 1991","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1991-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115265687","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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