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Handbook of Electronic Package Design最新文献

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Interconnections and Connectors 互连和连接器
Handbook of Electronic Package Design Pub Date : 2018-10-24 DOI: 10.1201/9781315214085-5
P. Lall, M. Pecht
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引用次数: 0
Layout 布局
Handbook of Electronic Package Design Pub Date : 2018-10-24 DOI: 10.1201/9781315214085-6
M. Osterman, Michael G. Pecht
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引用次数: 0
Thermomechanical Analysis and Design 热力分析与设计“，
Handbook of Electronic Package Design Pub Date : 2018-10-24 DOI: 10.1201/9781315214085-8
A. Dasgupta
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引用次数: 0
Design for Vibration and Shock 振动和冲击设计
Handbook of Electronic Package Design Pub Date : 2018-10-24 DOI: 10.1201/9781315214085-9
D. B. Barker
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引用次数: 0
Humidity and Corrosion Analysis and Design 湿度和腐蚀分析与设计
Handbook of Electronic Package Design Pub Date : 2018-10-24 DOI: 10.1201/9781315214085-10
M. Pecht
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引用次数: 0
Electronic Materials and Properties 电子材料与性能
Handbook of Electronic Package Design Pub Date : 2018-10-24 DOI: 10.1201/9781315214085-12
J. Y. Evans, J. Evans
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引用次数: 0
Electronic Assemblies 电子组件
Handbook of Electronic Package Design Pub Date : 2018-10-24 DOI: 10.1201/9781315214085-4
D. B. Harris
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引用次数: 0
Printed Wiring Board Design and Fabrication 印刷线路板设计与制造
Handbook of Electronic Package Design Pub Date : 2018-10-24 DOI: 10.1201/9781315214085-3
D. B. Harris, P. Lall
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引用次数: 0
Thermal Design Analysis 热设计分析
Handbook of Electronic Package Design Pub Date : 2018-10-24 DOI: 10.1201/9781315214085-7
Dennis K. Karr, M. Palmer, D. Dancer
{"title":"Thermal Design Analysis","authors":"Dennis K. Karr, M. Palmer, D. Dancer","doi":"10.1201/9781315214085-7","DOIUrl":"https://doi.org/10.1201/9781315214085-7","url":null,"abstract":"","PeriodicalId":298078,"journal":{"name":"Handbook of Electronic Package Design","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117154702","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Electronic Components 电子元件
Handbook of Electronic Package Design Pub Date : 2018-10-24 DOI: 10.1063/1.3061158
D. B. Harris, M. Pecht, P. Lall
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引用次数: 0
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