International Conference on Experimental Mechanics最新文献

Dynamic imaging of micro-particles in 3D using lensless in-line digital holographic microscopy 使用无透镜在线数字全息显微镜对微粒子进行三维动态成像

International Conference on Experimental Mechanics Pub Date : 2009-12-04 DOI: 10.1117/12.851420

V. Singh, E. Darakis, A. Asundi

引用次数: 0

Application of computed tomography to quality inspection of brass alloy 计算机断层扫描技术在黄铜合金质量检测中的应用

International Conference on Experimental Mechanics Pub Date : 2009-12-04 DOI: 10.1117/12.851261

G. Suparta, N. Handayani

{"title":"Application of computed tomography to quality inspection of brass alloy","authors":"G. Suparta, N. Handayani","doi":"10.1117/12.851261","DOIUrl":"https://doi.org/10.1117/12.851261","url":null,"abstract":"A research on application computed tomography to quality inspection of brass alloy has been done. The aim of the research was to study the capability of computed tomography system with source radiation isotope I-131 in order to mapping different quality of any type of brass alloy and study on the influence of activity of isotope I131 to the reconstructed image has been done. The inspection has been done by scanning three type of brass alloy, and comparing to the metal Cu and Zn which are the fundamental substances of brass alloy. The quality of brass alloy was identified through the profile of absorption of radiation and the distribution value of linear coefficient attenuation (μ) on the image and image contrast. The influence of activity isotope I-131 was studied by performance through the sinogram and reconstructed image. The result showed that the good quality of brass alloy have highest absorption of radiation than the bad quality of brass alloy, which were represented by the higher value of μ. From the visual observation on the reconstructed image, it showed that the higher activity of isotope I-131 would be used on the scanning process, the sharper sinogram contrast and reconstructed image contrast.","PeriodicalId":289489,"journal":{"name":"International Conference on Experimental Mechanics","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115654337","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Two-step dc-term-suppressed phase shifting technique in DSPI DSPI中两步直流项抑制相移技术

International Conference on Experimental Mechanics Pub Date : 2009-12-04 DOI: 10.1117/12.848923

B. Bhaduri, C. Tay, C. Quan

引用次数: 0

Curvature measurement system of Si-wafer using circular gratings 圆光栅硅晶片曲率测量系统

International Conference on Experimental Mechanics Pub Date : 2009-12-04 DOI: 10.1117/12.851832

C. Ng, A. Asundi

{"title":"Curvature measurement system of Si-wafer using circular gratings","authors":"C. Ng, A. Asundi","doi":"10.1117/12.851832","DOIUrl":"https://doi.org/10.1117/12.851832","url":null,"abstract":"Flatness/Curvature measurement is critical in many Si-wafer based technologies ranging from micro-electronics to MEMS and to the current PV industry. As the thickness of the wafer becomes smaller there is an increased tendency for it to warp and this is not conducive to both patterning as well as dicing. Monitoring of curvature/flatness is thus necessary to ensure reliability of device and its uses. However, due to the prevalence of surface flatness measurement systems that flooded the market, the cycle time for curvature measurement system has become one of the critical factors for the user to consider. A simple and rapid whole-field curvature measurement system using a novel a computer aided phase shift reflection grating method has been developed and discussed in the previous publications. Laterals gratings in horizontal has vertical directions are needed in order to realize the curvature information on the wafer in both directions. In this paper, with same system setup, circular grating is being projected on to the specimen to measure the curvature distribution of the wafer. With the aid of coordinate-transform method and the digital phase-shifting technique, the digital images of reflected gratings are processed automatically and analyzed in the polar coordinate system. Unlike vertical or horizontal line gratings, the utilization of the circular gratings in radial shearing method provides curvature information in all directions, not only in one. Further, only four phase shifted images are captured and the measurement cycle time is thus reduced by half.","PeriodicalId":289489,"journal":{"name":"International Conference on Experimental Mechanics","volume":"2006 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125559787","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Development of optical FBG force measurement system for the medical application 医用光纤光栅力测量系统的研制

International Conference on Experimental Mechanics Pub Date : 2009-12-04 DOI: 10.1117/12.851630

Ho-Seok Song, Kiyoung Kim, Jungwook Suh, Jung-Ju Lee

{"title":"Development of optical FBG force measurement system for the medical application","authors":"Ho-Seok Song, Kiyoung Kim, Jungwook Suh, Jung-Ju Lee","doi":"10.1117/12.851630","DOIUrl":"https://doi.org/10.1117/12.851630","url":null,"abstract":"Haptic feedback plays a very important role in medical surgery. In minimally invasive surgery (MIS), however, very long and stiff bar of instruments take haptic feeling away from the surgeon. In minimally invasive robotic surgery (MIRS), moreover, haptic feelings are totally eliminated. Previous researchers have reported that the absence of force feedback increased the average force magnitude applied to the tissue by at least 50%, and increased the peakforce magnitude by at least a factor of two. Therefore, it is very important to provide haptic information in MIRS. Recently, many sensors are being developed for MIS or MIRS, but they have some obstacles in their application to real situations of medical surgery. The most critical problems are size limit and sterilizability. Optical fiber sensors are one of the most suitable sensors for this environment. Especially, optical fiber Bragg grating (FBG) sensor has one additional advantage than the other optical fiber sensors. FBG sensor is not influenced by intensity of light source. In this paper, we would like to present the initial results of study on the application of the FBG sensor to measure reflected forces in MIRS environments and then suggest the possibility of successful application to the MIRS systems.","PeriodicalId":289489,"journal":{"name":"International Conference on Experimental Mechanics","volume":"148 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116560668","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Residual stress in porous silicon film with micro-Raman spectroscopy 用微拉曼光谱分析多孔硅膜的残余应力

International Conference on Experimental Mechanics Pub Date : 2009-12-04 DOI: 10.1117/12.851264

W. Qiu, Qiu Li, Yilan Kang, Z. Lei

{"title":"Residual stress in porous silicon film with micro-Raman spectroscopy","authors":"W. Qiu, Qiu Li, Yilan Kang, Z. Lei","doi":"10.1117/12.851264","DOIUrl":"https://doi.org/10.1117/12.851264","url":null,"abstract":"Porous silicon (PS) film was widely used in micro-systems sensors duo to its special properties. Nevertheless, intrinsic and processing residual stresses always introduced into porous silicon, always inducing the collapses and cracks inside the film and on the interface when the PS structure in service and/or during manufacture and storage. This paper presents a systematic study on the Raman stress measurement of porous silicon. Firstly, a theoretical model on the analytic relationship between stress and Raman-shift is presented by analyzing the micro-structures and transversely isotropy property of forest-like porous silicon film prepared on Si wafer by electrochemical etching. Meanwhile, the nano-indentation and digital Speckle correlations is utilized to determined the Young's moduli and Poisson's ratios of the PS samples, respectively. Based on the theoretical model and material parameters above, the coefficients in the Raman to stress relationship of porous silicon are achieved. By applying Micro-Raman spectroscopy, the distribution of intrinsic residual stress along the depth of PS-film/Si-substrate structure is measured. Then, a dynamical capillarity experiment is preformed to analyze the real-time stress transformation during PS drying, and the failure mechanisms by capillarity are discussed.","PeriodicalId":289489,"journal":{"name":"International Conference on Experimental Mechanics","volume":"65 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122405625","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Improved active non-destructive inspection using periodic binary heating sequences 改进了采用周期性二元加热序列的主动无损检测

International Conference on Experimental Mechanics Pub Date : 2009-12-04 DOI: 10.1117/12.851503

G. Arroud, P. Guillaume

引用次数: 0

Changes in magnetic flux density around fatigue crack tips of carbon tool steels 碳素工具钢疲劳裂纹尖端磁通密度的变化

International Conference on Experimental Mechanics Pub Date : 2009-12-04 DOI: 10.1117/12.851780

T. Honda, K. Kida, E. Santos, H. Tanabe

{"title":"Changes in magnetic flux density around fatigue crack tips of carbon tool steels","authors":"T. Honda, K. Kida, E. Santos, H. Tanabe","doi":"10.1117/12.851780","DOIUrl":"https://doi.org/10.1117/12.851780","url":null,"abstract":"Fatigue failure of steel occurs when small cracks form in a component and then continue to grow to a size large enough to cause failure. In order to understand the strength of steel components it is important to find the cracks which eventually grow to cause failures. However, at present, it is not easy to distinguish, in the early stages of growth, the cracks which will grow fast and cause failure. We hypothesized that it may be possible to distinguish them by comparing changes in the magnetic flux density around the tips of those cracks that grew large enough to cause failure. In order to measure these changes in magnetic flux density, we developed a scanning Hall probe microscope and observed the fatigue cracks growing from artificial slits in carbon tool steels (JIS SKS93). We also compared the changes in magnetic flux density around crack tips which grew under different loads and found that there is a strong correlation between the magnetic flux density, crack growth and stress intensity factors. In order to understand this relation, we measured the changes in the magnetic flux density and residual tensile stress by using an X-ray system, and found that the magnetic flux density changes not only in the plastic deformation area but also in the area of elastic stress field with increased stress.","PeriodicalId":289489,"journal":{"name":"International Conference on Experimental Mechanics","volume":"178 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-12-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122979698","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Characterization of surface tension and contact angle of nanofluids 纳米流体表面张力和接触角的表征

International Conference on Experimental Mechanics Pub Date : 2009-12-04 DOI: 10.1117/12.851278

M. Radiom, Chun Yang, W. Chan

引用次数: 48

Study on the mechanical properties of TiNi shape memory alloy wires using mark shearing system 用标记剪切系统研究TiNi形状记忆合金丝的力学性能

International Conference on Experimental Mechanics Pub Date : 2009-12-04 DOI: 10.1117/12.850989

Tao Hua, H. Xie, F. Dai, Pengwan Chen, F. Huang

引用次数: 0