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New flipchip technology 新型倒装芯片技术
2009 European Microelectronics and Packaging Conference Pub Date : 2009-06-15 DOI: 10.1109/ESTC.2012.6542089
R. Windemuth, Takatoshi Ishikawa
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引用次数: 1
Encapsulation challenges for wafer level packaging 晶圆级封装的封装挑战
2009 European Microelectronics and Packaging Conference Pub Date : 2009-06-15 DOI: 10.1109/EPTC.2009.5416414
TH Eric Kuah, J. Hao, J. Ding, Qf Li, W. Chan, S. Ho, HM Huang, Yj Jiang
{"title":"Encapsulation challenges for wafer level packaging","authors":"TH Eric Kuah, J. Hao, J. Ding, Qf Li, W. Chan, S. Ho, HM Huang, Yj Jiang","doi":"10.1109/EPTC.2009.5416414","DOIUrl":"https://doi.org/10.1109/EPTC.2009.5416414","url":null,"abstract":"The interest of user for WLP has been raised because of benefits such as reduced package thickness, fan-out capability, high I/O, substrate-less process, integration of passives into structure, good thermal and electrical performance. The objective of this paper is to delineate technical challenges and issues that potential adopter of wafer level molding will face, technological solution availability and the broad application of WLP using granulated epoxy and liquid encapsulant such as epoxy, hybrid of epoxy-silicone, silicone. Result base on actual molding trial indicates among the different form of wafer level molding the challenges being faced are similar, including co-planarity, warpage, die shifting, coefficient of thermal expansion matching, incomplete filling, MBF and voiding","PeriodicalId":275745,"journal":{"name":"2009 European Microelectronics and Packaging Conference","volume":"73 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123175458","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 20
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