2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)最新文献

Nearly perfect Ag joints prepared by Ag stress-migration-bonding (SMB) process 采用银应力迁移键合(SMB)工艺制备了近乎完美的银接头

2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) Pub Date : 2018-06-01 DOI: 10.1109/3DPEIM.2018.8525233

Hao Zhang, S. Noh, N. Asatani, Yukiharu Kimoto, A. Suetake, S. Nagao, T. Sugahara, K. Suganuma

引用次数: 0

Power Modules for Pulsed Power Applications Using Phase Change Material 使用相变材料的脉冲功率应用的功率模块

2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) Pub Date : 2018-06-01 DOI: 10.1109/3DPEIM.2018.8525239

Weihua Shao, L. Ran, Zheng Zeng, R. Wu, P. Mawby, Jiang Huaping, D. Kastha, P. Bajpai

{"title":"Power Modules for Pulsed Power Applications Using Phase Change Material","authors":"Weihua Shao, L. Ran, Zheng Zeng, R. Wu, P. Mawby, Jiang Huaping, D. Kastha, P. Bajpai","doi":"10.1109/3DPEIM.2018.8525239","DOIUrl":"https://doi.org/10.1109/3DPEIM.2018.8525239","url":null,"abstract":"The current requirement of a pulsed load may be many times of the average value. To prevent over temperature, short-term over current capability is needed. The over current capability of existing power modules is barely a few microseconds, which is mainly constrained by the junction temperature. This study customizes a power module with enhanced short-term current capability using phase change material (PCM). Thanks to the great thermal capacity of PCM during melting, the power module can support pulsed load three times the rated value for tens of seconds with appropriate PCM. To avoid unacceptably increasing thermal resistance, a metal framework is utilized. Two different 3D printed metal frameworks are presented and compared. Device power losses in a grid-connected inverter is calculated, followed by the thermal model for this case study. Simulation is conducted to show the effects of PCM thickness and proportion concerning the phase change time, dynamic thermal response and steady state thermal resistance, followed by the optimization of design using finite element analyses (FEA). Finally, the effect of the PCM is verified through experiment. When the junction temperature of the device is controlled below the limit, the power module can indeed handle the required large current for an intended duration.","PeriodicalId":262974,"journal":{"name":"2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132458003","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Increasing Electrical and Thermal Performances of VRMs by Using Folded Flexible Substrate 利用折叠柔性基板提高VRMs的电学和热学性能

2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) Pub Date : 2018-06-01 DOI: 10.1109/3DPEIM.2018.8525238

Bo Gao, Xin Zhao, D. Hopkins

引用次数: 0

Reflectometry Based SOH Estimation Scheme for a SiC Buck Converter Having Branched Network 基于反射法的具有分支网络的SiC降压变换器SOH估计方案

2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) Pub Date : 2018-06-01 DOI: 10.1109/3DPEIM.2018.8525237

A. Hanif, Faisal Khan

引用次数: 4

Thermostable porous Ag die-attach structure for high-temperature power devices 用于高温功率器件的热稳定多孔银模贴附结构

2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) Pub Date : 2018-06-01 DOI: 10.1109/3dpeim.2018.8525232

S. Noh, Hao Zhang, K. Suganuma

{"title":"Thermostable porous Ag die-attach structure for high-temperature power devices","authors":"S. Noh, Hao Zhang, K. Suganuma","doi":"10.1109/3dpeim.2018.8525232","DOIUrl":"https://doi.org/10.1109/3dpeim.2018.8525232","url":null,"abstract":"In this work, efforts were made to prepare a thermostable die-attach structure which includes stable sintered porous Ag and multi-layer surface metallization. Silicon carbide particles (SiCp) were added into the Ag sintering paste to improve the high-temperature reliability of sintered Ag joints. Presence of SiCp in the bonding structures inhibited the coarsening of the porous Ag network during high temperature storage (HTS) tests, and the morphology remains similar to that of the as-sintered state. In addition to the Ag paste, on the side of DBC substrates, the thermal reliability of various surface metallization such as Ni, Ti and Pt were also evaluated by shear strength, cross-section morphology and on-resistance test. The results indicated that Ti and Pt diffusion barrier layers played an active role in inhibiting the oxidation of Cu and inter-diffusion between Cu and Ag at high temperatures exceeding 250 °C. While Ni barrier layer showed a relatively weak barrier effect due to the generation of thin oxide layer between Ag and Ni. The changes of on-resistance indicated that Pt metallization has a relatively better electrical property comparing to that of Ti and Ni. Ag metallization which lacks of barrier layers showed a severe growth of oxide layer between Ag and Cu, however, the on-resistance showed less changes, which needs further studies.","PeriodicalId":262974,"journal":{"name":"2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134467278","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

3D-PEIM 2018 Copyright Page 3D-PEIM 2018版权页面

2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) Pub Date : 2018-06-01 DOI: 10.1109/3dpeim.2018.8525230

引用次数: 0

Impact of Accelerated Stress-Tests on SiC MOSFET Precursor Parameters 加速应力测试对SiC MOSFET前驱体参数的影响

2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) Pub Date : 2018-06-01 DOI: 10.1109/3DPEIM.2018.8525234

J. P. Kozak, K. Ngo, D. DeVoto, J. Major

引用次数: 17

3D-PEIM 2018 Cover Page 3D-PEIM 2018封面

2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) Pub Date : 2018-06-01 DOI: 10.1109/3dpeim.2018.8525235

引用次数: 0

Improvement of Ag sintering Quality on Cu surface at Hydrogen atmosphere 氢气氛下Cu表面银烧结质量的改善

2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) Pub Date : 2018-06-01 DOI: 10.1109/3DPEIM.2018.8525231

T. Takemasa, J. Jiu, Junko Seino, K. Suganuma

{"title":"Improvement of Ag sintering Quality on Cu surface at Hydrogen atmosphere","authors":"T. Takemasa, J. Jiu, Junko Seino, K. Suganuma","doi":"10.1109/3DPEIM.2018.8525231","DOIUrl":"https://doi.org/10.1109/3DPEIM.2018.8525231","url":null,"abstract":"Wide-bang gap (WBG) semiconductors such as SiC and GaN have many advantages including energy saving and high power capability and are expected as the new semiconductors substituting traditional Si. To bond these SiC/GaN dies to substrates securely, the die-bonding materials are required to stand high-temperature environment and possess superior heat and electronic-conducting properties as well as excellent reliability. Recently, Ag micron particle paste has been developed to show good performance such as high-temperature raliability and high electronic conductivity. Direct copper bonding (DCB) is the commonly used substrate, of which a Cu face is bonded with dies. Since Cu is easy to be oxidized in air, the substrates have to be coated with a thin layer of Ag to realize bonding and to improve the mechanical property. In this work, a simple two-step sintering process was proposed to omit the complicated Ag-coating process and achieve the stable direct bonding between a Cu surface and a die. The two-steps sintering process included first-step in the air and second-step in hydrogen atmosphere. Shear strength over 20 MPa has been achieved by an opti-mized sintering condition with an affordable Ag micron paste.","PeriodicalId":262974,"journal":{"name":"2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124534487","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Application of the PCB-Embedding Technology in Power Electronics – State of the Art and Proposed Development pcb嵌入技术在电力电子中的应用——现状与发展建议

2018 Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) Pub Date : 2018-06-01 DOI: 10.1109/3DPEIM.2018.8525236

C. Buttay, C. Martin, F. Morel, Remy Caillaud, Johan Le Leslé, R. Mrad, N. Degrenne, S. Mollov

引用次数: 16