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19th IEEE International Conference on Micro Electro Mechanical Systems最新文献

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Compact And Stress-Released Piston Tip-Tilt Mirror 紧凑和应力释放活塞倾斜镜
19th IEEE International Conference on Micro Electro Mechanical Systems Pub Date : 2006-05-08 DOI: 10.1109/MEMSYS.2006.1627910
T. Overstolz, W. Noell, R. Stanley, N. D. de Rooij
{"title":"Compact And Stress-Released Piston Tip-Tilt Mirror","authors":"T. Overstolz, W. Noell, R. Stanley, N. D. de Rooij","doi":"10.1109/MEMSYS.2006.1627910","DOIUrl":"https://doi.org/10.1109/MEMSYS.2006.1627910","url":null,"abstract":"Devices based on SOI technology are subject to bow due to residual stress induced by the buried oxide. We have designed and fabricated a compact tunable piston tip-tilt mirror device in which the shape and the arrangement of the suspension beams result in both a reduced stress in the suspension beams and an optically flat mirror. The piston tip-tilt mirror is characterized by an accurate vertical displacement of up to 18 µ m @80 V with good repeatability, and a tip-tilt of up to 2 mrad @50 V.","PeriodicalId":250831,"journal":{"name":"19th IEEE International Conference on Micro Electro Mechanical Systems","volume":"113 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124156820","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
A Novel Elastomer Membrane Micropump with Embedded Coils for Off-Chip Pumping Applications 一种新型弹性体膜微泵与嵌入式线圈的片外泵应用
19th IEEE International Conference on Micro Electro Mechanical Systems Pub Date : 2006-05-08 DOI: 10.1109/MEMSYS.2006.1627913
Hung-Lin Yin, J. Hsieh, H. Hsu
{"title":"A Novel Elastomer Membrane Micropump with Embedded Coils for Off-Chip Pumping Applications","authors":"Hung-Lin Yin, J. Hsieh, H. Hsu","doi":"10.1109/MEMSYS.2006.1627913","DOIUrl":"https://doi.org/10.1109/MEMSYS.2006.1627913","url":null,"abstract":"This paper reports on the implementation of an improved electromagnetic membrane micropump for off-chip operation. Several advantages including small size, localized pumping, programmability, large pumping volume, and good time stability can be found in the proposed design. The experimental results reveal the maximum displacement was up to 47.5μm, which is equivalent to a pumping volume larger than 2μL. The pressure can be maintained for at least 30 minutes. The result of reliability test shows that the displacement deviations could remain within 7% after 24,000 cycles’ operation.","PeriodicalId":250831,"journal":{"name":"19th IEEE International Conference on Micro Electro Mechanical Systems","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121779624","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
A Temperature-Gradient Driven Micromirror with Large Angles and High Frequencies 一种温度梯度驱动的大角度高频微镜
19th IEEE International Conference on Micro Electro Mechanical Systems Pub Date : 2006-05-08 DOI: 10.1109/MEMSYS.2006.1627933
D. Elata, R. Mahameed
{"title":"A Temperature-Gradient Driven Micromirror with Large Angles and High Frequencies","authors":"D. Elata, R. Mahameed","doi":"10.1109/MEMSYS.2006.1627933","DOIUrl":"https://doi.org/10.1109/MEMSYS.2006.1627933","url":null,"abstract":"In this work we demonstrate that thermoelastic actuation can be used to drive tilting micromirrors to large angles at high frequencies. We present a Single Crystalline Silicon (SCS) micromirror with 1 mm diameter that achieves a scanning deflection angle of ± 8.5 ° at 9.5 kHz, which is driven by a 1.5 Volt source. The key feature that enables the high frequency of the thermoelastic actuator is that it uses temperature gradient as the driving force rather than using temperature itself as in prevalent thermoelastic actuators.","PeriodicalId":250831,"journal":{"name":"19th IEEE International Conference on Micro Electro Mechanical Systems","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121813931","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Vertical and Horizontal Parallel Mounting of Micro Components on a Substrate with High Surface Coverage 微元件在高表面覆盖基板上的垂直和水平平行安装
19th IEEE International Conference on Micro Electro Mechanical Systems Pub Date : 2006-05-08 DOI: 10.1109/MEMSYS.2006.1627783
Jiandong Fang, K. Bohringer
{"title":"Vertical and Horizontal Parallel Mounting of Micro Components on a Substrate with High Surface Coverage","authors":"Jiandong Fang, K. Bohringer","doi":"10.1109/MEMSYS.2006.1627783","DOIUrl":"https://doi.org/10.1109/MEMSYS.2006.1627783","url":null,"abstract":"We demonstrate a novel parallel micro assembly process based on both shape recognition and capillary-driven self-assembly in an air environment. Mechanically diced silicon parts with dimensions of 790 µ m × 790 µ m × 330 µ m are used for proof-of-concept demonstrations. Each part has only one hydrophobic 790 µ m × 790 µ m face and its other faces are hydrophilic. On a vibrating plate, tumbling parts are captured by cavities having an opening clearance that only admits a single part standing vertically with a 790 µ m × 330 µ m footprint. The trapped parts are then transferred to a substrate having an array of receptor sites covered with water droplets. Initially the parts are vertically attached, but capillary forces from water condensate turn them to face the substrate with their 790 µ m × 790 µ m hydrophilic faces. This process assembles micro parts to densely packed 1000 receptor sites in about 2 minutes with a defect rate ~ 1%. A single batch assembly process achieves 31% surface coverage, and a 2ndbatch doubles the ratio to 62%.","PeriodicalId":250831,"journal":{"name":"19th IEEE International Conference on Micro Electro Mechanical Systems","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131754936","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Carrying Target Molecules on Beads by Bio Molecular Motors 生物分子马达在微珠上携带靶分子
19th IEEE International Conference on Micro Electro Mechanical Systems Pub Date : 2006-05-08 DOI: 10.1109/MEMSYS.2006.1627852
M. Tarhan, R. Yokokawa, F. Morin, S. Takeuchi, T. Kon, H. Fujita
{"title":"Carrying Target Molecules on Beads by Bio Molecular Motors","authors":"M. Tarhan, R. Yokokawa, F. Morin, S. Takeuchi, T. Kon, H. Fujita","doi":"10.1109/MEMSYS.2006.1627852","DOIUrl":"https://doi.org/10.1109/MEMSYS.2006.1627852","url":null,"abstract":"A motor protein system, kinesin/microtubule, transported target molecules specifically attached on bead surfaces. The target molecule, biotin-4-fluorescein, was specifically immobilized on streptavidin-coated beads, on which kinesin molecules were also attached. The target molecules were successfully transported along microtubules immobilized on a glass surface. The activity of kinesin was not disturbed by co-existing target molecules. The result has significant implication to sort out any target molecule selectively from a sample solution by a nano-scale transport system driven by the kinesin/microtubule system.","PeriodicalId":250831,"journal":{"name":"19th IEEE International Conference on Micro Electro Mechanical Systems","volume":"80 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131730125","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
3-Axes Flexible Tactile Sensor Fabricated by Si Micromachining and Packaging Technology 基于硅微加工和封装技术的三轴柔性触觉传感器
19th IEEE International Conference on Micro Electro Mechanical Systems Pub Date : 2006-05-08 DOI: 10.1109/MEMSYS.2006.1627890
K. Kim, K.R. Lee, Y. Kim, D.S. Lee, N. Cho, W.H. Kim, K.B. Park, H. Park, Y. Park, J. Kim, J. Pak
{"title":"3-Axes Flexible Tactile Sensor Fabricated by Si Micromachining and Packaging Technology","authors":"K. Kim, K.R. Lee, Y. Kim, D.S. Lee, N. Cho, W.H. Kim, K.B. Park, H. Park, Y. Park, J. Kim, J. Pak","doi":"10.1109/MEMSYS.2006.1627890","DOIUrl":"https://doi.org/10.1109/MEMSYS.2006.1627890","url":null,"abstract":"We present the fabrication process and characteristics of a 3-axes flexible tactile sensor available for normal and shear mode fabricated using Si micromachining and packaging technologies. The fabrication processes for the 3 axes flexible tactile sensor were classified in the fabrication of sensor chips and their packaging on the flexible PCB. The variation rate of resistance was about 2.1%/N and 0.5%/N in applying normal and shear force, respectively. Because this tactile sensor can measure the variations of resistance of the semiconductor strain gauge for normal and shear force, it can be used to sense touch, pressure, hardness, and slip.","PeriodicalId":250831,"journal":{"name":"19th IEEE International Conference on Micro Electro Mechanical Systems","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128256710","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 39
Alow Temperature Vacuum Package Utilizing Porous Alumina Thin Film Encapsulation 利用多孔氧化铝薄膜封装的低温真空封装
19th IEEE International Conference on Micro Electro Mechanical Systems Pub Date : 2006-05-08 DOI: 10.1109/MEMSYS.2006.1627752
R. He, C. Kim
{"title":"Alow Temperature Vacuum Package Utilizing Porous Alumina Thin Film Encapsulation","authors":"R. He, C. Kim","doi":"10.1109/MEMSYS.2006.1627752","DOIUrl":"https://doi.org/10.1109/MEMSYS.2006.1627752","url":null,"abstract":"We report a monolithic thin-film encapsulation method that satisfies the most popular requirements for on-wafer packaging: low temperature, low cost, hermetic, and RF compatible. The key for this new nano-porous thin-film encapsulation method is the technique to produce a large free-standing porous alumina membrane on-chip by post-deposition anodization of aluminum at room temperature. A porous alumina membrane allows for the diffusion of gas or liquid etchants through the nano-pores into the cavity to etch the sacrificial material, freeing the movable structures encapsulated inside. Subsequent vacuum sealing was achieved by depositing a thin film over the nano-porous alumina shell in a vacuum deposition tool, with no detectable penetration of the sealing material owing to the nano-pores with a high aspect ratio (> 30). The process, done at a low temperature, produced a hermetic vacuum seal and demonstrated an exceptionally low RF insertion loss: < 0.1 dB up to 40 GHz.","PeriodicalId":250831,"journal":{"name":"19th IEEE International Conference on Micro Electro Mechanical Systems","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124638640","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 19
MEMS Radioisotope-Powered Piezoelectric µ - Power Generator (RPG) MEMS放射性同位素驱动压电&#181;-发电机(RPG)
19th IEEE International Conference on Micro Electro Mechanical Systems Pub Date : 2006-05-08 DOI: 10.1109/MEMSYS.2006.1627744
R. Duggirala, R. Polcawich, E. Zakar, M. Dubey, H. Li, A. Lal
{"title":"MEMS Radioisotope-Powered Piezoelectric &#181; - Power Generator (RPG)","authors":"R. Duggirala, R. Polcawich, E. Zakar, M. Dubey, H. Li, A. Lal","doi":"10.1109/MEMSYS.2006.1627744","DOIUrl":"https://doi.org/10.1109/MEMSYS.2006.1627744","url":null,"abstract":"We present a microfabricated die-scale Radioisotope-powered Piezoelectric µ -power Generator (RPG) with nuclear to electrical conversion efficiency as high as 3.7%. The generator employs direct charging to convert radiated β-particle kinetic energy into stored electromechanical energy in a piezoelectric unimorph, and piezoelectricity to convert the stored mechanical energy into extractable electrical energy. The generator goes through a charge-discharge-vibrate cycle, integrating the energy collected during the charging phase. This enables high power output (1.13 µ W peak across a 90 kΩ load impedance) for a short time (10 s) during the vibration cycle, even with radioactive film emitting only 100 nW of continuous power.","PeriodicalId":250831,"journal":{"name":"19th IEEE International Conference on Micro Electro Mechanical Systems","volume":"75 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124691316","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 21
Micromachined Flow-Through Polymerase Chain Reaction Chip Utilizing Multiple Membrane-Activated Micropumps 利用多膜激活微泵的微机械流动聚合酶链反应芯片
19th IEEE International Conference on Micro Electro Mechanical Systems Pub Date : 2006-05-08 DOI: 10.1109/MEMSYS.2006.1627814
Chih-Hao Wang, Yi-Yu Chen, C. Liao, Huei-Huang Lee, Gwo-Bin Lee
{"title":"Micromachined Flow-Through Polymerase Chain Reaction Chip Utilizing Multiple Membrane-Activated Micropumps","authors":"Chih-Hao Wang, Yi-Yu Chen, C. Liao, Huei-Huang Lee, Gwo-Bin Lee","doi":"10.1109/MEMSYS.2006.1627814","DOIUrl":"https://doi.org/10.1109/MEMSYS.2006.1627814","url":null,"abstract":"This paper reports a new micromachined flow-through polymerase chain reaction (PCR) chip for applications of rapid pathogen diagnosis. The PCR chip comprised a micro thermal control module and a microfluidic control module fabricated using MEMS (micro-electro-mechanical-systems) technology. The micro thermal control module was formed with three individual heating and temperature-sensing sections, each modulating a specific temperature for denaturation, annealing and extension process, respectively. The membrane-activated micropumps were used to transport sample fluids through three reaction regions to adjust the time ratio and cycle numbers for PCR. The experimental results showed that S. pneumoniae detection gene (273 bps) could be amplified successfully using the new flow-through PCR chip. The new PCR chip could be promising for rapid clinical diagnosis of DNA-based infectious disease.","PeriodicalId":250831,"journal":{"name":"19th IEEE International Conference on Micro Electro Mechanical Systems","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133771072","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
EWOD (Electrowetting-on-Dielectric) Actuated Optical Micromirror 电介质电润湿驱动光学微镜
19th IEEE International Conference on Micro Electro Mechanical Systems Pub Date : 2006-05-08 DOI: 10.1109/MEMSYS.2006.1627906
Hyung-Hoon Kang, Joonwon Kim
{"title":"EWOD (Electrowetting-on-Dielectric) Actuated Optical Micromirror","authors":"Hyung-Hoon Kang, Joonwon Kim","doi":"10.1109/MEMSYS.2006.1627906","DOIUrl":"https://doi.org/10.1109/MEMSYS.2006.1627906","url":null,"abstract":"This paper introduces a novel method to control the tilting motion of an optical micromirror using EWOD (Electrowetting-on-Dielectric) actuation that can be used in optical devices (e.g., optical scanner, large scale display). Using the vertical motion of a liquid droplet during EWOD movement that gives a height difference due to the contact angle variation at the three-phase contact line by an applied voltage, a dramatically simplified and effective tilting motion of micromirror can be realized. The actuation concept, fabrication, and test of the initial devices are reported. A preliminary time response experiment of our initial device is also included to examine the feasibility of our device as a large display component.","PeriodicalId":250831,"journal":{"name":"19th IEEE International Conference on Micro Electro Mechanical Systems","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129978272","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
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