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Symposium of Life Sciences, Materials, and Applied Chemistry 生命科学、材料和应用化学专题讨论会
Scientific Books Collection Pub Date : 2023-10-09 DOI: 10.4028/b-m6yn2f
A. D. Hatmanto, A. Kusumaatmaja, F. Pambudi, M. Mardjan, Robby Noor Cahyono, Taufik Abdillah Natsir
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引用次数: 0
Semi-Solid Processing of Alloys and Composites (S2P) 合金和复合材料半固态加工(S2P)
Scientific Books Collection Pub Date : 2023-09-01 DOI: 10.4028/b-9hx0d3
A. Pola, M. Tocci, Ahmed Rassili
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引用次数: 1
Fundamentals of Solidifications 5th edition with Solutions Manual 基础固化第5版与解决方案手册
Scientific Books Collection Pub Date : 2023-08-23 DOI: 10.4028/b-ck2nnq
W. Kurz, D. Fisher, M. Rappaz
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引用次数: 0
Dielectric, Supercapacitive, Photoluminescent Properties of Hybrid Metal Organic Frameworks 杂化金属有机骨架的介电、超电容、光致发光特性
Scientific Books Collection Pub Date : 2023-08-11 DOI: 10.4028/b-0e3hbo
V. Adimule, R. Shashanka
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引用次数: 0
Fundamentals of Solidification 5th edition - Solutions Manual 凝固基础第5版-解决方案手册
Scientific Books Collection Pub Date : 2023-08-07 DOI: 10.4028/b-uk5dlh
W. Kurz, D. Fisher, M. Rappaz
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引用次数: 0
The 9th International Conference on Mechanics, Materials and Manufacturing 第九届力学、材料与制造国际会议
Scientific Books Collection Pub Date : 2023-08-04 DOI: 10.4028/b-mkq3jv
I. McAndrew
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引用次数: 0
5th EPI International Conference on Science and Engineering (EICSE) 第五届EPI科学与工程国际会议(EICSE)
Scientific Books Collection Pub Date : 2023-07-28 DOI: 10.4028/b-5nn6y9
F. Mahmuddin
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引用次数: 0
2nd International Conference on Semiconductor Materials and Technology (ICoSeMT 2021) 第二届国际半导体材料与技术会议(ICoSeMT 2021)
Scientific Books Collection Pub Date : 2023-07-27 DOI: 10.4028/b-a20jwg
H. J. Quah
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引用次数: 0
3rd International Conference on Structural Engineering and Materials 第三届结构工程与材料国际会议
Scientific Books Collection Pub Date : 2023-07-26 DOI: 10.4028/b-81vck5
Dong Keon Kim
{"title":"3rd International Conference on Structural Engineering and Materials","authors":"Dong Keon Kim","doi":"10.4028/b-81vck5","DOIUrl":"https://doi.org/10.4028/b-81vck5","url":null,"abstract":"","PeriodicalId":250559,"journal":{"name":"Scientific Books Collection","volume":"239 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-07-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125702022","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The 4th International Conference on Science and Technology Applications 第四届国际科技应用会议
Scientific Books Collection Pub Date : 2023-07-21 DOI: 10.4028/b-ryz6xp
B. Sinaga, J. Rajagukguk, R. Rajaramakrishna, T. Setiadipura, M. Horprathum, S. Silaban
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引用次数: 0
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