Phạm Thế Hải, Huynh Chau Thinh, Bui Van Phuc, H. H. Kha
{"title":"Automatic feature extraction for Vietnamese sign language recognition using support vector machine","authors":"Phạm Thế Hải, Huynh Chau Thinh, Bui Van Phuc, H. H. Kha","doi":"10.1109/SIGTELCOM.2018.8325780","DOIUrl":"https://doi.org/10.1109/SIGTELCOM.2018.8325780","url":null,"abstract":"This paper aims at finding an automatic approach for extracting features of the Vietnamese sign language to classify both static Vietnamese alphabet letters and their combing diacritic marks as dynamic hand gestures. A Vietnamese sign language recognition system (VSLRS) collects all images including depth images, RGB images, and skeletal join maps to extract the desired features of each hand gesture and their own movements. These characteristics are normalized and converted to build a full Vietnamese sign language combing diacritic marks. The primary features of this system are automatically extracting the hand gestures of the observed person before the Kinect device version 1, and both dynamic and static diacritic marks are able to be recognized because of the movement detection method. Multi-class support vector machines (SVMs) and the One-Against-All approach are employed to find two suitable SVMs for static and dynamic hand gesture recognition. During the recognition phase, all hand gestures are extracted, normalized, and then filtered out based on the Euclidean distance difference of hand positions in captured frames to go through the exact SVMs. The recognized letter or diacritic is the positive label of all the SVM classes. The experimental results demonstrate the proposed VSLRS recognized the Vietnamese sign language (VSL) in realtime with the high accuracy.","PeriodicalId":236488,"journal":{"name":"2018 2nd International Conference on Recent Advances in Signal Processing, Telecommunications & Computing (SigTelCom)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131115107","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Impact of temperature on electrical performance of Ni film on n-type 4H-SÌC contacts in terms of micropipes density","authors":"H. Pham, S. Luong, A. Holland, Huy L. Nguyen","doi":"10.1109/SIGTELCOM.2018.8325777","DOIUrl":"https://doi.org/10.1109/SIGTELCOM.2018.8325777","url":null,"abstract":"Silicon carbide (SiC) is novel semiconductor material which is intensively studied recently due to its outstanding physical and electrical characteristics. One of the drawbacks of this innovative SiC material is the micropipe defect, which is created during SiC crystal growth. These defects worsen the performance of the semiconductor devices by increasing leakage current and decreasing breakdown voltage. As heat treatment is a necessary process in making Ohmic contact, it is interesting to examine the correlation between defects density and heating temperature. Nickel (Ni) films are deposited on n-type 4H-SÌC substrate to test for this correlation. Temperature up to 1000°C is used for heat treatment While it is still possible to form Ohmic contact with high-micropipe density samples (−100 micropipe per cm2), the impact of temperature on low-micropipe density samples (< 30 micropipe per cm2) is minor.","PeriodicalId":236488,"journal":{"name":"2018 2nd International Conference on Recent Advances in Signal Processing, Telecommunications & Computing (SigTelCom)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130030975","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Analysis of structural dynamics for a circular wedge-wave ultrasonic motor","authors":"Tai-Ho Yu","doi":"10.1109/SIGTELCOM.2018.8325801","DOIUrl":"https://doi.org/10.1109/SIGTELCOM.2018.8325801","url":null,"abstract":"This study analyzes the structural dynamics of an ultrasonic motor driven by a circular wedge acoustic waveguide in order to determine the optimal motor design parameters. The motor stator comprises a metal circular wedge and piezoelectric cylindrical tube. The outer surface of the piezoelectric cylindrical tube is coated with comb-type electrodes, and equispaced electrodes on its surface formed two comb-type transducers. A self-designed high-performance dual-phase driver circuit initiated flexural waves along the wedge peak, changing the driving voltage and phases, which allows for the speed and direction of motor rotation to be controlled accurately. This study uses finite element software to analyze the resonant frequencies and dynamics of the motor. Harmonic analysis and simulation results are then used to derive optimal parameters for motor design. The results indicate that the ultrasonic motor has an operating frequency of 33.8 kHz and operating voltage of ±100V. Two pairs of dual-phase comb-type electrodes generate five flexural waves that transmitted along the wedge peak in a clockwise or counterclockwise direction. The point of contact between the stator and rotor is located approximately 1 mm underneath the wedge peak in order to ensure the motor's optimal performance.","PeriodicalId":236488,"journal":{"name":"2018 2nd International Conference on Recent Advances in Signal Processing, Telecommunications & Computing (SigTelCom)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123840591","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Nguyen Thi Thu Hang, Nguyen Chien Trinh, Nguyen Tien Ban
{"title":"Energy aware event driven routing protocol and dynamic delivering scheme for multievent wireless sensor network","authors":"Nguyen Thi Thu Hang, Nguyen Chien Trinh, Nguyen Tien Ban","doi":"10.1109/SIGTELCOM.2018.8325795","DOIUrl":"https://doi.org/10.1109/SIGTELCOM.2018.8325795","url":null,"abstract":"Multievent wireless sensor networks (WSN) require different levels of reliability and latency based on event types. Besides that, energy efficient consumption is one of the crucial requirements for most WSNs because sensors have limited power and processing capability. Most of researches in this area have dealt with one or two of the requirements. This paper proposes a novel solution combining of energy aware, event driven routing protocol, and dynamic delivering scheme to support the requirements for multievent WSN. Simulation results show that, the proposed solution reduces packet loss rate for high reliability requirement events and extends the network lifetime of multievent WSN. Moreover, in case of high traffic conditions, sharing load across multiple paths would reduce latency for the urgent events in the multiple events network.","PeriodicalId":236488,"journal":{"name":"2018 2nd International Conference on Recent Advances in Signal Processing, Telecommunications & Computing (SigTelCom)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131490767","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Silicon on insulator null convention logic based asynchronous circuit design for high performance low power digital systems","authors":"Nguyen Le Huy, A. Holland, P. Beckett","doi":"10.1109/SIGTELCOM.2018.8325772","DOIUrl":"https://doi.org/10.1109/SIGTELCOM.2018.8325772","url":null,"abstract":"Integrated Circuits developed for portable hardware systems are required to operate at ultra-low power supply levels with a considerable speed performance while occupying a relatively small circuit area. These circuit design and optimization constraints impose significant challenges to the whole semiconductor industry. Null Convention Logic based approach has evolved to a prominent clock-less circuit design and optimization technique due to its easiness and readiness in circuit design, implementation, and optimization with Electronic Design Automation tool support. This paper proposes and examines a novel Null Convention Logic gate architecture implemented in Fully-Depleted Silicon on Insulator 28 nanometer technology node targeting mobile systems. The newly-proposed gate architecture has outperformed its conventional NCL static and semi-static CMOS counterparts in terms of power consumption and operational speed and can be dynamically controlled to switch between high speed and ultra-low power low leakage operational modes.","PeriodicalId":236488,"journal":{"name":"2018 2nd International Conference on Recent Advances in Signal Processing, Telecommunications & Computing (SigTelCom)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131648726","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}