{"title":"Overview of Phase-Change Materials","authors":"","doi":"10.1142/9789813239746_0002","DOIUrl":"https://doi.org/10.1142/9789813239746_0002","url":null,"abstract":"","PeriodicalId":208679,"journal":{"name":"Encyclopedia of Thermal Packaging","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124593079","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Heat Sinks","authors":"K. Schmidt","doi":"10.1142/9789813239746_0006","DOIUrl":"https://doi.org/10.1142/9789813239746_0006","url":null,"abstract":"THERMAL MANAGEMENT is one of the critical aspects of packaging design. To ensure reliable operation of electronic and microwave components. junction tempera tures must be kept within specified limits. As a rule, the problem is one of cooling, because failure rates increase dramatically with increasing temperature. For every 10 �C (18 °F) increase in temperature, silicon and gallium arsenide lifetime drops by a factor of 2.5 to 3. Heat sinks, also called cold plates, are commonly used to transport heat dissipated by devices to a heat ex -_ changer or to spread it over a larger smface area to facilitate cooling by radiation or convection. To minimize thermal imped ance, the heat sink typically is adhesively bonded or soldered to the component it supports, which generally is one or more devices, a ceramic substrate supporting the devices, or a multilayer printed wiring board (PWB). Another critical packaging design prob lem is minimizing thermal stresses in the assembly. Thermal stresses can cause me chanical failures of devices, circuit solder joints, substrates, or the adhesive or solder used to hold the assembly together. Failure","PeriodicalId":208679,"journal":{"name":"Encyclopedia of Thermal Packaging","volume":"11 4","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114019196","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Experimental Methods","authors":"K. Willson","doi":"10.1142/9789813239746_0004","DOIUrl":"https://doi.org/10.1142/9789813239746_0004","url":null,"abstract":"SUMMARY Details of experimental technique, including definition of a method of sampling leaves, are reported. These were used throughout the work reported in subsequent papers in this series.","PeriodicalId":208679,"journal":{"name":"Encyclopedia of Thermal Packaging","volume":"130 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122421171","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Basic Geometries and Processes","authors":"","doi":"10.1142/9789813239746_0005","DOIUrl":"https://doi.org/10.1142/9789813239746_0005","url":null,"abstract":"","PeriodicalId":208679,"journal":{"name":"Encyclopedia of Thermal Packaging","volume":"45 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129816354","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Advancements in Thermal Technology for Remote Cooling Architectures","authors":"","doi":"10.1142/9789813239722_0005","DOIUrl":"https://doi.org/10.1142/9789813239722_0005","url":null,"abstract":"","PeriodicalId":208679,"journal":{"name":"Encyclopedia of Thermal Packaging","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130546454","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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