Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging最新文献

Simulation of multi-chip module package resonance using commercial finite element electromagnetic software 基于商用有限元电磁软件的多芯片模块封装谐振仿真

Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging Pub Date : 1995-05-16 DOI: 10.1109/EPEP.1994.594109

R. Clark, A. Agrawal, S. Miller

引用次数: 1

Electromagnetic modeling of simultaneous switching noise in power and ground planes in electronic packages 电子封装中电源和地平面同时开关噪声的电磁建模

Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging Pub Date : 1994-11-02 DOI: 10.1109/EPEP.1994.594146

R. Mittra, S. Chebolu

引用次数: 2

Accuracy in time domain transmission line measurements 时域传输线测量精度

Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging Pub Date : 1994-11-02 DOI: 10.1109/EPEP.1994.594133

L. A. Hayden, R. Marks

引用次数: 2

Use of periodic structure approach to model packaged MMIC and interconnects 使用周期结构方法对封装MMIC和互连进行建模

Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging Pub Date : 1994-11-02 DOI: 10.1109/EPEP.1994.594111

P. Petre, K. Kottapalli, M. Swaminathan

引用次数: 1

Effects of discontinuities (vias) on high speed interconnects 不连续性(过孔)对高速互连的影响

Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging Pub Date : 1994-11-02 DOI: 10.1109/EPEP.1994.594087

S. Venkataraman, J. Prince, A. Cangellaris

引用次数: 2

Lossy interconnect modeling from TDR/T measurements 基于TDR/T测量的有损互连建模

Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging Pub Date : 1994-11-02 DOI: 10.1109/EPEP.1994.594112

J. Jong, V. K. Tripathi, L. A. Hayden, B. Janko

引用次数: 9

Circuit modelling of two-port interconnection structures based on causality 基于因果关系的双端口互连结构电路建模

Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging Pub Date : 1994-11-02 DOI: 10.1109/EPEP.1994.594142

S. Sercu, L. Martens

引用次数: 4

A low cost, multilayer, thick film based, T/R module package for phased array applications 低成本，多层，厚膜为基础，T/R模块包相控阵应用

Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging Pub Date : 1994-11-02 DOI: 10.1109/EPEP.1994.594128

S. Miller, A. Miller, R. Clark

引用次数: 0

A model to hardware comparison of simultaneous switching noise on a CMOS chip CMOS芯片上同步开关噪声的模型与硬件比较

Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging Pub Date : 1994-11-02 DOI: 10.1109/EPEP.1994.594066

B. McCredie, S. Kuppinger, G. Katopis, W. Becker

引用次数: 4

Packaging for wireless communications 无线通信封装

Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging Pub Date : 1994-11-02 DOI: 10.1109/EPEP.1994.594124

W. E. Pence

{"title":"Packaging for wireless communications","authors":"W. E. Pence","doi":"10.1109/EPEP.1994.594124","DOIUrl":"https://doi.org/10.1109/EPEP.1994.594124","url":null,"abstract":"The key packaging problems which remain to be addressed for wireless communication adapters are: 1) packaging technologies supporting very low-profile card design, such as direct chip attach for 5-mm thick PCMCIA applications; 2) packaging for filter and discrete passive components; 3) integration of antennas into the enclosure, using printed planar antenna approaches; 4) low-cost RF packaging technology reducing the parasitic effects of single-chip packaging; and 5) techniques providing shielding between subsystems and between the sensitive transceiver and the computer system emissions. Good EMI suppression is also essential since FCC qualification has been a problem for a number of wireless PCMCIA products. In the future wireless communication adapters for the mobile PC market will use standard packaging technology for low-cost. PC board materials will be selected for low dielectric losses, but wherever possible, standard single-chip packaging will be preferred over hybrids or MCMs. There are unique aspects to wireless transceiver design, however, which require new design tools for layout, field calculations, and noise coupling analysis. Discrete components and filters are used extensively in RF designs, and they will remain the most challenging problem from a packaging perspective, with considerable opportunity for cost and size reduction.","PeriodicalId":198939,"journal":{"name":"Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1994-11-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125421946","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2