2019 IEEE/ACM International Conference on Technical Debt (TechDebt)最新文献

Supporting Analysis of Technical Debt Causes and Effects with Cross-Company Probabilistic Cause-Effect Diagrams 基于跨公司概率因果关系图的技术债务因果分析

2019 IEEE/ACM International Conference on Technical Debt (TechDebt) Pub Date : 2019-05-26 DOI: 10.1109/TechDebt.2019.00009

Nicolli Rios, R. Spínola, Manoel G. Mendonça, C. Seaman

{"title":"Supporting Analysis of Technical Debt Causes and Effects with Cross-Company Probabilistic Cause-Effect Diagrams","authors":"Nicolli Rios, R. Spínola, Manoel G. Mendonça, C. Seaman","doi":"10.1109/TechDebt.2019.00009","DOIUrl":"https://doi.org/10.1109/TechDebt.2019.00009","url":null,"abstract":"Understanding TD causes can support development teams in defining actions that could be taken to prevent the occurrence of debt items. Understanding the effects of TD could aid in prioritization of TD items to pay off to minimize possible negative consequences for the project. Existing work has revealed 105 causes and 85 effects of TD, and this high number can make it difficult to make practical use of this information. Without a consolidated representation, we would need to rely on a set of tables and isolated pieces of data. In this work, we propose the use of cross-company probabilistic cause-effect diagrams to represent information about TD causes and effects. We hypothesize that such diagrams can be useful to support TD cause/effect analysis sessions and empirically investigate this issue. Results from a case study performed with 72 participants indicate that the diagrams are able to positively support the management of TD, making it easier to identify its causes and the effects of its presence. Most of the participants also agreed that, by using the proposed diagrams, they gain agility, productivity, performance, and effectiveness. Finally, 89% of the participants stated that the use of the diagrams helped them to identify causes and effects of TD that they would not have identified without their support.","PeriodicalId":197657,"journal":{"name":"2019 IEEE/ACM International Conference on Technical Debt (TechDebt)","volume":"255 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129047940","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 35

A Proposed Model-Driven Approach to Manage Architectural Technical Debt Life Cycle 一种管理架构技术债务生命周期的模型驱动方法

2019 IEEE/ACM International Conference on Technical Debt (TechDebt) Pub Date : 2019-05-26 DOI: 10.1109/TechDebt.2019.00025

B. Pérez, D. Correal, H. Astudillo

{"title":"A Proposed Model-Driven Approach to Manage Architectural Technical Debt Life Cycle","authors":"B. Pérez, D. Correal, H. Astudillo","doi":"10.1109/TechDebt.2019.00025","DOIUrl":"https://doi.org/10.1109/TechDebt.2019.00025","url":null,"abstract":"Architectural Technical Debt (ATD) is a metaphor used to describe consciously decisions taken by software architects to accomplish short-term goals but possibly negatively affecting the long-term health of the system. However, difficulties arise when repayment strategies are defined because software architects need to be aware of the consequences of these strategies over others decisions in the software architecture. This article proposes REBEL, a semi-automated model-driven approach that exploits natural language processing, machine learning and model checking techniques on heterogeneous project artifacts to build a model that allows to locate and visualize the impact produced by the consciously injected ATD and its repayment strategy on the other architectural decisions. The technique is illustrated with a data analytics project in Colombia where software architects are unaware of the consequences of the repayment strategies. This proposal seeks to support teams of architects to make explicit the current and future impact of the ATD injected as a result of decisions taken, focusing on the architectural level rather than code level.","PeriodicalId":197657,"journal":{"name":"2019 IEEE/ACM International Conference on Technical Debt (TechDebt)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126851101","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 9

TDMentions: A Dataset of Technical Debt Mentions in Online Posts TDMentions:在线帖子中提到的技术债务数据集

2019 IEEE/ACM International Conference on Technical Debt (TechDebt) Pub Date : 2019-05-26 DOI: 10.1109/TechDebt.2019.00031

Morgan Ericsson, Anna Wingkvist

引用次数: 4

How (not ) to Remove Technical Debt in Testing Environments 如何(不)消除测试环境中的技术债务

2019 IEEE/ACM International Conference on Technical Debt (TechDebt) Pub Date : 2019-05-26 DOI: 10.1109/TechDebt.2019.00008

Valentin Guerlesquin

引用次数: 1

Lessons from the Exponential Growth of Refactoring Research in the Last Decade 过去十年重构研究的指数级增长的经验教训

2019 IEEE/ACM International Conference on Technical Debt (TechDebt) Pub Date : 2019-05-26 DOI: 10.1109/TechDebt.2019.00020

Danny Dig

引用次数: 2

DV8: Automated Architecture Analysis Tool Suites DV8:自动化架构分析工具套件

2019 IEEE/ACM International Conference on Technical Debt (TechDebt) Pub Date : 2019-05-26 DOI: 10.1109/TechDebt.2019.00015

Yuanfang Cai, R. Kazman

引用次数: 13

Silverthread CodeMRI Care 银线代码 MRI 护理

2019 IEEE/ACM International Conference on Technical Debt (TechDebt) Pub Date : 2019-05-26 DOI: 10.1109/TechDebt.2019.00019

Daniel J. Sturtevant

引用次数: 0

The Delta Maintainability Model: Measuring Maintainability of Fine-Grained Code Changes 增量可维护性模型:测量细粒度代码更改的可维护性

2019 IEEE/ACM International Conference on Technical Debt (TechDebt) Pub Date : 2019-05-26 DOI: 10.1109/TechDebt.2019.00030

M. D. Biase, Ayushi Rastogi, M. Bruntink, A. Deursen

{"title":"The Delta Maintainability Model: Measuring Maintainability of Fine-Grained Code Changes","authors":"M. D. Biase, Ayushi Rastogi, M. Bruntink, A. Deursen","doi":"10.1109/TechDebt.2019.00030","DOIUrl":"https://doi.org/10.1109/TechDebt.2019.00030","url":null,"abstract":"Existing maintainability models are used to identify technical debt of software systems. Targeting entire codebases, such models lack the ability to determine shortcomings of smaller, fine-grained changes. This paper proposes a new maintainability model – the Delta Maintainability Model (DMM) – to measure fine-grained code changes, such as commits, by adapting and extending the SIG Maintainability Model. DMM categorizes changed lines of code into low and high risk, and then uses the proportion of low risk change to calculate a delta score. The goal of the DMM is twofold: first, producing meaningful and actionable scores; second, compare and rank the maintainability of fine-grained modifications. We report on an initial study of the model, with the goal of understanding if the adapted measurements from the SIG Maintainability Model suit the fine-grained scope of the DMM. In a manual inspection process for 100 commits, 67 cases matched the expert judgment. Furthermore, we report an exploratory empirical study on a data set of DMM scores on 3,017 issue-fixing commits of four open source and four closed source systems. Results show that the scores of DMM can be used to compare and rank commits, providing developers with a means to do root cause analysis on activities that impacted maintainability and, thus, address technical debt at a finer granularity.","PeriodicalId":197657,"journal":{"name":"2019 IEEE/ACM International Conference on Technical Debt (TechDebt)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132893836","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 18

How Deep is the Mud: Fathoming Architecture Technical Debt Using Designite 泥沼有多深:使用Designite分析架构技术债务

2019 IEEE/ACM International Conference on Technical Debt (TechDebt) Pub Date : 2019-05-26 DOI: 10.1109/TechDebt.2019.00018

Tushar Sharma

引用次数: 8

Teamscale: Tackle Technical Debt and Control the Quality of Your Software 团队规模:处理技术债务并控制软件质量

2019 IEEE/ACM International Conference on Technical Debt (TechDebt) Pub Date : 2019-05-26 DOI: 10.1109/TechDebt.2019.00016

Roman Haas, Rainer Niedermayr, Elmar Jürgens

引用次数: 9