发布求助
文献互助 智能选刊 最新文献

2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)最新文献

筛选
英文 中文
SMPS noise managing methodology for RFI solution in mobile platforms 移动平台RFI解决方案的SMPS噪声管理方法
2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 1900-01-01 DOI: 10.1109/EDAPS.2016.7893115
Kiyeong Kim, Hyunho Baek, Hwan-woo Shim, Jiheon Yu, A. Scogna, Dong-Sub Kim
{"title":"SMPS noise managing methodology for RFI solution in mobile platforms","authors":"Kiyeong Kim, Hyunho Baek, Hwan-woo Shim, Jiheon Yu, A. Scogna, Dong-Sub Kim","doi":"10.1109/EDAPS.2016.7893115","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7893115","url":null,"abstract":"In mobile platforms, RFI problems caused by the noises on switched-mode power supplies (SMPSs) have arisen. The SMPS noise which affects RF bands is generated by the voltage ringing at the switch transitions in the SMPS operation. This voltage ringing is caused by the parallel resonance between the chip-level capacitance and the PCB routing inductance in the off-chip level. In this paper, we propose a new SMPS noise managing methodology to reduce the SMPS noise in RF bands and optimize the PCB designs for SMPSs. Additionally, we consider the possible deleterious effect of the proposed managing methodology on the SMPS efficiency.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"62 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127615819","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Comparison of techniques for model order reduction of frequency-dependent networks 频率相关网络模型降阶技术的比较
2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 1900-01-01 DOI: 10.1109/EDAPS.2016.7893133
Thong Nguyen, J. Schutt-Ainé
{"title":"Comparison of techniques for model order reduction of frequency-dependent networks","authors":"Thong Nguyen, J. Schutt-Ainé","doi":"10.1109/EDAPS.2016.7893133","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7893133","url":null,"abstract":"The constant increase in complexity and functionality of integrated circuit (IC) systems has resulted in large-scale systems that require advanced techniques for simulation at the verification stage. Signal integrity analysis has become more crucial in helping reduce time and production manufacturing costs. This is particularly critical for high-speed networks with transmission-line where crosstalk, skin effect, dispersion and jitter, often lead to malfunction and faulty products. From a circuit analysis perspective, the dynamical order of such systems is in principle infinity. Moreover, the number of ports of such systems can be in the hundreds which makes the analysis of such networks prohibitive. Model order reduction (MOR) has been used not only to reduce the size of the problem but to extract an optimum, relatively smaller system or macro-model for time-domain simulations. This paper explores two of the currently most popular techniques for performing MOR, namely, the Vector Fitting and Loewner Matrix methods. A comparison between the two methods is drawn and some examples are illustrated.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"22 6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132708031","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A novel methodology to create generative statistical models of interconnects 一种新的方法来创建互连的生成统计模型
2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 1900-01-01 DOI: 10.1109/EDAPS.2016.7893128
S. De Ridder, P. Manfredi, J. De Geest, T. Dhaene, D. De Zutter, D. Vande Ginste
{"title":"A novel methodology to create generative statistical models of interconnects","authors":"S. De Ridder, P. Manfredi, J. De Geest, T. Dhaene, D. De Zutter, D. Vande Ginste","doi":"10.1109/EDAPS.2016.7893128","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7893128","url":null,"abstract":"This paper addresses the problem of constructing a generative statistical model for an interconnect starting from a limited set of S-parameter samples, which are obtained by simulating or measuring the interconnect for a few random realizations of its stochastic physical properties. These original samples are first converted into a pole-residue representation with common poles. The corresponding residues are modeled as a correlated stochastic process by means of principal component analysis and kernel density estimation. The obtained model allows generating new samples with similar statistics as the original data. A passivity check is performed over the generated samples to retain only passive data. The proposed approach is applied to a representative coupled microstrip line example.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114578611","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
EM modeling 在建模
2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 1900-01-01 DOI: 10.1109/edaps.2016.7893152
Tom Dhaene, Wendem Beyene
{"title":"EM modeling","authors":"Tom Dhaene, Wendem Beyene","doi":"10.1109/edaps.2016.7893152","DOIUrl":"https://doi.org/10.1109/edaps.2016.7893152","url":null,"abstract":"","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133301658","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Delayed-rational Green's-function-based method of transmission lines and the Heaviside condition 基于延迟理性格林函数的输电线路分析方法及Heaviside条件
2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 1900-01-01 DOI: 10.1109/EDAPS.2016.7893147
M. De Lauretis, J. Ekman, G. Antonini
{"title":"Delayed-rational Green's-function-based method of transmission lines and the Heaviside condition","authors":"M. De Lauretis, J. Ekman, G. Antonini","doi":"10.1109/EDAPS.2016.7893147","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7893147","url":null,"abstract":"In electronics as well as in communications, it is highly desirable to be able to transmit a signal that is preserved from any distortions that is due to the lossy nature of the medium in which the signal travels, normally a transmission line. In this paper, we exploit the connections between the delayed Green's-function-based method from the authors and the well-known distortionless Heaviside condition. It is found that, in the method, an important results was already present but its importance not yet understood. In particular, we prove that we are able to identify the distortionless transmission line associated to a generic transmission line. We consider only 1-conductor transmission lines, with frequency-independent per-unit-length parameters. The multiconductor transmission-line case will be addressed in future works.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133648058","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Fast characterization of hybrid near-field coupling effects of multi-PCBs in rectangular cavities with FFT-accelerated integral-equation method 用fft加速积分方程法快速表征矩形腔中多pcb杂化近场耦合效应
2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 1900-01-01 DOI: 10.1109/EDAPS.2016.7893156
Kai Yang, C. Ning, W. Yin
{"title":"Fast characterization of hybrid near-field coupling effects of multi-PCBs in rectangular cavities with FFT-accelerated integral-equation method","authors":"Kai Yang, C. Ning, W. Yin","doi":"10.1109/EDAPS.2016.7893156","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7893156","url":null,"abstract":"This paper analyzes the frequency-domain EMC/EMI problems including complicated transmission lines and printed circuit boards (PCBs) that reside in metallic rectangular cavities, by using an efficient iterative Fast Fourier Transform (FFT)-accelerated integral-equation method. The internal field distribution and near-field coupling/interference of multiple transmission-lines and PCBs in cavities can be extensively investigated with this method, which further enables the optimization of EMC/EMI design to effectively suppress near-field coupling effects for complicated multi-PCBs and transmission lines.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"154 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133949290","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A new de-embedding technique for arbitrary N-port networks using ideal 1:J transformers 基于理想1:J变压器的任意n口网络去嵌入新技术
2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 1900-01-01 DOI: 10.1109/EDAPS.2016.7893144
D. Ahn, Jongsik Lim, KwanSun Choi, Sang‐Min Han
{"title":"A new de-embedding technique for arbitrary N-port networks using ideal 1:J transformers","authors":"D. Ahn, Jongsik Lim, KwanSun Choi, Sang‐Min Han","doi":"10.1109/EDAPS.2016.7893144","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7893144","url":null,"abstract":"In this paper, a new de-embedding technique that using ideal 1:j transformers is proposed. The proposed method uses cascade connection between an N-port network whose all ports are linked with 1:j transformers and the same N-port network. The ABCD matrices are fully derived in terms of the ideal 1:j transformers and the N-port network with transformers on all ports. To verify the proposed method, sample de-embedding process is performed and compared using Ansys HFSS simulation and the proposed method for a 4-port network. It is found that the magnitude (|S21|) of transmission is 0 dB, the phase difference between the through-port is 0o, and the magnitude between the input and near-/far-end ports is below −300 dB, which prove the validity of the proposed method.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130338020","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A 60GHz antenna array with heatsink considerations for massive-MIMO applications 60GHz天线阵列，考虑散热，适用于大规模mimo应用
2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 1900-01-01 DOI: 10.1109/EDAPS.2016.7893131
Xing Li, Bei-Bei Xu, Hong-li Peng
{"title":"A 60GHz antenna array with heatsink considerations for massive-MIMO applications","authors":"Xing Li, Bei-Bei Xu, Hong-li Peng","doi":"10.1109/EDAPS.2016.7893131","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7893131","url":null,"abstract":"A 60GHz Massive-MIMO patch antenna array, consisting of 8×16 elements, is presented in this paper. To overcome its heat problem caused by active circuits in its system, heatsink (HT) solution around the array are explored, focusing on the impact of the HT on array radiating characteristics. Simulation shows that our proposed array and HT solution is a very promising for 60 GHz Massive-MIMO system applications.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128718285","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
On the sensitivity of causality filter parameters 论因果滤波器参数的灵敏度
2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 1900-01-01 DOI: 10.1109/EDAPS.2016.7893160
M. Hoque, A. Zadehgol
{"title":"On the sensitivity of causality filter parameters","authors":"M. Hoque, A. Zadehgol","doi":"10.1109/EDAPS.2016.7893160","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7893160","url":null,"abstract":"In this paper we examine an existing method of causality verification. Specifically, we examine the effect of filter specifications, choice of negative time duration, and the maximum sample frequency, on the method's ability to detect causality of sampled scattering parameters of a finite bandwidth. Our study reveals that although the method is novel in its simplicity and ease-of-implementation, its ability to detect non-causality of sampled data is very much dependent on the choice of above parameters.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129459359","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Machine learning based MoM (ML-MoM) for parasitic capacitance extractions 基于机器学习的寄生电容提取MoM (ML-MoM)
2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 1900-01-01 DOI: 10.1109/EDAPS.2016.7893155
H. Yao, Y. Qin, L. J. Jiang
{"title":"Machine learning based MoM (ML-MoM) for parasitic capacitance extractions","authors":"H. Yao, Y. Qin, L. J. Jiang","doi":"10.1109/EDAPS.2016.7893155","DOIUrl":"https://doi.org/10.1109/EDAPS.2016.7893155","url":null,"abstract":"This paper is a rethinking of the conventional method of moments (MoM) using the modern machine learning (ML) technology. By repositioning the MoM matrix and unknowns in an artificial neural network (ANN), the conventional linear algebra MoM solving is changed into a machine learning training process. The trained result is the solution. As an application, the parasitic capacitance extraction broadly needed by VLSI modeling is solved through the proposed new machine learning based method of moments (ML-MoM). The multiple linear regression (MLR) is employed to train the model. The computations are done on Amazon Web Service (AWS). Benchmarks demonstrated the interesting feasibility and efficiency of the proposed approach. According to our knowledge, this is the first MoM truly powered by machine learning methods. It opens enormous software and hardware resources for MoM and related algorithms that can be applied to signal integrity and power integrity simulations.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"77 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133767338","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
首页 上一页 下一页 尾页
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：481959085
Book学术官方微信