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64th Annual Technical Conference Proceedings最新文献

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ALD-CAP® Encapsulation of Wafers, Devices, and Objects ALD-CAP®晶圆、器件和对象封装
64th Annual Technical Conference Proceedings Pub Date : 2021-09-15 DOI: 10.14332/svc21.proc.0082
D. Higgs
{"title":"ALD-CAP® Encapsulation of Wafers, Devices, and Objects","authors":"D. Higgs","doi":"10.14332/svc21.proc.0082","DOIUrl":"https://doi.org/10.14332/svc21.proc.0082","url":null,"abstract":"","PeriodicalId":153602,"journal":{"name":"64th Annual Technical Conference Proceedings","volume":"2006 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128832650","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Atomic Layer Deposition: An Enabling Thin Film Nanotechnology for a Growing Number of Applications 原子层沉积:使薄膜纳米技术在越来越多的应用
64th Annual Technical Conference Proceedings Pub Date : 2021-09-15 DOI: 10.14332/svc21.proc.0083
W. Kessels
{"title":"Atomic Layer Deposition: An Enabling Thin Film Nanotechnology for a Growing Number of Applications","authors":"W. Kessels","doi":"10.14332/svc21.proc.0083","DOIUrl":"https://doi.org/10.14332/svc21.proc.0083","url":null,"abstract":"","PeriodicalId":153602,"journal":{"name":"64th Annual Technical Conference Proceedings","volume":"99 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117214281","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The Full Range of Magnetic Array Options for Planar Magnetrons – Too Much Choice? 平面磁控管的全范围磁阵列选项-太多的选择?
64th Annual Technical Conference Proceedings Pub Date : 2021-09-15 DOI: 10.14332/svc21.proc.0081
D. Monaghan
{"title":"The Full Range of Magnetic Array Options for Planar Magnetrons – Too Much Choice?","authors":"D. Monaghan","doi":"10.14332/svc21.proc.0081","DOIUrl":"https://doi.org/10.14332/svc21.proc.0081","url":null,"abstract":"","PeriodicalId":153602,"journal":{"name":"64th Annual Technical Conference Proceedings","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127113724","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Variation of Indices of Refraction of Very Thin Silver Layers with Materials, Thickness, and Simulation Models 极薄银层折射率随材料、厚度和模拟模型的变化
64th Annual Technical Conference Proceedings Pub Date : 2021-09-15 DOI: 10.14332/svc21.proc.0039
R. Willey
{"title":"Variation of Indices of Refraction of Very Thin Silver Layers with Materials, Thickness, and Simulation Models","authors":"R. Willey","doi":"10.14332/svc21.proc.0039","DOIUrl":"https://doi.org/10.14332/svc21.proc.0039","url":null,"abstract":"","PeriodicalId":153602,"journal":{"name":"64th Annual Technical Conference Proceedings","volume":"64 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116607423","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Enabling Extreme Fast Charging Through Control of Li Deposition Overpotential 通过控制锂沉积过电位实现极快充电
64th Annual Technical Conference Proceedings Pub Date : 2021-09-15 DOI: 10.14332/svc21.proc.0004
David Bock
{"title":"Enabling Extreme Fast Charging Through Control of Li Deposition Overpotential","authors":"David Bock","doi":"10.14332/svc21.proc.0004","DOIUrl":"https://doi.org/10.14332/svc21.proc.0004","url":null,"abstract":"","PeriodicalId":153602,"journal":{"name":"64th Annual Technical Conference Proceedings","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115089218","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Innovations in E-Beam Deposition 电子束沉积的创新
64th Annual Technical Conference Proceedings Pub Date : 2021-09-15 DOI: 10.14332/svc21.proc.0070
Tom Guppenberger
{"title":"Innovations in E-Beam Deposition","authors":"Tom Guppenberger","doi":"10.14332/svc21.proc.0070","DOIUrl":"https://doi.org/10.14332/svc21.proc.0070","url":null,"abstract":"","PeriodicalId":153602,"journal":{"name":"64th Annual Technical Conference Proceedings","volume":"33 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130810180","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Interphases and Interfaces in Batteries Probed by PES Techniques 用PES技术探测电池的界面和界面
64th Annual Technical Conference Proceedings Pub Date : 2021-09-15 DOI: 10.14332/svc21.proc.0017
K. Edström
{"title":"Interphases and Interfaces in Batteries Probed by PES Techniques","authors":"K. Edström","doi":"10.14332/svc21.proc.0017","DOIUrl":"https://doi.org/10.14332/svc21.proc.0017","url":null,"abstract":"","PeriodicalId":153602,"journal":{"name":"64th Annual Technical Conference Proceedings","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130821207","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Vacuum Thin Film Deposition for Automotive Applications 汽车用真空薄膜沉积
64th Annual Technical Conference Proceedings Pub Date : 2021-09-15 DOI: 10.14332/svc21.proc.0035
C. Deus
{"title":"Vacuum Thin Film Deposition for Automotive Applications","authors":"C. Deus","doi":"10.14332/svc21.proc.0035","DOIUrl":"https://doi.org/10.14332/svc21.proc.0035","url":null,"abstract":"","PeriodicalId":153602,"journal":{"name":"64th Annual Technical Conference Proceedings","volume":"272 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116191884","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Benefits of Using a Magnetic Active Anode in the Sputtering of Rotatable Magnetrons 在可旋转磁控管溅射中使用磁性活性阳极的好处
64th Annual Technical Conference Proceedings Pub Date : 2021-09-15 DOI: 10.14332/svc21.proc.0036
Patrick T. McCarthy, G. Ltd.
{"title":"Benefits of Using a Magnetic Active Anode in the Sputtering of Rotatable Magnetrons","authors":"Patrick T. McCarthy, G. Ltd.","doi":"10.14332/svc21.proc.0036","DOIUrl":"https://doi.org/10.14332/svc21.proc.0036","url":null,"abstract":"","PeriodicalId":153602,"journal":{"name":"64th Annual Technical Conference Proceedings","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116154358","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Conveyor Imprints Cleaning, Surface Etching and Activation - All in One Scalable Solution Based on Ion Source "LUCH" from Izovac 输送印痕清洗，表面蚀刻和激活-所有在一个可扩展的解决方案，基于离子源“LUCH”从Izovac
64th Annual Technical Conference Proceedings Pub Date : 2021-09-15 DOI: 10.14332/svc21.proc.0030
Pavel Shapotkin, Izovac Ltd.
{"title":"Conveyor Imprints Cleaning, Surface Etching and Activation - All in One Scalable Solution Based on Ion Source \"LUCH\" from Izovac","authors":"Pavel Shapotkin, Izovac Ltd.","doi":"10.14332/svc21.proc.0030","DOIUrl":"https://doi.org/10.14332/svc21.proc.0030","url":null,"abstract":"","PeriodicalId":153602,"journal":{"name":"64th Annual Technical Conference Proceedings","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123533375","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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