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1983 EIC 6th Electrical/Electronical Insulation Conference最新文献

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Characterization and testing of epoxy powder insulated conductors 环氧粉末绝缘导体的特性和试验
1983 EIC 6th Electrical/Electronical Insulation Conference Pub Date : 1983-10-01 DOI: 10.1109/EEIC.1983.7465091
Frank R. Zickar
{"title":"Characterization and testing of epoxy powder insulated conductors","authors":"Frank R. Zickar","doi":"10.1109/EEIC.1983.7465091","DOIUrl":"https://doi.org/10.1109/EEIC.1983.7465091","url":null,"abstract":"A significant recent development in conductor insulation is the electrostatic powder coating of copper and aluminum rectangular cross section wire for use in liquid filled transformers. DuraBIL∗ turn insulation is a single layer of epoxy povrier deposited electrostatically on conductors, then baked and cured, linking polymers to form a continuous coating. Bonded tightly to the conductor, the coating is of uniform thickness, flexible, abrasion resistant, rigid, and chemically stable. All these characteristics add to unit reliability and service life. This paper will review the testing methods used to evaluate epoxy powders to be applied to aluminum or copper conductors. Analytical techniques used to evaluate critical powder properties will be discussed. Data from particle size analysis, gel time, moisture content, and other properties will be presented. Methods of interpreting the data obtained will also be described. Also, to be presented will be the various functional or performance tests including the evaluation of physical, thermal, and electrical properties of DuraBIL∗ epoxy powder coated conductors. Data obtained through thermal analysis will be used to differentiate between cured and incompletely cured insulated conductors. This paper will also cover the functional testing used to verify the polymerized coating for use in liquid filled transformers.","PeriodicalId":148370,"journal":{"name":"1983 EIC 6th Electrical/Electronical Insulation Conference","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1983-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125287065","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Bondable insulation systems 可粘合绝缘系统
1983 EIC 6th Electrical/Electronical Insulation Conference Pub Date : 1983-10-01 DOI: 10.1109/EEIC.1983.7465089
David A. Wilson, Velio Nolvak
{"title":"Bondable insulation systems","authors":"David A. Wilson, Velio Nolvak","doi":"10.1109/EEIC.1983.7465089","DOIUrl":"https://doi.org/10.1109/EEIC.1983.7465089","url":null,"abstract":"The bondable system concept provides a strong, uniform bond between all components of a motor, transformer or coil. Only two major components were changed when converting from a conventional insulation system to a bondable system. These components were: bondable magnet wire and \"B\" stage resin treated sheet and tape insulation. Bonding of the system may be accomplished by resistance or oven heating. When resistance heating, only the conductor is heated, activating the bond overcoat and \"B\" stage resins. Energy consumption is reduced to that required for bonding purposes. Compared to conventional methods, bondable systems require no varnish, dip tanks, pre-heat or curing ovens. Compliance with current environmental requirements is more easily met with these items no longer needed. Helical coil bond strength and moisture resistance are equal to or greater than most conventional dip and bake systems.","PeriodicalId":148370,"journal":{"name":"1983 EIC 6th Electrical/Electronical Insulation Conference","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1983-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115145711","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Experience and practice with standardized acceptance test procedures for windings of rotating machinery 具有旋转机械绕组标准化验收试验程序的经验和实践
1983 EIC 6th Electrical/Electronical Insulation Conference Pub Date : 1983-10-01 DOI: 10.1109/EEIC.1983.7465052
H. Meyer, A. Wichmann
{"title":"Experience and practice with standardized acceptance test procedures for windings of rotating machinery","authors":"H. Meyer, A. Wichmann","doi":"10.1109/EEIC.1983.7465052","DOIUrl":"https://doi.org/10.1109/EEIC.1983.7465052","url":null,"abstract":"European Standards for rotating machines include rules for acceptance tests on high voltage winding insulation. The standard claims for dielectric loss and dielectric strength measurements and contains a thermal short time stability test of single bars or coils. This paper describes the test methods and the values of the acceptance limits. Examples will be shown how dielectric loss measurements serve successfully as a tool for maintaining uniform manufacturing results using different methods of modern insulation production. Problems, limits and benefits of applicating the described test procedures will be discussed and an international standard recommended.","PeriodicalId":148370,"journal":{"name":"1983 EIC 6th Electrical/Electronical Insulation Conference","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1983-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123472612","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Uretrane encapsulants for switchgear transformers 开关柜变压器用尿素密封剂
1983 EIC 6th Electrical/Electronical Insulation Conference Pub Date : 1983-10-01 DOI: 10.1109/EEIC.1983.7465023
Andrew M. Chyko
{"title":"Uretrane encapsulants for switchgear transformers","authors":"Andrew M. Chyko","doi":"10.1109/EEIC.1983.7465023","DOIUrl":"https://doi.org/10.1109/EEIC.1983.7465023","url":null,"abstract":"Epoxy resin systems are being used to encapsulate various switchgear transformers for indoor and outdoor applications. However, some manufacturers are experiencing stress cracking problems associated with this resin chemistry. For this reason, urethane electrical resin systems have been developed and marketed as an alternative because of their excellent thermal shock, flexibility, and stress relief properties over a wide temperature range. Further advantages of urethanes are: • Lower processing and cure temperature • Faster demold time/higher productivity • Stable electricals and good property retention up to 125°C • Fungus resistance • Will meet the requirements of UL 94V-0.","PeriodicalId":148370,"journal":{"name":"1983 EIC 6th Electrical/Electronical Insulation Conference","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1983-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115245409","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
New b-staged epoxy mica paper tapes 新型b级环氧云母纸带
1983 EIC 6th Electrical/Electronical Insulation Conference Pub Date : 1983-10-01 DOI: 10.1109/EEIC.1983.7465028
R. W. Staley, K. W. Stanley
{"title":"New b-staged epoxy mica paper tapes","authors":"R. W. Staley, K. W. Stanley","doi":"10.1109/EEIC.1983.7465028","DOIUrl":"https://doi.org/10.1109/EEIC.1983.7465028","url":null,"abstract":"A new family of B-staged, epoxy mica paper tapes has been developed. These tapes have been in commercial use for several years and have proved themselves to have low cost, excellent electrical properties and have been free from dermatitis problems.","PeriodicalId":148370,"journal":{"name":"1983 EIC 6th Electrical/Electronical Insulation Conference","volume":"97 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1983-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128899474","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
New connector in an adhesive tape form for electronic applications 电子应用用胶带形式的新型连接器
1983 EIC 6th Electrical/Electronical Insulation Conference Pub Date : 1983-10-01 DOI: 10.1109/EEIC.1983.7465037
P. D. Hinderaker, R. S. Reylek, R. H. Stow, R. Swinehart, R. Tollefson
{"title":"New connector in an adhesive tape form for electronic applications","authors":"P. D. Hinderaker, R. S. Reylek, R. H. Stow, R. Swinehart, R. Tollefson","doi":"10.1109/EEIC.1983.7465037","DOIUrl":"https://doi.org/10.1109/EEIC.1983.7465037","url":null,"abstract":"A newly developed adhesive tape which utilizes conductor stripes with a range of center-to-center spacings produces reliable, cost effective, multiple electrical connections to liquid crystal displays (LCD), printed circuit boards (PCB), membrane switches and terminal pads on other components. A continuously striped tape in a roll format allows bonded connections to be made at any point using a rapid application of heat and pressure. The stable electrical connections which are made with the tape have immediate good strength for handling in high volume automated applications. The tape's flexibility allows for a wide range of component positioning with respect to the associated printed circuit board since no supporting hardware is needed to maintain good electrical connections. Performance of the tape connector system enables its use in electronic and automotive applications.","PeriodicalId":148370,"journal":{"name":"1983 EIC 6th Electrical/Electronical Insulation Conference","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1983-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121432643","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Quick instrumental technique for testing insulating materials 绝缘材料快速检测仪器技术
1983 EIC 6th Electrical/Electronical Insulation Conference Pub Date : 1983-10-01 DOI: 10.1109/EEIC.1983.7465101
P. G. Agashe, V. Sitaraman
{"title":"Quick instrumental technique for testing insulating materials","authors":"P. G. Agashe, V. Sitaraman","doi":"10.1109/EEIC.1983.7465101","DOIUrl":"https://doi.org/10.1109/EEIC.1983.7465101","url":null,"abstract":"Thermo analytical techniques like Thermogravimetry (TGA) and Differential scanning calorimetry (DSC) were used for evaluating comparative thermal behaviour of various silicone and epoxy varnishes. Compositional data was generated for laminating/impregnating and flexible silicone varnishes using dynamic TGA. This has been used in conjunction with infrared spectroscopic data for evaluation of thermal, stability. Heat of reaction of B-stage novolac epoxy glass mica tape has been estimated using dynamic and isothermal DSC. This data along with glass transition temperature has been used for obtaining consolidation parameters of tapes from different manufacturers. Thermomechnical analysis (TMA) was used in tensile mode to estimate glass transition temperature of terylene cords. The data was used for the determination of suitability in service.","PeriodicalId":148370,"journal":{"name":"1983 EIC 6th Electrical/Electronical Insulation Conference","volume":"69 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1983-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126041276","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Conformal coating thickness determination: A comparison of methods 保形涂层厚度测定方法的比较
1983 EIC 6th Electrical/Electronical Insulation Conference Pub Date : 1983-10-01 DOI: 10.1109/EEIC.1983.7465084
I. B. Goldman, A. Krajewski
{"title":"Conformal coating thickness determination: A comparison of methods","authors":"I. B. Goldman, A. Krajewski","doi":"10.1109/EEIC.1983.7465084","DOIUrl":"https://doi.org/10.1109/EEIC.1983.7465084","url":null,"abstract":"In the manufacture of electrical and electronic packages and assemblies, conformal coatings are employed to protect the electronic package from moisture, gases, and other constituents of harsh atmospheres. In addition, circuit board dielectric characteristics can be improved by proper use of conformal coatings. The actual product use and design requirements will normally dictate the method of coating application and cured thickness needed. In any case, some method of thickness measurement is desirable from both a quality control standpoint as well as operator \"during-the-fact\" testing. This paper discusses several alternative methods of measuring the thickness of cured conformal coatings. More familiar methods are reviewed and put in perspective by a subsequent discussion of a more recent non-destructive technique. A statistical analysis of the data is included.","PeriodicalId":148370,"journal":{"name":"1983 EIC 6th Electrical/Electronical Insulation Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1983-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122317221","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
New stator laminations — Decision factors 新的定子片。决策因素
1983 EIC 6th Electrical/Electronical Insulation Conference Pub Date : 1983-10-01 DOI: 10.1109/EEIC.1983.7465032
Joseph R. Fox, Alain Jolicoeur
{"title":"New stator laminations — Decision factors","authors":"Joseph R. Fox, Alain Jolicoeur","doi":"10.1109/EEIC.1983.7465032","DOIUrl":"https://doi.org/10.1109/EEIC.1983.7465032","url":null,"abstract":"When not detected visually, the iron damage can be identified by performing a \"loop test\" when the unit is scheduled for rewinding. However, in most of the cases the decision to restack the core is taken after the rotor is out, thus usually extending the duration of the outage. We, at Hydro-Quebec, are interested in finding a method enabling us to assess the state of the iron prior to removal of the rotor, and we want to report our efforts in this direction.","PeriodicalId":148370,"journal":{"name":"1983 EIC 6th Electrical/Electronical Insulation Conference","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1983-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122379232","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The analysis of water in treed crosslinked polyethylene films 树状交联聚乙烯薄膜中水的分析
1983 EIC 6th Electrical/Electronical Insulation Conference Pub Date : 1983-10-01 DOI: 10.1109/EEIC.1983.7465020
R. Weiss, S. Shaw, M. Shaw, Y. E. Araktingi, J. Feinberg, M. Plunkett, G. Roth
{"title":"The analysis of water in treed crosslinked polyethylene films","authors":"R. Weiss, S. Shaw, M. Shaw, Y. E. Araktingi, J. Feinberg, M. Plunkett, G. Roth","doi":"10.1109/EEIC.1983.7465020","DOIUrl":"https://doi.org/10.1109/EEIC.1983.7465020","url":null,"abstract":"A particularly troublesome problem to the electrical utility industry is the occurrence of tree-like defects in polyolefin insulated transmission cables that have been energized for a period of time in the presence of water. These defects, water trees, are associated with decreased dielectric strength and may be responsible for premature failure of underground cables. Although it is generally agreed that both water and electrical stresses are necessary for the initiation and growth of water trees, neither the mechanism for the formation of these defects nor their morphology is known with certainty.","PeriodicalId":148370,"journal":{"name":"1983 EIC 6th Electrical/Electronical Insulation Conference","volume":"70 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1983-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116128951","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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