{"title":"Error correcting codes for crosstalk effect minimization [system buses]","authors":"Daniele Rossi, S. Cavallotti, C. Metra","doi":"10.1109/DFTVS.2003.1250120","DOIUrl":"https://doi.org/10.1109/DFTVS.2003.1250120","url":null,"abstract":"In this paper, we present an analysis of crosstalk effects on buses implementing error correcting codes. We show that the redundancy introduced by these codes can be exploited in order to avoid the worst case crosstalk-induced delay. Our analysis is based on the evaluation of the coupling effective capacitance which needs to be charged during bus activity. In particular, we analyze the cases of the Hamming and dual rail codes. We show that Hamming codes do not allow us to avoid the most delay costly bus transitions, while this can be the case for dual rail codes. Furthermore, we illustrate that, by increasing the redundancy of the dual rail code by only one bit, even higher crosstalk-induced delay reductions can be achieved. Finally, we show that a further improvement can be obtained by an optimized placing of the bus wires.","PeriodicalId":146263,"journal":{"name":"Proceedings 18th IEEE Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128479231","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
A. Vassighi, O. Semenov, M. Sachdev, A. Keshavarzi
{"title":"Thermal management of high performance microprocessors in burn-in environment","authors":"A. Vassighi, O. Semenov, M. Sachdev, A. Keshavarzi","doi":"10.1109/DFTVS.2003.1250126","DOIUrl":"https://doi.org/10.1109/DFTVS.2003.1250126","url":null,"abstract":"In deep sub-micron CMOS technologies, increased standby current in high performance processors results in increased junction temperature. This elevated temperature has a positive feedback on the standby current. If the temperature is not controlled, it may lead to thermal runaway. In this paper we investigate the thermal management of high performance chips in the burn-in environment.","PeriodicalId":146263,"journal":{"name":"Proceedings 18th IEEE Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127834592","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Control constrained resource partitioning for complex SoCs [intra-chip wireless interconnects]","authors":"Dan Zhao, S. Upadhyaya, M. Margala","doi":"10.1109/DFTVS.2003.1250140","DOIUrl":"https://doi.org/10.1109/DFTVS.2003.1250140","url":null,"abstract":"When moving into the billion-transistor era, the wired interconnects used in conventional SoC test control models are rather restricted in not only system performance, but also signal integrity and transmission with continued scaling of feature size. On the other hand, recent advances in silicon integrated circuit technology are making possible tiny low-cost transceivers to be integrated on chip. Based on the recent development in \"radio-on-chip\" technology, a new distributed multihop wireless test control network has been proposed. Under the multilevel tree structure, the system optimization is performed on control constrained resource partitioning and distribution. Several system design issues such as radio-frequency nodes placement, clustering and routing problems are studied, with the integrated resource distribution including not only the circuit blocks to perform testing, but also the on-chip radio-frequency nodes for intra-chip communication.","PeriodicalId":146263,"journal":{"name":"Proceedings 18th IEEE Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124390592","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Quadruple time redundancy adders [error correcting adder]","authors":"W. J. Townsend, J. Abraham, E. Swartzlander","doi":"10.1109/DFTVS.2003.1250119","DOIUrl":"https://doi.org/10.1109/DFTVS.2003.1250119","url":null,"abstract":"This paper presents a concurrent error correcting adder design employing fault masking through a combination of time and hardware redundancy. This new method, quadruple time redundancy, is compared with a non-redundant adder, a triple modular redundancy adder, and a time shared triple modular redundancy adder with respect to the hardware complexity and the delay for adders of various sizes. In comparison with time shared triple modular redundancy to which it is most closely related, quadruple time redundancy results in a 40%-55% reduction in hardware complexity while incurring a reasonable delay increase.","PeriodicalId":146263,"journal":{"name":"Proceedings 18th IEEE Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129596778","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Exploiting instruction redundancy for transient fault tolerance [microprocessor applications]","authors":"Toshinori Sato","doi":"10.1109/DFTVS.2003.1250154","DOIUrl":"https://doi.org/10.1109/DFTVS.2003.1250154","url":null,"abstract":"This paper presents an approach for integrating fault-tolerance techniques into microprocessors by utilizing instruction redundancy as well as time redundancy. Smaller and smaller transistors, higher and higher clock frequency, and lower and lower power supply voltage reduce the reliability of microprocessors. In addition, microprocessors are used in systems which require high dependability, such as e-commerce businesses. Based on these trends, it is expected that the quality with respect to reliability will become important as well as performance and cost for future microprocessors. To meet the demand, we have proposed and evaluated a fault-tolerance mechanism, which is based on instruction reissue and utilizes time redundancy, and found severe performance loss. In order to mitigate the loss, this paper proposes to exploit instruction redundancy. Using the reuse table, previously executed computing is reused for checking the occurrence of transient faults. From detailed simulations, we find that the performance loss caused by introducing fault tolerance into 4-way and 8-way superscalar processors is 12.5% and 20.8%, respectively.","PeriodicalId":146263,"journal":{"name":"Proceedings 18th IEEE Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"81 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130692868","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"An efficient functional test for the massively-parallel C/spl middot/RAM logic-enhanced memory architecture","authors":"Xiaoling Sun, B. Cockburn, D. Elliott","doi":"10.1109/DFTVS.2003.1250146","DOIUrl":"https://doi.org/10.1109/DFTVS.2003.1250146","url":null,"abstract":"Computational RAM (C/spl middot/RAM) is a logic-enhanced memory architecture that has already shown promise in several demanding applications. A C/spl middot/RAM chip integrates a conventional memory array along with a linear array of bit-serial processing elements (PEs). The narrow PEs are pitch-matched to the columns of the memory array to access the high internal memory bandwidth and to produce an efficient layout. After a memory row has been accessed, the PEs can perform many thousands of bit-serial operations in parallel on the fetched bits as well as values stored locally in PE registers. We consider the problem of efficiently testing C/spl middot/RAMs for functional faults in the PEs and the memory array. It is shown that the linear array of PEs is a powerful resource that can be used to generate standard memory test patterns. The test time for the PEs plus their local memories is much less than the test time of the memories alone.","PeriodicalId":146263,"journal":{"name":"Proceedings 18th IEEE Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128521352","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Yield analysis of compiler-based arrays of embedded SRAMs","authors":"Xiaopeng Wang, M. Ottavi, F. Lombardi","doi":"10.1109/DFTVS.2003.1250089","DOIUrl":"https://doi.org/10.1109/DFTVS.2003.1250089","url":null,"abstract":"This paper presents a detailed analysis of the yield of embedded static random access memories (eSRAM) which are generated using a compiler. Defect and fault analysis inclusive of industrial data are presented for these chips by taking into account the design constructs (referred to as kernels) and the physical properties of the layout. The new tool CAYA (Compiler-based Array Yield Analysis) is based on a characterization of the design process which accounts for fault types and the relation between functional and structural faults; a novel empirical model is proposed to facilitate the yield calculation. Industrial data is provided for the analysis of various configurations with different structures and redundancy. The effectiveness and accuracy as provided by CAYA are assessed with respect to industrial designs.","PeriodicalId":146263,"journal":{"name":"Proceedings 18th IEEE Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123631967","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Analysis and testing of analog and mixed-signal circuits by an operation-region model: a case study of application and implementation","authors":"Y. Miura, D. Kato","doi":"10.1109/DFTVS.2003.1250122","DOIUrl":"https://doi.org/10.1109/DFTVS.2003.1250122","url":null,"abstract":"We have developed an operation-region (OR) model for abstractly modeling the behavior of analog and mixed-signal circuits. The model is based on observing changes in the operation regions of MOS transistors. In this paper, we propose an analysis method for analog and mixed-signal circuits by applying the OR model and apply our method to test ITC'97 benchmark circuits. We also propose and verify a more efficient method of applying the OR model. To enhance the usability of the model, we try to implement it by using an X-Y curve method. This implementation maps transistor ORs to observable values and provides the capability to represent common conditions showing behaviors caused by many faults.","PeriodicalId":146263,"journal":{"name":"Proceedings 18th IEEE Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114613692","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Multiple scan chain design technique for power reduction during test application in BIST","authors":"D. Ghosh, S. Bhunia, K. Roy","doi":"10.1109/DFTVS.2003.1250112","DOIUrl":"https://doi.org/10.1109/DFTVS.2003.1250112","url":null,"abstract":"The multiple scan chain has been used in DFT (design for test) architectures primarily to reduce test application time. Since power is an emerging problem, in this paper, we present a design technique for multiple scan chains in BIST (built-in self test) to reduce average power dissipation and test application time, while maintaining the fault coverage. First, we partition the scan chain into a set of smaller chains of similar lengths in such a way that the total number of scan transitions in the scan chain is minimized. Then, we use a novel scan re-ordering algorithm in each smaller chain to further reduce the transitions. Experiments on ISCAS'89 benchmarks show up to 46.2% (average 24.4%) power reduction using the proposed technique, compared to the scan partitions given in the RTL description. Unlike previous approaches, our solution is computationally efficient and test-set independent and thus, can be effectively applied to large BIST circuitry.","PeriodicalId":146263,"journal":{"name":"Proceedings 18th IEEE Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124316850","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Clock calibration faults and their impact on quality of high performance microprocessors","authors":"C. Metra, T. M. Mak, Daniele Rossi","doi":"10.1109/DFTVS.2003.1250096","DOIUrl":"https://doi.org/10.1109/DFTVS.2003.1250096","url":null,"abstract":"In this paper we analyze the fault effects of some clock calibration features which are common to today's high performance microprocessors. We show that induced faults with such schemes may give rise to effects that are not detectable by common manufacturing testing (e.g. scan based). However, these faults could seriously impact the microprocessor correct operation, and result in a decrease of product quality. Similar considerations may apply to different microprocessor calibration features. Considering that there is a wide range of process variations on die, as well as across the process, and that very deep sub-micron circuits tend to provide higher levels of performance to the circuits, the use of such on-die calibration features will increase in all segments of design. Proper strategies to test these features cannot be ignored.","PeriodicalId":146263,"journal":{"name":"Proceedings 18th IEEE Symposium on Defect and Fault Tolerance in VLSI Systems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130712548","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}