Electrical Contacts - 2007 Proceedings of the 53rd IEEE Holm Conference on Electrical Contacts最新文献_第8页

Material transfer characteristic of silver contacts under resistive DC load conditions 电阻性直流负载条件下银触点的材料传递特性

Electrical Contacts - 2007 Proceedings of the 53rd IEEE Holm Conference on Electrical Contacts Pub Date : 1993-09-27 DOI: 10.1109/HOLM.1993.489687

M. Hasegawa, K. Niizuma, H. Mizukoshi, S. Fujii, K. Sawa

{"title":"Material transfer characteristic of silver contacts under resistive DC load conditions","authors":"M. Hasegawa, K. Niizuma, H. Mizukoshi, S. Fujii, K. Sawa","doi":"10.1109/HOLM.1993.489687","DOIUrl":"https://doi.org/10.1109/HOLM.1993.489687","url":null,"abstract":"Arc discharge between electrodes of electromechanical relays and mechanical switches often causes contact surface damage through material transfer and arc erosion. Especially, material transfer sometimes occurs even with a very small load current such as DC50 to 100 mA, which is quite a bit smaller than the minimum arc current value of each contact material. In this paper, material transfer characteristic of silver contacts installed in telecommunication relays were studied with a scanning laser microscope under various resistive load conditions. The relation between electrical load conditions (load current and power supply voltage) and contact surface configuration caused by material transfer (craters and pips) was studied. It is confirmed that material transfer occurs by anode arcs even with the load condition of DC10 V-50 mA, which might be considered too light to have an arc discharge. The tested samples can be categorized into two groups; material transfer phase and arc erosion phase. Transition from transfer phase to erosion phase is believed to occur and is related to the contact activation process. The results also indicate that load current has an influence on the material transfer phenomena and power supply voltage is related to the arc erosion phenomena.","PeriodicalId":11624,"journal":{"name":"Electrical Contacts - 2007 Proceedings of the 53rd IEEE Holm Conference on Electrical Contacts","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1993-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75277333","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Safe levels of silicone contamination for electrical contact 电接触硅污染的安全等级

Electrical Contacts - 2007 Proceedings of the 53rd IEEE Holm Conference on Electrical Contacts Pub Date : 1993-09-27 DOI: 10.1109/HOLM.1993.489686

T. Tamai, M. Aramata

引用次数: 7

Relationship between applied voltage to cause discharge and movement of carriers for rhodium-plated contact reed switches 引起放电的外加电压与镀铑触点簧片开关载流子移动之间的关系

Electrical Contacts - 2007 Proceedings of the 53rd IEEE Holm Conference on Electrical Contacts Pub Date : 1993-09-27 DOI: 10.1109/HOLM.1993.489691

K. Hinohara, K. Nakamura, T. Kobayashi, T. Miyata

{"title":"Relationship between applied voltage to cause discharge and movement of carriers for rhodium-plated contact reed switches","authors":"K. Hinohara, K. Nakamura, T. Kobayashi, T. Miyata","doi":"10.1109/HOLM.1993.489691","DOIUrl":"https://doi.org/10.1109/HOLM.1993.489691","url":null,"abstract":"Reed switches have been used in various fields of application due to excellent reliability and compactness. The progress of electronics is leading to increasing demand for enhanced functions of the reed switch. One such demand is high breakdown voltage between contacts. To achieve the improvement in breakdown voltage, fundamental research on discharge phenomena is very important. We studied the relationship between applied voltage to cause discharge and movement of carriers for rhodium-plated contact reed switches. Using Auger electron spectroscopy (AES), we analyzed contact surfaces before and after discharge caused by various applied voltages. Amount of nitrogen and amount of oxygen were found to increase on the cathode surface and on the anode surface, respectively, after discharge. Furthermore, we found that this increase was accelerated by enhancing applied voltage to cause discharge. On the contrary, amount of oxygen was found to decrease on the cathode surface after discharge. We found that this decrease was also accelerated by enhancing applied voltage to cause discharge. These results revealed that the nitrogen cation and oxygen anion moved as carriers through discharge and that this movement was accelerated by increasing applied voltage to cause discharge.","PeriodicalId":11624,"journal":{"name":"Electrical Contacts - 2007 Proceedings of the 53rd IEEE Holm Conference on Electrical Contacts","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1993-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73273232","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

The effect of contact opening velocity and the moment of contact opening on the AC erosion of Ag/CdO contacts 研究了触点打开速度和触点打开力矩对Ag/CdO触点交流腐蚀的影响

Electrical Contacts - 2007 Proceedings of the 53rd IEEE Holm Conference on Electrical Contacts Pub Date : 1993-09-27 DOI: 10.1109/HOLM.1993.489664

J. McBride, S. Sharkh

引用次数: 26

Influence of oxygen concentration and humidity on palladium oxide formation by a mechanochemical reaction 氧浓度和湿度对机械化学反应生成氧化钯的影响

Electrical Contacts - 2007 Proceedings of the 53rd IEEE Holm Conference on Electrical Contacts Pub Date : 1993-09-27 DOI: 10.1109/HOLM.1993.489689

T. Yamamoto, K. Sawa

引用次数: 3

Resistance buildup in electrical connectors due to fretting corrosion of rough surfaces 由于粗糙表面的微动腐蚀，电连接器中的电阻增加

Electrical Contacts - 2007 Proceedings of the 53rd IEEE Holm Conference on Electrical Contacts Pub Date : 1993-09-27 DOI: 10.1109/HOLM.1993.489675

M. D. Bryant

{"title":"Resistance buildup in electrical connectors due to fretting corrosion of rough surfaces","authors":"M. D. Bryant","doi":"10.1109/HOLM.1993.489675","DOIUrl":"https://doi.org/10.1109/HOLM.1993.489675","url":null,"abstract":"A comprehensive model to predict the contact resistance during the nth fretting cycle and the ultimate usable lifetime of the contact has been developed. This model incorporates contact wipe, fretting vibration amplitude and frequency, contaminant chemistry, material properties, plating thickness, asperity deformations, normal load, electrical load, and surface topography. It is assumed that fretting vibrations separate contacting asperities and expose virgin metallic a-spots to environmental contaminant attack. The model calculates the amount of corrosive product produced on the exposed surfaces during the separation phase of a cycle of fretting. As fretting motions pull the exposed corroded asperities back together, a mismatch in size occurs and some of the corrosive product is scraped off and deposited in the valleys. Eventually, the valleys fill and separate the a-spots, resulting in \"ultimate\" failure. A material balance between amounts produced and scraped off estimates the amount of corrosive product dragged into the contact. Shifting of molecules via plastic deformation mix particles of corrosive product into the asperity metal. Assumptions that correlate mixing to plastic flow and use of modern composite theory leads to an estimate of the conductivity within the contaminated asperity. Integration over the asperity volume gives the asperity resistance, and application of Greenwood's theory estimates the total contact resistance. Results show a monotonic increase in contact resistance over time. Initial increases are slow, followed by rapid increases. Predicted failure times are consistent with field measurements.","PeriodicalId":11624,"journal":{"name":"Electrical Contacts - 2007 Proceedings of the 53rd IEEE Holm Conference on Electrical Contacts","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1993-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82207877","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 69

Mechanical properties and heading characteristics of some Ag/CdO and Ag/SnO/sub 2/ compositions Ag/CdO和Ag/SnO/sub / 2/组合物的力学性能及掘进特性

Electrical Contacts - 2007 Proceedings of the 53rd IEEE Holm Conference on Electrical Contacts Pub Date : 1993-09-27 DOI: 10.1109/HOLM.1993.489659

M. Myers

引用次数: 6

The model of interaction between arc and AgMeO contact materials 电弧与AgMeO接触材料相互作用模型

Electrical Contacts - 2007 Proceedings of the 53rd IEEE Holm Conference on Electrical Contacts Pub Date : 1993-09-27 DOI: 10.1109/HOLM.1993.489656

Ming Sun, Qiping Wang, M. Lindmayer

引用次数: 19

Effect of pulse plating parameters on electrical contact behaviour of nickel coatings 脉冲镀参数对镍镀层电接触性能的影响

Electrical Contacts - 2007 Proceedings of the 53rd IEEE Holm Conference on Electrical Contacts Pub Date : 1993-09-27 DOI: 10.1109/HOLM.1993.489679

S. Benhenda, N. Benjemâa, M. Bourir

{"title":"Effect of pulse plating parameters on electrical contact behaviour of nickel coatings","authors":"S. Benhenda, N. Benjemâa, M. Bourir","doi":"10.1109/HOLM.1993.489679","DOIUrl":"https://doi.org/10.1109/HOLM.1993.489679","url":null,"abstract":"Pulse plated nickel coatings on copper and copper alloys were investigated in view of their use as underlayer in Au/Ni/Cu or as external protective coatings. Deposition parameters were varied in order to determine their influence on the microstructure and consequently on the electrical contact properties of the electrodeposited Ni films. Roughness and hardness measurements as well as SEM studies were performed on these samples. Smooth and dense coatings were obtained for high pause-to-pulse ratio, 25-75 Hz pulse-plating frequencies and low current density. The contact resistances R/sub c/ of the as-deposited samples in approach and insert mode were measured versus load F/sub c/ in the range 0.1-10 N. It was found that initial contact resistance follows the power law R/sub c/=KF/sub c//sup -n/ where n is hardness and coating topography dependent. Moreover, aging samples in daily cyclic atmosphere shows an increase in contact resistance during the test, but ohmic behaviour prevails as verified by the current-voltage characteristics. Finally, the mechanical behaviour investigated by a fretting study shows that the pulse reverse condition improves contact resistance stability.","PeriodicalId":11624,"journal":{"name":"Electrical Contacts - 2007 Proceedings of the 53rd IEEE Holm Conference on Electrical Contacts","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"1993-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76414894","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

High temperature superconductors as current limiters-an alternative to contacts and arcs in circuit breakers? 高温超导体作为电流限制器——断路器中触点和电弧的替代品?

Electrical Contacts - 2007 Proceedings of the 53rd IEEE Holm Conference on Electrical Contacts Pub Date : 1993-09-27 DOI: 10.1109/HOLM.1993.489653

M. Lindmayer

引用次数: 9