Optical Interconnects XIX最新文献

Directly modulated membrane-buried heterostructure lasers on SiO2/Si substrate (Conference Presentation) 在SiO2/Si衬底上直接调制膜埋异质结构激光器(会议报告)

Optical Interconnects XIX Pub Date : 2019-03-04 DOI: 10.1117/12.2513650

S. Matsuo

{"title":"Directly modulated membrane-buried heterostructure lasers on SiO2/Si substrate (Conference Presentation)","authors":"S. Matsuo","doi":"10.1117/12.2513650","DOIUrl":"https://doi.org/10.1117/12.2513650","url":null,"abstract":"Reduction of laser operating energy is a key issue to use the lasers in datacom and computercom networks because internet traffic is still increasing. To reduce operating energy, it is important to increase the optical confinement factor because the modulation efficiency is proportional to square root of optical confinement factor. Thus, the integration of thin membrane laser on SiO2/Si substrate is essential. Employing buried heterostructure (BH), in which the active region is buried with InP layer, is also important because BH provides efficient carrier confinement and thermal conductance. For datacom application, we have developed membrane Distributed Reflector (DR) laser array on SiO2/Si substrate. To fabricate BH, we have employed epitaxial growth of InP layer on a directly bonded InP on SiO2/Si substrate. We demonstrated an 8-channel DR laser array with integrating an SiN arrayed waveguide grating (AWG) filter. We have also developed photonic crystal (PhC) wavelength-scale cavity laser to obtain ultra-low operating energy for computercom application. The device exhibited a threshold current of 22 A, and a 7.3-fJ/bit energy cost directly modulated with a 10-Gbit/s NRZ signal. These results indicate that the membrane BH lasers on SiO2/Si substrate are highly suitable for use as a transmitter in datacom and computercom applications.","PeriodicalId":111560,"journal":{"name":"Optical Interconnects XIX","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125350498","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Monolithic silicon photonic CWDM transceivers (Conference Presentation) 单片硅光子CWDM收发器(会议报告)

Optical Interconnects XIX Pub Date : 2019-03-04 DOI: 10.1117/12.2513775

J. Rosenberg

{"title":"Monolithic silicon photonic CWDM transceivers (Conference Presentation)","authors":"J. Rosenberg","doi":"10.1117/12.2513775","DOIUrl":"https://doi.org/10.1117/12.2513775","url":null,"abstract":"Silicon photonics is gaining increasing adoption for mid- to long-reach communication links in datacenters at 100Gbps and beyond. Two significant challenges remain integrated on-chip WDMs, and fiber and laser packaging.\u0000\u0000The adoption of wavelength division multiplexing (WDM) allows for multiple data signals to be carried on a single fiber, reducing the cost of fiber provisioning compared to parallel implementations and greatly increasing achievable data rates. Designing WDM structures can be challenging on a silicon platform, however, as silicon waveguides are highly sensitive to minute fabrication variations and temperature changes. To account for and compensate for these changes, it is necessary to have a robust testing methodology to characterize the WDM system, as well as an efficient and complete tuning mechanism to dial in the desired performance without sacrificing too much in power consumption, chip area for off-chip electrical connections, and insertion loss. We will present a monolithic silicon WDM design, the implementation of low power tuning elements, and the test and biasing algorithms to align all filters on the desired CWDM grid.\u0000\u0000Another perennial challenge for silicon photonics has been coupling light on and off the chip, due to the significant mode size mismatch and exacting alignment requirements between silicon waveguides and optical fibers or III-V chips. We will present on packaging developments implementing fully passive alignment using existing CMOS production tools, improving scalability and cost efficiency and enabling the packaging techniques for silicon photonics chips to keep up with the massive volumes generated by silicon waferscale fabrication.","PeriodicalId":111560,"journal":{"name":"Optical Interconnects XIX","volume":"96 ","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113993045","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

From practice to practice--high-precision assembly of optoelectronic components basics and influencing factors: a case study (Conference Presentation) 从实践到实践——光电元件高精度装配基础及影响因素的案例分析(会议报告)

Optical Interconnects XIX Pub Date : 2019-03-04 DOI: 10.1117/12.2513865

Matthias Lorenz

引用次数: 0

A plasmonic optical antenna enhanced avalanche photodetector with a high gain-bandwidth product for compact lidar applications (Conference Presentation) 用于紧凑型激光雷达的具有高增益带宽产品的等离子体光学天线增强雪崩光电探测器(会议报告)

Optical Interconnects XIX Pub Date : 2019-03-04 DOI: 10.1117/12.2513803

Thitikorn Kemsri, B. Xiang, Ainaz GhafaryAghdam, Guiru Gu, Xuejun Lu

引用次数: 0

High-speed VCSEL photonics for optical interconnects (Conference Presentation) 用于光互连的高速VCSEL光子学(会议报告)

Optical Interconnects XIX Pub Date : 2019-03-04 DOI: 10.1117/12.2511312

F. Koyama, X. Gu

{"title":"High-speed VCSEL photonics for optical interconnects (Conference Presentation)","authors":"F. Koyama, X. Gu","doi":"10.1117/12.2511312","DOIUrl":"https://doi.org/10.1117/12.2511312","url":null,"abstract":"Vertical cavity surface-emitting lasers (VCSELs) are the most popular choice as the ultra-fast and energy-efficient transmitters for use in optical interconnection of datacenters and supercomputers. Improvements on the wafer level have made much progress. High speed operations at data rates beyond 40 Gbps were demonstrated through the careful optimization of epi-wafers and device structures, and reached at to NRZ 71 Gbps with electrical equalization employed. But there remain difficulties in increasing the frequency response, which is mostly limited by the relaxation oscillation frequency and paracitics. \u0000 In this paper, we review the progress of transverse-coupled-cavity VCSELs for increasing the modulation bandwidth and the monolithic lateral modulator integration. The noticeable modulation-bandwidth enhancement can be exhibited owing to “photon-photon resonance effect”. We demonstrated the modulation-bandwidth enhancement of a quasi-single mode VCSEL with a passive optical-feedback-cavity. The 3-dB modulation bandwidth can reach at 30 GHz. Eye opening of large signal modulations at 48 Gbps was obtained. The modeling and future prospect toward the bandwidth enhancement beyond 100GHz will also be presented. In addition, we demonstrated the lateral integration of an ultra-compact electro-absorption modulator with VCSEL. We obtained a sub-volt low driving voltage, and the bandwidth beyond 30 GHz. Our ultra-compact modulator integrated VCSEL can boost the modulation speed far beyond the direct modulation bandwidth for use in next-generation computing and data-center networks. We will also discuss on the multi-level modulation format, wavelength division multiplexing and space division multiplexing toward 400 Gbps or higher per fiber.","PeriodicalId":111560,"journal":{"name":"Optical Interconnects XIX","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129083765","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Development of scalable optical packaging for integrated photonics (Conference Presentation) 集成光子学中可扩展光封装的发展(会议报告)

Optical Interconnects XIX Pub Date : 2019-03-04 DOI: 10.1117/12.2514698

P. O'Brien

{"title":"Development of scalable optical packaging for integrated photonics (Conference Presentation)","authors":"P. O'Brien","doi":"10.1117/12.2514698","DOIUrl":"https://doi.org/10.1117/12.2514698","url":null,"abstract":"There is a growing demand for integrated photonic devices from a wide range of applications, including high-speed communications, medical devices and sensing. There has been significant research and development to address the demand for fiber-based optical interconnect for integrated photonic devices. However, applications such as medical diagnostics and remote sensing often require free-space coupling using micro optical components. As with fiber-based systems, packaging of micro optical components presents challenges in order to maximise coupling efficiencies and ensure packaging processes can be scaled to high-volume for cost-effective manufacturing.\u0000\u0000In this talk, I will present an overview of challenges in optical interconnect for integrated photonic devices, including Silicon, InP and SiN technologies. Factors including device layout, optical fiber and micro optical lens design will be reviewed. This includes the development of on-chip mode adaptors, improved device facet configurations for easier fiber packaging and specialty fibers which improve optical coupling efficiencies.\u0000\u0000The talk will also present information about the European Photonic Packaging Pilot Line, PIXAPP. The Pilot Line addresses the gap between early-stage prototypes and scaling to volume manufacturing. PIXAPP achieves this through the implementation of packaging design rules and working towards standard package designs. The talk will also present details of a novel optical test system which is being developed within the Pilot Line to ensure devices are characterised in advanced of packaging. PIXAPP is supporting a large number of companies develop their first photonics-based products and the talk will be of interest to those from a wide range of application areas.","PeriodicalId":111560,"journal":{"name":"Optical Interconnects XIX","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125780916","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Monolithically Integrated TCC VCSELs with Surface-normal 2D Slow-light PC Waveguide Arrays (Conference Presentation) 面法线二维慢光PC波导阵列单片集成TCC VCSELs(会议报告)

Optical Interconnects XIX Pub Date : 2019-03-04 DOI: 10.1117/12.2512990

H. Dalir, E. Heidari, M. Teimourpour, M. Miscuglio, V. Sorger, Ray T. Chen

{"title":"Monolithically Integrated TCC VCSELs with Surface-normal 2D Slow-light PC Waveguide Arrays (Conference Presentation)","authors":"H. Dalir, E. Heidari, M. Teimourpour, M. Miscuglio, V. Sorger, Ray T. Chen","doi":"10.1117/12.2512990","DOIUrl":"https://doi.org/10.1117/12.2512990","url":null,"abstract":"Discovery of TCC-VCSEL done by Dr. Dalir (PI) in 2013 led to new functionalities of VCSEL structure. In principal, a TCC-VCSEL has same vertical structure as conventional VCSEL. A VCSEL is consists of two distributed Bragg reflector (DBR) mirrors parallel to the wafer surface with an active region consisting of one or more quantum wells for the laser light generation in between. The planar DBR-mirrors consist of layers with alternating high and low refractive indices. Each layer has a thickness of a quarter of the laser wavelength in the material, yielding intensity reflectivity’s above 99%. High reflectivity mirrors are required in VCSELs to balance the short axial length of the gain region. Here we assume a TCC-VCSEL with a coupling of K between the cavities. We pump one cavity with a gain of g, while the other cavity has loss of ɣ. It is noted that the lasing frequency is a function of loss and coupling between the cavities. Assuming a constant coupling (K), tunabilty of the TCC-VCSEL will be adjusted by the loss. The three-dimensional simulation of the single mode operation in TCC structure is performed by employing film mode matching method of FIMMWAVE Photon Design Corp. With a coupling of K= 1.5THz, a 19.7 nm wavelength will be swept in the PT regime crucial for lab-on-a-chip integrated bio-sensor applications.","PeriodicalId":111560,"journal":{"name":"Optical Interconnects XIX","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132111815","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Automated assembly of 127um pitched multichannel PM-fiber connectors (Conference Presentation) 127um间距多通道pm光纤连接器的自动化组装(会议报告)

Optical Interconnects XIX Pub Date : 2019-03-04 DOI: 10.1117/12.2511258

T. Müller, D. Zontar, C. Brecher

引用次数: 0