Monolithic silicon photonic CWDM transceivers (Conference Presentation)

J. Rosenberg
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Abstract

Silicon photonics is gaining increasing adoption for mid- to long-reach communication links in datacenters at 100Gbps and beyond. Two significant challenges remain integrated on-chip WDMs, and fiber and laser packaging. The adoption of wavelength division multiplexing (WDM) allows for multiple data signals to be carried on a single fiber, reducing the cost of fiber provisioning compared to parallel implementations and greatly increasing achievable data rates. Designing WDM structures can be challenging on a silicon platform, however, as silicon waveguides are highly sensitive to minute fabrication variations and temperature changes. To account for and compensate for these changes, it is necessary to have a robust testing methodology to characterize the WDM system, as well as an efficient and complete tuning mechanism to dial in the desired performance without sacrificing too much in power consumption, chip area for off-chip electrical connections, and insertion loss. We will present a monolithic silicon WDM design, the implementation of low power tuning elements, and the test and biasing algorithms to align all filters on the desired CWDM grid. Another perennial challenge for silicon photonics has been coupling light on and off the chip, due to the significant mode size mismatch and exacting alignment requirements between silicon waveguides and optical fibers or III-V chips. We will present on packaging developments implementing fully passive alignment using existing CMOS production tools, improving scalability and cost efficiency and enabling the packaging techniques for silicon photonics chips to keep up with the massive volumes generated by silicon waferscale fabrication.
单片硅光子CWDM收发器(会议报告)
硅光子学在数据中心100Gbps及以上的中远距离通信链路中得到越来越多的采用。两个重要的挑战仍然是集成片上wdm,以及光纤和激光封装。采用波分复用(WDM)允许在一条光纤上传输多个数据信号,与并行实现相比,降低了光纤供应的成本,并大大提高了可实现的数据速率。然而,在硅平台上设计WDM结构可能具有挑战性,因为硅波导对微小的制造变化和温度变化高度敏感。为了考虑和补偿这些变化,有必要有一个强大的测试方法来表征WDM系统,以及一个有效和完整的调谐机制,以在不牺牲太多功耗的情况下获得所需的性能,片外电连接的芯片面积,以及插入损耗。我们将介绍一个单片硅WDM设计,低功耗调谐元件的实现,以及测试和偏置算法,以便在所需的CWDM网格上对齐所有滤波器。硅光子学的另一个长期挑战是芯片上和芯片外的光耦合,这是由于硅波导和光纤或III-V芯片之间存在显著的模式尺寸不匹配和严格的对准要求。我们将介绍利用现有CMOS生产工具实现完全无源对准的封装发展,提高可扩展性和成本效率,并使硅光子芯片的封装技术跟上硅晶圆级制造产生的大量产量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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