2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)最新文献

A Novel 3D-Printed (0-3) Piezocomposite Material for Sensing Applications 用于传感应用的新型3d打印(0-3)压电复合材料

2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) Pub Date : 2020-08-16 DOI: 10.1109/FLEPS49123.2020.9239541

R. Mansour, O. Omoniyi, A. Reid, L. Liang, R. O’Leary, J. Windmill

{"title":"A Novel 3D-Printed (0-3) Piezocomposite Material for Sensing Applications","authors":"R. Mansour, O. Omoniyi, A. Reid, L. Liang, R. O’Leary, J. Windmill","doi":"10.1109/FLEPS49123.2020.9239541","DOIUrl":"https://doi.org/10.1109/FLEPS49123.2020.9239541","url":null,"abstract":"The desire for highly sensitive, miniature sensors and actuators has grown in recent years. This desire has led to the recent development of 3D-printed sensors and actuators using piezocomposites. The use of 3D-printing leads to the rapid development of devices at lower costs and device personalization. This work describes the process of developing a novel 0-3 piezocomposite material, 3D – printing using a digital light processing technique, and characterization. The composite material was made using a photopolymer, grey resin and lead magnesium niobate and lead titanate (PMN-PT) with particles sizes $5 mu mathrm{m}$. 3D-printing of a membrane using the piezoelectric composite with high concentrations of PMN-PT was achieved with good print resolution and remarkably high $d _{33}$ coefficient of 74 pm/V, measured using the laser vibrometer technique. Thin film samples of the composites were also made using spin coating technique to produce composites with 0-3 connectivity pattern and layer thickness of $90 mu mathrm{m}$. The bottom-up digital light processing method used provides a narrow design space in which the composite may be selectively cured and the parameters which allow successful generation of highly piezoelectric printed parts was investigated. The microstructure of the piezocomposites was analyzed using a scanning electron micrograph.","PeriodicalId":101496,"journal":{"name":"2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"129 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115681535","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Method for Inkjet-printing PEDOT:PSS polymer electrodes on piezoelectric PVDF-TrFE fibers 压电PVDF-TrFE纤维上喷墨打印PEDOT:PSS聚合物电极的方法

2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) Pub Date : 2020-08-16 DOI: 10.1109/FLEPS49123.2020.9239588

Andrew Closson, Haley Richards, Lin Dong, Zhe Xu, John X. J. Zhang

引用次数: 1

Hysteresis Compensation of 3D Printed Sensors by a Power Law Model with Reduced Parameters 基于降参数幂律模型的3D打印传感器滞回补偿

2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) Pub Date : 2020-08-16 DOI: 10.1109/FLEPS49123.2020.9239580

D. Kosmas, Martijn Schouten, G. Krijnen

引用次数: 8

Tip Tracking of Surgical Navigation Stylets Using Integrated Strain Sensors 基于集成应变传感器的外科导航针尖端跟踪

2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) Pub Date : 2020-08-16 DOI: 10.1109/FLEPS49123.2020.9239571

Caroline Yu, Kevin A. Kam, Marco R. Cavallari, I. Kymissis

引用次数: 1

FLEPS 2020 Index FLEPS 2020指数

2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) Pub Date : 2020-08-16 DOI: 10.1109/fleps49123.2020.9239473

引用次数: 0

Symmetrical orientation of spiral-interconnects for high mechanical stability of stretchable electronics 螺旋互连的对称方向，可拉伸电子产品的高机械稳定性

2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) Pub Date : 2020-08-16 DOI: 10.1109/FLEPS49123.2020.9239530

N. Qaiser, A. Damdam, S. Khan, M. Hussain

{"title":"Symmetrical orientation of spiral-interconnects for high mechanical stability of stretchable electronics","authors":"N. Qaiser, A. Damdam, S. Khan, M. Hussain","doi":"10.1109/FLEPS49123.2020.9239530","DOIUrl":"https://doi.org/10.1109/FLEPS49123.2020.9239530","url":null,"abstract":"Recently, interconnect based stretchable electronic devices have attained growing interest due to its application for various state-of-the-art technologies. Here, we report an engineered design of spiral interconnects for a series of stretchable networks referred to as the symmetrical series; wherein spirals connect to the island in the symmetry manner. A systematic analysis of Si-based spiral interconnects by numerical modeling, and experiments show that our design provides higher stretchability of 165% in comparison to the conventionally used nonsymmetrical design. The reason for high mechanical reliability is attributed to the favorable unwrapping profile of spiral interconnect due to the nature of forces acting on it during the stretching process. In contrast, for the nonsymmetrical series, the nature of tensile forces produces the rotation, and resultant tilting of spiral arm results in low stretchability of 150%. As a result, nonsymmetrical interconnect fails at earlier stages of stretching. Our study demonstrates the significance of the orientation of spiral interconnects linked to the island to attain the high performance of stretchable electronic devices.","PeriodicalId":101496,"journal":{"name":"2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"113 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115548057","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Stretchable Wireless Sensor Skin for the Surface Monitoring of Soft Objects 用于软性物体表面监测的可拉伸无线传感器皮肤

2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) Pub Date : 2020-08-16 DOI: 10.1109/FLEPS49123.2020.9239524

S. Nappi, C. Su, H. Luan, J. Rogers, G. Marrocco

{"title":"Stretchable Wireless Sensor Skin for the Surface Monitoring of Soft Objects","authors":"S. Nappi, C. Su, H. Luan, J. Rogers, G. Marrocco","doi":"10.1109/FLEPS49123.2020.9239524","DOIUrl":"https://doi.org/10.1109/FLEPS49123.2020.9239524","url":null,"abstract":"Like rigid objects, also soft and elastic manufactured materials for industrial and biomedical applications are subjected to fatigue stress that might speed up the aging process and even cause premature failures. The occurrence of early signs of damaging, like the arising of surface cracks, could avoid more severe critical events, especially when biomedical soft prosthesis are involved (such as artificial breast, stomach, bladder).A thin-film stretchable wireless sensor for surface monitoring is here proposed. The device is based on a densely distributed electrode exploiting, at the macro-scale, a Space-Filling Curve pattern, and a meandered profile in the micro-scale. Interconnection with a wrapped Radiofrequency Identification antenna permits to transmit the status of the electrode to remote, with no battery onboard. The device was manufactured by means of electron beam deposition over a thin elastomer. Surface defects of size larger than 0.9mm to 9mm can be detected with probability of 60% to 90%, respectively. Thanks to its double-scale meanderings, the sensor is highly tolerant to stretch keeping its shape nearly unchanged up to a 35% strain.","PeriodicalId":101496,"journal":{"name":"2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"80 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114335504","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Embroidered Textile Capacitive Sensor for Sucrose Solutions Measurement 用于蔗糖溶液测量的绣花织物电容式传感器

2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) Pub Date : 2020-08-16 DOI: 10.1109/FLEPS49123.2020.9239432

Chengyang Luo, R. Fernández-García, I. Gil

引用次数: 2

Inkjettable, polydimethylsiloxane based soft electronics 可喷墨，聚二甲基硅氧烷为基础的软电子

2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) Pub Date : 2020-08-16 DOI: 10.1109/FLEPS49123.2020.9239558

Riikka Mikkonen, M. Mäntysalo

引用次数: 1

[FLEPS 2020 Front matter] [FLEPS 2020前沿事项]

2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) Pub Date : 2020-08-16 DOI: 10.1109/fleps49123.2020.9239481

引用次数: 0