{"title":"Three-Point Bending Test and Crack Detection by Acoustic Emission on Different Spring Steel Wires with Different Crystallographic Textures","authors":"None Mathias Lorenz, None Mohammed. Salih, None Daniela Schwerdt, None Nowfal Al-Hamdany, None Emad Maawad, None Norbert Schell, None Eckehard Müller","doi":"10.17265/2161-6213/2023.7-9.001","DOIUrl":"https://doi.org/10.17265/2161-6213/2023.7-9.001","url":null,"abstract":"","PeriodicalId":71607,"journal":{"name":"材料科学与工程:中英文A版","volume":"98 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135470054","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
材料科学与工程:中英文A版Pub Date : 2023-06-28DOI: 10.17265/2161-6213/2023.4-6.004
None Eckehard Mueller
{"title":"A Way to Determine the Maximum Inducible Residual Stresses in Steel by Mechanical Surface Treatment","authors":"None Eckehard Mueller","doi":"10.17265/2161-6213/2023.4-6.004","DOIUrl":"https://doi.org/10.17265/2161-6213/2023.4-6.004","url":null,"abstract":": The issue of determining the maximum compressive residual stress that can be induced through mechanical surface treatment is of great significance. There are two possible approaches, namely stress peening and stress rolling, both to determine the limit. Steel with high hardness may be under the yield strength, while for those with lower tensile strength, the hardness is increased, and the limit is above the tensile strength.","PeriodicalId":71607,"journal":{"name":"材料科学与工程:中英文A版","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-06-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135359574","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
材料科学与工程:中英文A版Pub Date : 2023-06-28DOI: 10.17265/2161-6213/2023.4-6.001
None Ravi Kumar Chanana
{"title":"Discussion on the Electron and Hole Effective Masses in Thermal Silicon Dioxide","authors":"None Ravi Kumar Chanana","doi":"10.17265/2161-6213/2023.4-6.001","DOIUrl":"https://doi.org/10.17265/2161-6213/2023.4-6.001","url":null,"abstract":": This review and research study provides conclusive discussion on the electron and hole effective masses in thermal silicon dioxide placing their values at 0.42 m and 0.58 m , where m is the free electron mass, correct to two decimal places. Only one of the masses needs to be determined as the electron and hole masses in materials add up to be equal to free electron mass with the hole effective mass being larger than the electron effective mass. The review also convinces the reader that the CBO (conduction band offset) or the Si-SiO 2 barrier height at the oxide/silicon interface of a Si MOS (metal-oxide-semiconductor) device is 3.20 eV.","PeriodicalId":71607,"journal":{"name":"材料科学与工程:中英文A版","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-06-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135359576","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
材料科学与工程:中英文A版Pub Date : 2023-03-28DOI: 10.17265/2161-6213/2023.1-3.003
None Ravi Kumar Chanana
{"title":"Properties of a MOS Device on Single Layer Molybdenum Disulfide","authors":"None Ravi Kumar Chanana","doi":"10.17265/2161-6213/2023.1-3.003","DOIUrl":"https://doi.org/10.17265/2161-6213/2023.1-3.003","url":null,"abstract":"","PeriodicalId":71607,"journal":{"name":"材料科学与工程:中英文A版","volume":"121 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-03-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135778086","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}