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A universal optoelectronic imaging platform with wafer-scale integration of two-dimensional semiconductors 二维半导体晶圆级集成的通用光电成像平台

Chip Pub Date : 2024-08-08 DOI: 10.1016/j.chip.2024.100107

Xinyu Wang, Die Wang, Yuchen Tian, Jing Guo, Jinshui Miao, Weida Hu, Hailu Wang, Kang Liu, Lei Shao, Saifei Gou, Xiangqi Dong, Hesheng Su, Chuming Sheng, Yuxuan Zhu, Zhejia Zhang, Jinshu Zhang, Qicheng Sun, Zihan Xu, Peng Zhou, Honglei Chen, Wenzhong Bao

{"title":"A universal optoelectronic imaging platform with wafer-scale integration of two-dimensional semiconductors","authors":"Xinyu Wang, Die Wang, Yuchen Tian, Jing Guo, Jinshui Miao, Weida Hu, Hailu Wang, Kang Liu, Lei Shao, Saifei Gou, Xiangqi Dong, Hesheng Su, Chuming Sheng, Yuxuan Zhu, Zhejia Zhang, Jinshu Zhang, Qicheng Sun, Zihan Xu, Peng Zhou, Honglei Chen, Wenzhong Bao","doi":"10.1016/j.chip.2024.100107","DOIUrl":"https://doi.org/10.1016/j.chip.2024.100107","url":null,"abstract":"Photodetectors (PDs) are crucial in modern society as they enable the detection of a diverse range of light-based signals. With the exponential increase in their development, materials are being used to create a wide range of PDs that play critical roles in enabling various applications and technologies. Image sensor technology has been hindered due to the lack of a universal system that can integrate all types of PDs with silicon-based readout integrated circuits (ROICs). To address this issue, we conducted experiments using two-dimensional materials as an example. We fabricated high-performance MoS-/MoTe-based PDs and identified the most suitable ROICs to pair with them. This established a solid foundation for further research in the field of image sensors. We developed and implemented a versatile testing system that uses a printed circuit board to connect the PD and ROIC. After the ROIC generates the sampled signal, it is collected and processed by algorithms, which overcome device uniformity limitations and produce a high-quality image that is visible to the naked eye. This universal system can be used with a wide range of PD and ROIC types made from different materials, making it highly convenient for diverse testing applications and the development of diverse image sensor types. This robust new platform is expected to spur further innovation and advancements in this rapidly developing field.","PeriodicalId":501616,"journal":{"name":"Chip","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2024-08-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142206230","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Wafer-scale synthesis of two-dimensional materials for integrated electronics 晶圆级合成二维集成电子材料

Chip Pub Date : 2023-12-01 DOI: 10.1016/j.chip.2023.100080

Zijia Liu, Xunguo Gong, Jinran Cheng, Lei Shao, Chunshui Wang, Jian Jiang, Ruiqing Cheng, Jun He

引用次数: 0